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公开(公告)号：US09627196B2
公开(公告)日：2017-04-18
申请号：US14511199
申请日：2014-10-10
Applicant: Infineon Technologies AG
Inventor： Guenther Ruhl , Klemens Pruegl
CPC classification number: H01L21/02527 , C01B32/186 , H01L21/0237 , H01L21/02488 , H01L21/02614 , H01L21/02631 , H01L21/02664 , H01L21/02667 , H01L29/1606
Abstract: According to various embodiments, a method for processing a carrier may include: co-depositing at least one metal from a first source and carbon from a second source over a surface of the carrier to form a first layer; forming a second layer over the first layer, the second layer including a diffusion barrier material, wherein the solubility of carbon in the diffusion barrier material is less than in the at least one metal; and forming a graphene layer at the surface of the carrier from the first layer by a temperature treatment.
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公开(公告)号：US20160238549A1
公开(公告)日：2016-08-18
申请号：US15136047
申请日：2016-04-22
Applicant: Infineon Technologies AG
Inventor： Guenther Ruhl , Florian Bachl
CPC classification number: G01N27/127 , G01N27/125 , G01N27/403 , G01N33/0027 , H01L51/0003 , H01L51/0021
Abstract: A fluid sensor chip includes an isolator substrate including amorphous carbon, an electrical conductor including graphite and an active material including graphene or carbon nanotubes.
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公开(公告)号：US20160190446A1
公开(公告)日：2016-06-30
申请号：US14587007
申请日：2014-12-31
Applicant: Infineon Technologies AG
Inventor： Hans-Joachim Schulze , Peter Irsigler , Guenther Ruhl
IPC: H01L51/00 , H01L21/324 , H01L21/02
CPC classification number: H01L51/0048 , B82Y30/00 , B82Y40/00 , C01B31/0226 , C01B31/0461 , C01B32/184 , C01B32/188 , H01L21/02373 , H01L21/02378 , H01L21/0243 , H01L21/02527 , H01L21/02587 , H01L21/02612 , H01L29/0676 , H01L29/068 , H01L29/1606 , H01L29/66045 , H01L29/66439 , H01L29/775 , H01L29/7781 , H01L51/0002 , H01L51/0026 , H01L51/003 , H01L51/0558 , H01L51/057 , Y10S977/742 , Y10S977/842 , Y10S977/932
Abstract: In various embodiments, a method of forming a graphene structure is provided. The method may include forming a body including at least one protrusion, and forming a graphene layer at an outer peripheral surface of the at least one protrusion.
Abstract translation: 在各种实施例中，提供了形成石墨烯结构的方法。 该方法可以包括形成包括至少一个突起的主体，以及在至少一个突起的外周表面处形成石墨烯层。
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公开(公告)号：US20160181496A1
公开(公告)日：2016-06-23
申请号：US14579154
申请日：2014-12-22
Applicant: Infineon Technologies AG
Inventor： Christian Kegler , Johannes Georg Laven , Hans-Joachim Schulze , Guenther Ruhl , Joachim Mahler
CPC classification number: G01K7/16 , H01L29/16 , H01L29/1602 , H01L29/1604 , H01L29/1608 , H01L29/20 , H01L29/2003 , H01L35/04 , H01L35/14 , H01L35/18
Abstract: Temperature sensor devices and corresponding methods are provided. A temperature sensor may include a first layer being essentially non-conductive in a temperature range and a second layer having a varying resistance in the temperature range.
Abstract translation: 提供温度传感器装置和相应的方法。 温度传感器可以包括在温度范围内基本上不导电的第一层和在温度范围内具有变化的电阻的第二层。
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45.发明申请GRAPHENE GAS SENSOR FOR MEASURING THE CONCENTRATION OF CARBON DIOXIDE IN GAS ENVIRONMENTS 有权用于测量二氧化碳浓度在气体环境中的石墨气体传感器公开(公告)号：US20150377824A1
公开(公告)日：2015-12-31
申请号：US14751660
申请日：2015-06-26
Applicant: Infineon Technologies AG
Inventor： Guenther Ruhl , Thomas Hirsch , Alexander Zoepfl
IPC: G01N27/407
CPC classification number: G01N33/004 , G01N27/127
Abstract: A gas sensor for measuring a concentration of carbon dioxide in a gas environment (GE) is provided. The gas sensor includes a graphene layer having a side facing towards the gas environment (GE), an electrode layer including a plurality of electrodes electrically connected to the graphene layer, and a chalcogenide layer covering at least a part of the side of the graphene layer facing towards the gas environment (GE).
Abstract translation: 提供了用于测量气体环境（GE）中的二氧化碳浓度的气体传感器。 气体传感器包括具有朝向气体环境（GE）的一侧的石墨烯层，包括电连接到石墨烯层的多个电极的电极层和覆盖石墨烯层的至少一部分侧面的硫族化物层 面向气体环境（GE）。
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Patent Agency Ranking
公开(公告)号：US20150226810A1
公开(公告)日：2015-08-13
申请号：US14631443
申请日：2015-02-25
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Jochen Dangelmaier , Franz Michael Darrer , Thomas Mueller , Mathias Vaupel , Manfred Fries , Guenther Ruhl , Horst Theuss , Matthias Rose , Stephan Auer , Tue Fatt David Wee , Sie Boo Chiang
CPC classification number: G01R31/3658 , H01M10/0525 , H01M10/4257 , H01M10/48 , H01M10/486 , H01M2010/4271 , H04Q9/00 , H04Q2209/40 , H04Q2209/823
Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.
Abstract translation: 根据实施例的传感器装置包括基板，以及安装在基板上的至少一个传感器和控制电路，其中至少一个传感器和控制电路位于基板上，以可安装在电池单元内部， 电池单元。
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公开(公告)号：US20150185180A1
公开(公告)日：2015-07-02
申请号：US14143634
申请日：2013-12-30
Applicant: Infineon Technologies AG
Inventor： Guenther Ruhl , Florian Bachl
IPC: G01N27/403
CPC classification number: G01N27/127 , G01N27/125 , G01N27/403 , G01N33/0027 , H01L51/0003 , H01L51/0021
Abstract: A fluid sensor chip includes an isolator substrate including amorphous carbon, an electrical conductor including graphite and an active material including graphene or carbon nanotubes.
Abstract translation: 流体传感器芯片包括包括无定形碳的隔离器基板，包括石墨的电导体和包括石墨烯或碳纳米管的活性材料。
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公开(公告)号：US20150123142A1
公开(公告)日：2015-05-07
申请号：US14595669
申请日：2015-01-13
Applicant: Infineon Technologies AG
Inventor： Joachim Mahler , Ralf Otremba , Hans-Joachim Shulze , Guenther Ruhl , Hans-Joerg Timme
IPC: H01L23/367 , H01L27/02 , H01L27/06 , H01L23/373 , H01L27/088
CPC classification number: H01L27/0248 , H01L23/3677 , H01L23/4275 , H01L23/525 , H01L27/0676 , H01L27/088 , H01L29/49 , H01L29/4983 , H01L29/7397 , H01L29/7813 , H01L29/8611 , H01L2924/0002 , H01L2924/00
Abstract: A power semiconductor device includes a wiring structure adjoining at least one side of a semiconductor body and comprising at least one electrically conductive compound. The power semiconductor device further includes a cooling material in the wiring structure. The cooling material is characterized by a change in structure by means of absorption of energy at a temperature TC ranging between 150° C. and 400° C.
Abstract translation: 功率半导体器件包括邻接半导体主体的至少一侧并且包括至少一种导电化合物的布线结构。 功率半导体器件还包括布线结构中的冷却材料。 冷却材料的特征在于通过在150℃和400℃之间的温度TC下吸收能量而改变结构。
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公开(公告)号：US20150090043A1
公开(公告)日：2015-04-02
申请号：US14497452
申请日：2014-09-26
Applicant: Infineon Technologies AG
Inventor： Guenther Ruhl , Max Christian Lemme , Alfons Dehe , Andreas Fischer , Frank Niklaus , Anderson Smith
CPC classification number: B81C1/00182 , G01L9/0044 , G01L9/0048 , G01L9/0052 , G01N3/02 , Y10T29/49117
Abstract: Embodiments provide a MEMS including a MEMS device and an detector circuit. The MEMS device includes a membrane, wherein a material of the membrane comprises a band gap and a crystal structure with structural elements (unit cells) connected by covalent bonds in two dimensions only. The detector circuit is configured to determine a deformation of the membrane based on a piezoresistive resistance of the material of the membrane.
Abstract translation: 实施例提供了包括MEMS器件和检测器电路的MEMS。 MEMS器件包括膜，其中膜的材料包括带隙和仅通过共价键连接的结构元件（单元电池）的晶体结构。 检测器电路被配置为基于膜的材料的压阻电阻来确定膜的变形。
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公开(公告)号：US20140170446A1
公开(公告)日：2014-06-19
申请号：US13717417
申请日：2012-12-17
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Klaus Elian , Horst Theuss , Guenther Ruhl
CPC classification number: H01M10/48 , G01M3/227 , G01M3/3272 , G01M3/36 , H01M2/345 , H01M10/052 , H01M2200/20
Abstract: A sensor module includes an enclosure adapted to hermetically seal an opening or a hole on the outer surface of a casing or packaging, a sensor element and a membrane. The membrane is arranged between the enclosure and the opening or hole of the casing or packaging.
Abstract translation: 传感器模块包括适于气密地密封壳体或包装，传感器元件和膜的外表面上的开口或孔的外壳。 隔膜布置在外壳和外壳或包装的开口或孔之间。
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