公开(公告)号：US20190139722A1

公开(公告)日：2019-05-09

申请号：US16092944

申请日：2016-07-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： HUNG-MING CHEN ,  KUAN-TING WU ,  CHAO-WEN CHENG

IPC: H01H13/83 ,  G06F3/02 ,  F21V8/00 ,  H05K1/03

Abstract: The present subject matter relates to backlight keyboards. In an example implementation of the present subject matter, backlight keyboards and methods of fabricating lighting units for such backlight keyboards are described. In an example, a backlight keyboard includes a substrate and a plurality of Light Emitting Diodes (LEDs) disposed on the substrate. The backlight keyboard further includes a printed circuit disposed on the substrate, where the printed circuit comprises of a plurality of electrical connections to provide electric current to the plurality of LEDs, and where width of each of the plurality of electrical connections is predefined to control brightness of a corresponding LED from amongst the plurality of LEDs.

公开(公告)号：US20190025895A1

公开(公告)日：2019-01-24

申请号：US16067766

申请日：2016-04-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  AI-TSUNG LI ,  YA-TING YEH ,  KEVIN VOSS ,  MICHAEL DELPIER

IPC: G06F1/20 ,  B32B33/00

Abstract: Examples of a cover for a device are described herein. The cover includes a substrate to be placed in proximity of a heat source of a device. In an example, a heat resistant layer is applied over a surface of the substrate to insulate heat generated by the heat source. Further, a top layer is applied over one of the heat resistant layer and another surface of the substrate, which is opposite to the surface having the heat resistant layer. The top layer provides at least one of chemical resistant properties and aesthetic properties.

公开(公告)号：US20190022990A1

公开(公告)日：2019-01-24

申请号：US16067758

申请日：2016-04-04

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  Hung-Ming CHEN ,  Shan-Chih CHEN

IPC: B32B27/40 ,  B32B27/38 ,  B32B27/36 ,  B32B27/28 ,  B32B27/08 ,  B32B7/02 ,  B32B7/12 ,  G06F3/0354

Abstract: The present subject matter relates to self-healing touch-surface components. In an example implementation, a self-healing touch-surface component of an electronic device comprises a self-healing layer disposed over a touch-surface component. The self-healing layer includes polyurethane, polyester, epoxy, polyurethane microcapsules filled with di-n-butyltin dilaurate, and a polysiloxane mixture.

公开(公告)号：US20180213659A1

公开(公告)日：2018-07-26

申请号：US15746129

申请日：2015-08-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  KEVIN VOSS ,  YA-TING YEH

IPC: H05K5/02

CPC classification number: H05K5/02 ,  B05D3/06 ,  B05D3/10 ,  B05D3/12 ,  C03C17/42 ,  C03C2217/76 ,  C03C2218/31 ,  C03C2218/32

Abstract: Various examples provide a method of making a hydrophobic surface for an object. According to the method, a hydrophobic coating may be applied to an original surface of the object. A microstructure may be formed on the original surface of the object. The hydrophobic surface of the object may be obtained with the microstructure submerged by the hydrophobic coating. The microstructure may be a rough structure including micro-sired portions, and may have greater hardness than the hydrophobic coating.

公开(公告)号：US20180155846A1

公开(公告)日：2018-06-07

申请号：US15565485

申请日：2015-07-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  KUAN-TING WU ,  CHEN-TING LIN

IPC: C25D5/48 ,  B05D3/06 ,  B05D3/02 ,  B05D7/14 ,  C25D3/02

CPC classification number: C25D5/48 ,  B05D3/0254 ,  B05D3/067 ,  B05D7/14 ,  C09D123/02 ,  C25D3/02

Abstract: According to one example, forming a deposition layer on a magnesium alloy substrate and forming a cured coating on the deposition layer, where the cured coating is cured by ultra-violet radiation, heat at a cure temperature in a range from 60° C. to 140° C., or combinations thereof.

公开(公告)号：US20170351126A1

公开(公告)日：2017-12-07

申请号：US15535806

申请日：2015-02-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： WEI KUANG CHU ,  KUAN-TING WU ,  HUI LENG LIM

IPC: G02F1/13 ,  G02F1/155 ,  G02F1/1334 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1343 ,  G02F1/137

CPC classification number: G02F1/1323 ,  G02F1/13338 ,  G02F1/1334 ,  G02F1/1335 ,  G02F1/13439 ,  G02F1/137 ,  G02F1/15 ,  G02F1/155 ,  G02F2201/44

Abstract: One example provides an article. The article comprises a substrate that is an electronic display; a first device disposed over the substrate; and a second device disposed over the substrate. The first device comprises: a first electrode; a second electrode; and polymer dispersed liquid crystals disposed between the first electrode and the second electrode. The second device comprises: an electrochromic layer comprising an electrochromic material; and a third electrode in electrical contact with the electrochromic layer.

公开(公告)号：US20170312823A1

公开(公告)日：2017-11-02

申请号：US15519693

申请日：2015-01-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  CHIEN-TING LIN ,  KUAN-TING WU

IPC: B22F3/11 ,  H05K5/03 ,  B22F3/105 ,  B33Y80/00 ,  H05K5/04 ,  B33Y10/00

CPC classification number: B22F3/1115 ,  A45C2011/002 ,  A45C2011/003 ,  B22F3/1055 ,  B22F2003/1058 ,  B33Y10/00 ,  B33Y80/00 ,  G06F1/1656 ,  H04M1/185 ,  H05K5/03 ,  H05K5/04 ,  Y02P10/295

Abstract: One example provides a method of manufacturing. The method comprises printing multiple layers comprising a metal material by an additive manufacturing technique, wherein each of the multiple layers comprises an array of cavities each having a cross-section of a polygon; and assembling at least two of the multiple layers to form an article having an array of three-dimensional hollow cells collectively having a honeycomb structure.

公开(公告)号：US20170245385A1

公开(公告)日：2017-08-24

申请号：US15518521

申请日：2014-11-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHENG-FENG LIAO ,  KUAN-TING WU ,  YAO-WIN FAN ,  HUI HE

IPC: H05K7/02 ,  B32B15/08 ,  B32B7/02 ,  B32B5/12 ,  B32B5/26 ,  B29C70/46 ,  B32B5/02

CPC classification number: H05K7/02 ,  B29C70/46 ,  B29K2069/00 ,  B29K2105/0881 ,  B29K2105/089 ,  B29K2705/02 ,  B29L2031/3481 ,  B32B5/022 ,  B32B5/024 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B7/02 ,  B32B15/08 ,  B32B27/12 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/308 ,  B32B27/32 ,  B32B27/34 ,  B32B27/365 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2307/51 ,  B32B2307/546 ,  B32B2307/718 ,  B32B2457/00 ,  B32B2509/00 ,  D06M15/513 ,  D06M15/53 ,  D06M15/63 ,  D06M15/693 ,  D06M2101/40

Abstract: One example provides a composite. The composites includes a core layer comprising a thermoplastic polymer and having a first and a second sides opposite to each other; a first set of two layers disposed over at least a portion of the core layer respectively on the first and the second sides, each layer of the first set including carbon fibers aligned in a first direction in a plane; and a second set of two layers disposed over at least a portion of the first set of two layers respectively on the first and the second sides, each layer of the second set including carbon fibers aligned in a second direction perpendicular to the first direction in the plane In the plane, the composite has a length and a width, the length larger than the width and parallel to the second direction.

公开(公告)号：US20170226654A1

公开(公告)日：2017-08-10

申请号：US15501230

申请日：2014-10-27

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHALAM KASHYAP ,  KUAN-TING WU

IPC: C25D13/14 ,  C25D5/48 ,  C25D11/30 ,  C23C28/00 ,  C25D13/22 ,  C23C14/58 ,  C23C16/56 ,  C25D7/04 ,  C25D13/20

CPC classification number: C25D13/14 ,  C23C14/5853 ,  C23C16/56 ,  C23C28/00 ,  C25D5/42 ,  C25D5/48 ,  C25D7/00 ,  C25D7/04 ,  C25D11/30 ,  C25D13/02 ,  C25D13/12 ,  C25D13/20 ,  C25D13/22

Abstract: According to one example, preparing a substrate for an electronic device can include forming a deposition layer on a magnesium alloy substrate, anodizing the magnesium alloy substrate, and forming an electrophoretic deposition layer on the anodized magnesium alloy substrate.

公开(公告)号：US20170183781A1

公开(公告)日：2017-06-29

申请号：US15309535

申请日：2014-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P

Inventor： KUAN-TING WU ,  JAMES CHANG ,  YU-CHUAN KANG

IPC: C23C28/00 ,  B32B15/08

CPC classification number: C23C28/00 ,  B32B15/08

Abstract: An example composite material composed of a metal or multilayered metal substrate onto which an elastomer or elastomeric mixture is positioned by electrophoretic disposition. The elastomer or elastomeric mixture forms a flexible non-rigid elastomeric coating, which imparts a soft touch tactile feeling to the metal base substrate.