Abstract:
A semiconductor device is provided which is highly reliable and operable at fast speed and low noises. In this semiconductor device, there are provided a power wiring section 1003a, a ground wiring section 1003b and a signal wiring section 1003c are formed on one level. The power wiring section or the ground wiring section is formed adjacently on both sides of at least one part of the signal wiring section.
Abstract:
A new soft stainless steel sheet has an austenite-stability index Md30 controlled in a range of −120 to −10 and a stacking fault formability index SFI controlled not less than 30, and involves precipitates whose Cu concentration is controlled not more than 1.0%, so as to maintain concentration of dissolved Cu at 1-5%. The stainless steel sheet preferably contains up to 0.06%(C+N), up to 2.0% Si, up to 5% Mn, 15-20% Cr, 5-9% Ni, 1.0-4.0% Cu, up to 0.003% Al, up to 0.005% S, and optionally one or more of up to 0.5% Ti, up to 0.5% Nb, up to 0.5% Zr, up to 0.5% V, up to 3.0% Mo, up to 0.03% B, up to 0.02% REM (rare earth metals) and up to 0.03% Ca. The stainless steel sheet can be plastically deformed to an objective shape without any cracks even at a part heavily-worked part by multi-stage deep drawing or compression deforming. Md30(° C.)=551−462(C+N)−9.2Si−8.1Mn−29(Ni+Cu)−13.7Cr−18.5Mo SFI(mJ/m2)=2.2Ni+6Cu−1.1Cr−13Si−1.2Mn+32.
Abstract:
A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.
Abstract:
A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.
Abstract:
In a liquid-crystal display device comprising a liquid-crystal display panel, a light source provided in proximity to the liquid-crystal display panel for illuminating the liquid-crystal display panel, a transformer of the light source provided in proximity to the liquid-crystal display panel, and an enclosure for housing the liquid-crystal display panel, the light source and the transformer, a gasket is provided between the liquid-crystal display panel and the enclosure for controlling a thermal gradient of the liquid-crystal display panel.
Abstract:
A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
Abstract:
A coating method and coating apparatus capable of providing a coated film of improved surface properties free from any streak and color shading and facilitating coating on a sheet of an increased width without causing enlargement of the apparatus and thus complicating its structure. A swirling motion imparting mechanism and an orifice are arranged at a connection between a liquid feed pipe and a coater. Swirling motion is imparted to coating liquid discharged from a pump and then a flow velocity of the coating liquid is immediately increased to a level as high as 200 cm/s or more, the liquid then being fed into a pocket of the coater within 0.1 second or less. This permits shearing to act on the coating liquid, to thereby effectively prevent a variation in viscosity of the coating liquid and flocculation thereof, so that the coated film may be improved in surface properties.
Abstract:
A preloader apparatus retracts, upon quick deceleration of a vehicle, a buckle apparatus with which a tongue plate for supporting a webbing is engaged so as to fasten the webbing onto an occupant of the vehicle. The preloader apparatus has a flexible wire connected to the buckle apparatus and used to retract the buckle apparatus and a supporting member which supports the wire so as to maintain a predetermined portion of the wire in the standing state and whose supporting function is canceled upon retraction of the buckle apparatus. Accordingly, the buckle apparatus can be maintained in a predetermined standing state.
Abstract:
In a coating apparatus having an extrusion coating head, the working value H of a back end edge which corresponds to an end portion at the downstream side of a support feeding direction of a back edge of the extrusion coating head is set to 25 .mu.m or less, and the straightness of said back end edge with respect to the coating width is set to 5 .mu.m or less. Accordingly, a coating operation to form coated films at a stable thickness can be stably performed without occurrence of streaks and coating unevenness on the films, and a judgment on coating surface characteristics can be readily performed without actually carrying the coating operation.
Abstract:
A still picture display apparatus comprises a VRAM and a character ROM. The VRAM is allocated first coordinate addresses corresponding to display positions of a raster scan type display, and a character code representing a character to be displayed is stored in each of the first coordinate addresses. The character ROM is divided into a plurality of storage areas, and dot data of the character is stored in an address designated by the above character code in each of the storage areas. An extended RAM is also allocated second coordinate addresses similarly to the VRAM, and modifying data (character modifying data and/or color modifying data) corresponding to the character code stored in the VRAM is stored in each of the second coordinate addresses. The modifying data is read out of the extended RAM and is loaded into a register and then, is applied as a higher order address of the character ROM to designate any one of the storage areas, and the character code read out of the VRAM is applied as a lower order address of the character ROM. Consequently, the dot data of the character corresponding to the character code is read out of the character ROM.