公开(公告)号：US20090086451A1

公开(公告)日：2009-04-02

申请号：US12010436

申请日：2008-01-24

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H05K1/0218 ,  H05K1/0236 ,  H05K3/4069 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/09972

摘要： A printed circuit board having an embedded cavity capacitor is disclosed. According to an embodiment of the present invention, the printed circuit board having the embedded cavity capacitor, the printed circuit board can include two conductive layers to be used as a power layer and a ground layer, respectively; and a first dielectric layer, placed between the two conductive layers, wherein at least one cavity capacitor is arranged in a noise-transferable path between a noise source and a noise prevented destination which are placed on the printed circuit board, the cavity capacitor being formed to allow a second dielectric layer to have a lower stepped region than the first dielectric layer, the second dielectric layer using the two conductive layers as a first electrode and a second electrode, respectively, and placed between the first electrode and the second electrode.

摘要翻译： 公开了一种具有嵌入式腔体电容器的印刷电路板。 根据本发明的实施例，具有嵌入式空腔电容器的印刷电路板，印刷电路板可以分别包括用作功率层和接地层的两个导电层; 以及放置在所述两个导电层之间的第一电介质层，其中至少一个空腔电容器被布置在放置在所述印刷电路板上的噪声源和被噪声阻止的目的地之间的可噪声转移路径中，形成所述空腔电容器 以允许第二电介质层具有比第一电介质层更低的台阶区域，第二电介质层分别使用两个导电层作为第一电极和第二电极，并且放置在第一电极和第二电极之间。

公开(公告)号：US20090039984A1

公开(公告)日：2009-02-12

申请号：US12010561

申请日：2008-01-25

申请人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

发明人： Han Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC分类号： H01P1/20

CPC分类号： H01P1/2005 ,  H01L2224/16225 ,  H01Q15/006 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.

摘要翻译： 公开了一种具有电磁带隙的电磁带隙结构和印刷电路板，该电磁带隙拦截了频带范围内的信号的传送。 电磁带隙结构包括金属层; 介电层，堆叠在金属层上; 至少两个金属板，堆叠在介电层的相同平面上; 和缝合通孔，连接相邻的金属板。 缝合通孔穿过电介质层，并且缝合通孔的一部分被放置在金属层的同一平面上。 利用本发明，电磁带隙可以通过具有紧凑的尺寸和低的带隙频率来降低​​特定频率的噪声。

公开(公告)号：US20080314630A1

公开(公告)日：2008-12-25

申请号：US12213571

申请日：2008-06-20

申请人： Han Kim ,  Je-Gwang Yoo

发明人： Han Kim ,  Je-Gwang Yoo

IPC分类号： H01R12/04

CPC分类号： H01P1/2005 ,  H01Q15/006 ,  H01Q15/008 ,  H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/0969

摘要： An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one end is connected to the first metal plate; a second metal plate connected to the other end of the via; a first metal layer being connected to the second metal layer through a metal line; a first dielectric layer, layer-built between the first metal layer and the first metal plate; a second dielectric layer, layer-built on the first metal plate and the first dielectric layer; and a second metal layer, layer-built on the second dielectric layer. With the present invention, it is possible to solve the aforementioned mixed signal problem by preventing the EM wave of a certain frequency range from being transferred.

摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构包括蘑菇型结构，其包括第一金属板和一端连接到第一金属板的通孔; 连接到所述通孔的另一端的第二金属板; 第一金属层通过金属线连接到第二金属层; 在第一金属层和第一金属板之间层叠的第一介电层; 第二电介质层，其在第一金属板和第一介电层上构建; 以及第二金属层，其被构建在第二介电层上。 通过本发明，可以通过防止某一频率范围的EM波被传送来解决上述混合信号问题。

公开(公告)号：US20090236141A1

公开(公告)日：2009-09-24

申请号：US12285133

申请日：2008-09-29

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H05K1/02

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate. In the electromagnetic bandgap structure of the present invetion, the first stitching via can electrically connect the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above the one conductive plate, and the second stitching via can electrically connect the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface below the one conductive plate.

摘要翻译： 根据本发明的实施例，电磁带隙结构可以包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板。 在本发明的电磁带隙结构中，第一缝合通孔可以通过允许第一缝合通孔的一部分通过一个导电板上的平面连接而将一个导电板电连接到另一个导电板， 缝合通孔可以通过允许第二缝合通孔的一部分通过一个导电板下面的平坦表面连接而将一个导电板电连接到另一个导电板。

公开(公告)号：US20090071709A1

公开(公告)日：2009-03-19

申请号：US12076650

申请日：2008-03-20

申请人： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

发明人： Mi-Ja Han ,  Han Kim ,  Ja-Bo Koo

IPC分类号： H05K1/02

CPC分类号： H05K1/0236 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/09663

摘要： An electromagnetic bandgap structure and a printed circuit board that intercepts to transfer a signal having a predetermined frequency band are disclosed. In particularly, the electromagnetic bandgap structure includes a first metal layer and a second metal layer; a metal plate, placed between the first metal layer and a second metal layer; a multi-via, penetrating the first metal layer, passing through the same planar surface as an outer metal layer and turning toward the first metal layer to connect the metal plate and the first metal layer; and a dielectric layer, stacked in between the first metal layer and the metal plate, between the metal plate and the second metal layer and between the first metal layer and the outer metal layer. With the present invention, a bandgap frequency can be decreased without increasing the size of the metal plate.

摘要翻译： 公开了一种电磁带隙结构和用于传送具有预定频带的信号的印刷电路板。 特别地，电磁带隙结构包括第一金属层和第二金属层; 金属板，放置在第一金属层和第二金属层之间; 穿过第一金属层的多通孔，穿过与外部金属层相同的平面，并朝着第一金属层转动以连接金属板和第一金属层; 以及电介质层，层叠在所述第一金属层和所述金属板之间，所述金属板与所述第二金属层之间以及所述第一金属层与所述外部金属层之间。 通过本发明，可以在不增加金属板的尺寸的情况下降低带隙频率。

公开(公告)号：US07563104B2

公开(公告)日：2009-07-21

申请号：US11896298

申请日：2007-08-30

申请人： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

发明人： Han Kim ,  Yang Je Lee ,  Sang Jin Oh ,  Mi Ja Han

IPC分类号： H01R12/00

CPC分类号： H01R13/2407 ,  H01R12/58 ,  H05K3/365 ,  H05K2201/10295

摘要： The Printed Circuit Board (PCB) has connectors which each include a terminal part and a connector pin. The terminal part is formed in one end of the PCB and is provided with a terminal hole. The connector pin is configured such that one end thereof is inserted into the terminal hole, and the remaining end thereof extends to protrude outside the terminal hole and is also bent several times, thus forming a contact part that is elastically deformed, and electrically connected to a pad part provided in a target PCB for connection. Thus, a desirable signal transmission characteristic is guaranteed, so that the reliability of electronic devices using the PCB can be improved and the manufacturing cost can also be reduced.

摘要翻译： 印刷电路板（PCB）具有连接器，每个连接器包括端子部分和连接器引脚。 端子部分形成在PCB的一端并设有端子孔。 连接器销被构造成使得其一端插入端子孔中，并且其剩余端延伸到端子孔外部并且也弯曲多次，从而形成弹性变形的接触部，并且电连接到 设置在目标PCB中用于连接的焊盘部分。 因此，保证期望的信号传输特性，从而可以提高使用PCB的电子设备的可靠性，并且还可以降低制造成本。

公开(公告)号：US20090071603A1

公开(公告)日：2009-03-19

申请号：US12007474

申请日：2008-01-10

申请人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC分类号： B32B38/14

CPC分类号： B32B37/02 ,  B32B38/14 ,  B32B2038/0092 ,  B32B2038/047 ,  B32B2305/022 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2457/08 ,  H05K1/0236 ,  H05K1/162 ,  H05K3/007 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2203/0156

摘要： A method of manufacturing a 4-layered printed circuit board by one-time stacking process is disclosed. In particular, the printed circuit board manufacturing method includes adhering copper clad laminates (CCL) to both surfaces of a foam tape; forming an inner layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being not adhered to the foam tape; separating the CCL from the foam tape; arranging the copper thin layer in which the inner layer circuit pattern is formed to face a prepreg; compressing the CCL into the prepreg; and forming an outer layer circuit pattern on one of both copper thin layers of the CCL, the one copper thin layer being in no contact with the prepreg.

摘要翻译： 公开了通过一次堆叠处理制造4层印刷电路板的方法。 特别地，印刷电路板的制造方法包括将覆铜层压板（CCL）粘附到泡沫胶带的两个表面上; 在CCL的两个铜薄层之一上形成内层电路图案，一个铜薄层不粘附到泡沫胶带上; 将CCL与泡沫胶带分离; 将其中形成内层电路图案的铜薄层布置成面对预浸料; 将CCL压缩成预浸料; 并且在CCL的两个铜薄层之一上形成外层电路图案，一个铜薄层不与预浸料坯接触。

公开(公告)号：US08598468B2

公开(公告)日：2013-12-03

申请号：US13437254

申请日：2012-04-02

申请人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

发明人： Han Kim ,  Mi-Ja Han ,  Hyo-Jic Jung

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01P1/2005 ,  H01L2224/16 ,  H01P1/203 ,  H05K1/0236 ,  H05K1/0237 ,  H05K2201/09309 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09663 ,  H05K2201/09681

摘要： An electromagnetic bandgap structure including: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a second stitching via, configured to electrically connect the one conductive plate to yet another conductive plate, wherein the first stitching via electrically connects the one conductive plate to another conductive plate by allowing a part of the first stitching via to be connected through a planar surface above or below the one conductive plate, and the second stitching via electrically connects the one conductive plate to yet another conductive plate by allowing a part of the second stitching via to be connected through a planar surface that is different from the planar surface through which the part of the first stitching via is connected, the two planar surfaces being placed in a same direction based on the conductive plates.

摘要翻译： 一种电磁带隙结构，包括：至少三个导电板; 第一缝合通孔，被配置为将任一导电板电连接到另一个导电板; 以及第二缝合通孔，其被配置为将所述一个导电板电连接到另一个导电板，其中所述第一缝合通孔将所述第一缝合通孔的一部分通过平面 表面在一个导电板的上方或下方，并且第二缝合通孔通过允许第二缝合通孔的一部分通过不同于平面的平面表面连接一个导电板到另一个导电板，通过该平面 第一缝合通孔的部分被连接，两个平面被放置在相同的方向上，基于导电板。

公开(公告)号：US08077000B2

公开(公告)日：2011-12-13

申请号：US12232463

申请日：2008-09-17

申请人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC分类号： H01P1/201

CPC分类号： H01P3/088 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K1/0237 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括电介质层; 多个导电板; 缝合通孔，其构造成穿过介电层并且具有通过连接通过不同于导电板的平坦表面的平坦表面和通孔而将导电板彼此电连接的部分。 这里，电介质层，导电板和缝合通孔可以放置在任何两个导电层之间，并且通孔可以被配置为穿过形成在导电层中的间隙孔并将两个导电层彼此电连接 。

公开(公告)号：US20090184782A1

公开(公告)日：2009-07-23

申请号：US12232463

申请日：2008-09-17

申请人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

发明人： Ja-Bu Koo ,  Mi-Ja Han ,  Han Kim

IPC分类号： H01P1/203

CPC分类号： H01P3/088 ,  H01L2224/16225 ,  H01P1/2005 ,  H05K1/0236 ,  H05K1/0237 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09681

摘要： Disclosed are an electromagnetic bandgap structure and a printed circuit board. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a dielectric layer; a plurality of conductive plates; a stitching via, configured to pass through the dielectric layer and have a part electrically connecting the conductive plates to each other by connecting through a planar surface that is different from a planar surface of the conductive plates, and a through via. Here, the dielectric layer, the conductive plates and the stitching via can be placed between any two conductive layers, and the through via can be configured to pass through a clearance hole formed in the conductive layer and electrically connect the two conductive layers to each other.

摘要翻译： 公开了电磁带隙结构和印刷电路板。 根据本发明的实施例，电磁带隙结构可以包括电介质层; 多个导电板; 缝合通孔，其构造成穿过介电层并且具有通过连接通过不同于导电板的平坦表面的平坦表面和通孔而将导电板彼此电连接的部分。 这里，电介质层，导电板和缝合通孔可以放置在任何两个导电层之间，并且通孔可以被配置为穿过形成在导电层中的间隙孔并将两个导电层彼此电连接 。