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64 条记录 (耗时 0.037 秒)

    PLATINUM NANODET ETCH PROCESS
    41.
    发明申请
    PLATINUM NANODET ETCH PROCESS 有权
    铂纳米粒子过程

    公开(公告)号：US20080286975A1

    公开(公告)日：2008-11-20

    申请号：US11748196

    申请日：2007-05-14

    申请人： Ramakanth Alapati ,  Paul Morgan ,  Max Hineman

    发明人： Ramakanth Alapati ,  Paul Morgan ,  Max Hineman

    IPC分类号： H01L21/306

    CPC分类号： H01L21/32134 ,  B82Y10/00 ,  H01L21/28273

    摘要： A method for selectively removing nano-crystals on an insulating layer. The method includes providing an insulating layer with nano-crystals thereon; exposing the nano-crystals to a high density plasma comprising a source of free radical chlorine, ionic chlorine, or both to modify the nano-crystals; and removing the modified nano-crystals with a wet etchant.

    摘要翻译： 一种用于在绝缘层上选择性去除纳米晶体的方法。 该方法包括在其上提供具有纳米晶体的绝缘层; 将纳米晶体暴露于包含游离基氯源，离子氯或二者的高密度等离子体，以修饰纳米晶体; 并用湿蚀刻剂去除修饰的纳米晶体。

    Microfeature dies with porous regions, and associated methods and systems
    42.
    发明申请
    Microfeature dies with porous regions, and associated methods and systems 审中-公开
    具有多孔区域的微特征，以及相关的方法和系统

    公开(公告)号：US20070099397A1

    公开(公告)日：2007-05-03

    申请号：US11634417

    申请日：2006-12-04

    申请人： Kyle Kirby ,  Paul Morgan

    发明人： Kyle Kirby ,  Paul Morgan

    IPC分类号： H01L21/00

    CPC分类号： H01L21/76898 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02321 ,  H01L21/02323 ,  H01L21/02337 ,  H01L21/02343 ,  H01L21/02351 ,  H01L21/31695 ,  H01L21/743 ,  H01L21/78

    摘要： Microfeature dies with porous regions, and associated methods and systems are disclosed. A method in accordance with one embodiment of the invention includes forming a porous region between a die and a remainder portion of a microfeature workpiece, and separating the die from the remainder portion by removing at least a portion of the porous region. For example, the die can be removed from the remainder portion by making a cut at the porous region (e.g., with a rotating saw blade), etching material from the porous region, or directing a water jet at the porous region. In other embodiments, a porous region of the microfeature workpiece can receive conductive material to form a conductive pathway (e.g., a line and/or via) in the workpiece. In still further embodiments, the porous regions of the workpiece can be formed electrolytically with electrodes that are spaced apart from the workpiece and/or support relative movement between the electrodes and the workpiece.

    摘要翻译： 具有多孔区域的微特征模具以及相关方法和系统被公开。 根据本发明的一个实施例的方法包括在模具和微特征工件的剩余部分之间形成多孔区域，并且通过去除多孔区域的至少一部分将模具与其余部分分离。 例如，通过在多孔区域（例如，利用旋转的锯片）进行切割，从多孔区域蚀刻材料，或者在多孔区域引导水射流，可以将模具从剩余部分中除去。 在其他实施例中，微特征工件的多孔区域可以接收导电材料以在工件中形成导电路径（例如，线路和/或通孔）。 在另外的实施例中，可以用与工件间隔开的电极和/或支撑电极和工件之间的相对运动来电解形成工件的多孔区域。

    LED signage device
    43.
    发明申请
    LED signage device 审中-公开
    LED标牌装置

    公开(公告)号：US20060245190A1

    公开(公告)日：2006-11-02

    申请号：US11476993

    申请日：2006-06-27

    申请人： Chris Thompson ,  David McFerrin ,  Joe Counts ,  Paul Morgan ,  Timothy Thomas

    发明人： Chris Thompson ,  David McFerrin ,  Joe Counts ,  Paul Morgan ,  Timothy Thomas

    IPC分类号： F21V11/00

    CPC分类号： G02B6/0001 ,  G09F9/33 ,  G09F13/22

    摘要： A signage device (10) in which a housing (12) receives a circuit board (30) having a plurality of spaced-apart light sources (38) to define at least one symbol and a light-blocking sheet (60) having a message channel with opposing adjacent spaced-apart side walls. A light emitting surface closes a distal portion of the message channel, wherein light from the light sources communicates from the light emitting surface of the message channel.

    摘要翻译： 一种标牌装置（10），其中壳体（12）接收具有多个间隔开的光源（38）以限定至少一个符号的电路板（30）和具有消息的遮光片（60） 通道与相对相邻的间隔开的侧壁。 发光表面封闭消息通道的远端部分，其中来自光源的光从消息通道的发光表面通信。

    Structure and method for field emitter tips
    44.
    发明申请
    Structure and method for field emitter tips 审中-公开

    公开(公告)号：US20050282301A1

    公开(公告)日：2005-12-22

    申请号：US11209271

    申请日：2005-08-23

    申请人： Terry Gilton ,  Paul Morgan

    发明人： Terry Gilton ,  Paul Morgan

    IPC分类号： H01J1/05 ,  H01J1/14 ,  H01J1/304 ,  H01J1/38 ,  H01J1/48 ,  H01J9/02 ,  H01J9/38 ,  H01J19/06 ,  H01L21/00

    CPC分类号： H01J1/3042 ,  H01J9/025 ,  H01J2201/30403 ,  H01J2329/00

    摘要： Improved methods and structures are provided for an array of vertical geometries which may be used as emitter tips, as a self aligned gate structure surrounding field emitter tips, or as part of a flat panel display. The present invention offers controlled size in emitter tip formation under a more streamlined process. The present invention further provides a more efficient method to control the gate to emitter tip proximity in field emission devices. The novel method of the present invention includes implanting a dopant in a patterned manner into the silicon substrate and anodizing the silicon substrate in a controlled manner causing a more heavily doped region in the silicon substrate to form a porous silicon region.

    Method of selectively removing conductive material
    48.
    发明授权
    Method of selectively removing conductive material 有权
    选择性去除导电材料的方法

    公开(公告)号：US08603318B2

    公开(公告)日：2013-12-10

    申请号：US13098572

    申请日：2011-05-02

    申请人： Rita J. Klein ,  Dale W. Collins ,  Paul Morgan ,  Joseph N. Greeley ,  Nishant Sinha

    发明人： Rita J. Klein ,  Dale W. Collins ,  Paul Morgan ,  Joseph N. Greeley ,  Nishant Sinha

    IPC分类号： C25F3/16

    CPC分类号： H01L21/67086 ,  B82Y30/00 ,  C23F1/02 ,  C23F1/10 ,  H01B1/122 ,  H01L21/32115 ,  H01L21/67075

    摘要： An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with a surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to a dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.

    摘要翻译： 提供了一种用于从衬底选择性地去除导电金属的电解质溶液，方法和系统。 将包含比被除去的导电金属更高的纳米颗粒的电解质溶液施加到基底上以相对于介电材料选择性地去除导电金属，而不施加外部电位或处理垫与基底的表面的接触 。 解决方案和方法可以应用于例如相对于电介质材料选择性去除导电金属层（例如，阻挡金属），并且可以应用于物理上不同的导电金属（例如，铜互连）而不施加外部电位或接触 具有衬底表面的处理衬垫。

    Methods of modifying oxide spacers
    49.
    发明授权
    Methods of modifying oxide spacers 有权
    修饰氧化物间隔物的方法

    公开(公告)号：US08513135B2

    公开(公告)日：2013-08-20

    申请号：US13246050

    申请日：2011-09-27

    申请人： Joseph Neil Greeley ,  Paul Morgan ,  Mark Kiehlbauch

    发明人： Joseph Neil Greeley ,  Paul Morgan ,  Mark Kiehlbauch

    IPC分类号： H01L21/302

    CPC分类号： H01L21/0337

    摘要： Methods for reducing line roughness of spacers and other features utilizing a non-plasma and non-wet etch fluoride processing technology are provided. Embodiments of the methods can be used for spacer or line reduction and/or smoothing the surfaces along the edges of such features through the reaction and subsequent removal of material.

    摘要翻译： 提供了利用非等离子体和非湿蚀刻氟化物处理技术减少间隔物的线粗糙度和其它特征的方法。 这些方法的实施方案可以用于通过反应和随后的材料去除而沿着这些特征的边缘的间隔物或线减少和/或平滑表面。