公开(公告)号：US12219706B2

公开(公告)日：2025-02-04

申请号：US17354989

申请日：2021-06-22

Applicant: Intel Corporation

Inventor： Jonathan W. Thibado ,  Aaron Gorius ,  Michael T. Crocker ,  Matthew J. Adiletta ,  John C. Gulick ,  Emery E. Frey

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/11 ,  H05K3/28 ,  H05K3/36 ,  H05K7/02 ,  H05K7/20

Abstract: Examples described herein relate to an apparatus that includes a flexible conductor covered in an insulative material and at least one conductor region in contact with the flexible conductor. In some examples, melting of the at least one conductor region is to cause a conductive coupling of the flexible conductor with a second conductor and wherein the flexible conductor is adapted to conductively couple a first circuit board oriented orthogonal to a second circuit board. In some examples, the at least one conductor region comprises at least one solder ball of a grid array. In some examples, the at least one conductor region is re-solderable.

公开(公告)号：US12111775B2

公开(公告)日：2024-10-08

申请号：US17212722

申请日：2021-03-25

Applicant: Intel Corporation

Inventor： Duane E. Galbi ,  Matthew J. Adiletta ,  Hugh Wilkinson ,  Patrick Connor

IPC: G06F13/16 ,  G06F13/40 ,  G06F13/42

CPC classification number: G06F13/1621 ,  G06F13/1668 ,  G06F13/409 ,  G06F13/4221

Abstract: Examples described herein relate to an apparatus that includes at least two processing units and a memory hub coupled to the at least two processing units. In some examples, the memory hub includes a home agent. In some examples, the memory hub is to perform a memory access request involving a memory device, a first processing unit among the at least two processing units is to send the memory access request to the memory hub. In some examples, the first processing unit is to offload at least some but not all home agent operations to the home agent of the memory hub. In some examples, the first processing unit comprises a second home agent and wherein the second home agent is to perform the at least some but not all home agent operations before the offload of at least some but not all home agent operations to the home agent of the memory hub. In some examples, based on provision of the at least some but not all home agent operations to be performed by the second home agent, the second home agent is to perform the at least some but not all home agent operations.

公开(公告)号：US11108574B2

公开(公告)日：2021-08-31

申请号：US16583516

申请日：2019-09-26

Applicant: Intel Corporation

Inventor： Mrittika Ganguli ,  Joe Carvalho ,  Gary Muntz ,  Matthew J. Adiletta

IPC: H04L12/10 ,  H04L12/26 ,  H04L12/931

Abstract: Technologies for switch link and ply management for variable oversubscription ratios include powering up and down links of one or more network plys according to bandwidth demand, desired oversubscription ratio and/or other parameters. Telemetry data representing one or more network traffic metrics of one or more switch plies is monitored to determine respective power states of the plurality of links associated with the one or more switch plies as a function of a desired oversubscription ratio calculated based on the telemetry data. The respective power state of the plurality of links is set accordingly.

公开(公告)号：US11071039B2

公开(公告)日：2021-07-20

申请号：US16534604

申请日：2019-08-07

Applicant: INTEL CORPORATION

Inventor： Michael F. Fallon ,  Matthew J. Adiletta

IPC: H04W40/24 ,  H04W84/18 ,  H04L12/741 ,  H04W40/04 ,  H04W40/20 ,  H04L12/717 ,  H04W40/10

Abstract: Examples may include a management authority for a software-define network (SDN) receiving telemetric data from wireless devices coupled together in a mesh network having one or more ad hoc connections between the wireless devices. The management authority may then generate a routing table based on the received telemetric data and provide a routing table for use by the wireless devices to route data within the mesh network or route data to a network coupled to the mesh network.

公开(公告)号：US20200326955A1

公开(公告)日：2020-10-15

申请号：US16091201

申请日：2016-04-26

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Myles Wilde ,  Michael F. Fallon ,  Amit Kumar ,  Chengda Yang ,  Aaron Gorius ,  William R. Wheeler

IPC: G06F9/4401 ,  G06F13/40 ,  G06K19/04 ,  G06F1/16

Abstract: All in one mobile computing devices and methods performed by the devices. The all in one mobile computing device includes a processor, memory, and software instructions configured to be executed on the processor to enable the mobile computing device to perform various operations. The all in one device may include various wired and wireless interfaces that enable it to communicate with a wide-range of devices, including smartphones, tablets, laptops, personal computers, smart TVs, and others. The all in one device is capable of being remotely accessed when linked in communication with a second device, and is enabled to aggregate data from various user devices and cloud-based services to create unified data resources. Data that is accessed by the device may be synched with a cloud-based storage service to enable a user to access data from across a range of devices via the all in one device. The all in one device has a form factor that is approximately the size of a credit card, yet is capable of running a full-fledged desktop operating system.

公开(公告)号：US20200082782A1

公开(公告)日：2020-03-12

申请号：US16576386

申请日：2019-09-19

Applicant: Intel Corporation

Inventor： Myles Wilde ,  Matthew J. Adiletta ,  William R. Wheeler ,  Michael F. Fallon ,  Thomas M. Garrison ,  Aaron Gorius ,  Chengda Yang

IPC: G09G5/00 ,  H04W4/18 ,  H04N5/38 ,  G06T1/60 ,  H04N19/44 ,  H04N19/423 ,  H04W76/14 ,  H04W4/80 ,  H04W4/21 ,  H04L29/06 ,  G06F13/38 ,  H04W12/00

Abstract: Mobile computing device technology and systems and methods using the same are described herein. In particular, mobile computing devices that may serve as a processing component of a disaggregated computing system described, non-integral screens that may be paired with the mobile computing devices, and systems and methods using such devices and screens are described. In some embodiments, the mobile computing device technology includes a mobile computing device that lacks an integral screen, but which is capable of throwing at least video information to a non-integral target screen, e.g., via a paired connection established over a wired or wireless communication interface.

公开(公告)号：US20190387291A1

公开(公告)日：2019-12-19

申请号：US16506457

申请日：2019-07-09

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H04Q11/00 ,  H03M7/40 ,  H03M7/30 ,  G06F16/901 ,  G06F3/06 ,  H04L12/811 ,  G11C7/10 ,  H05K7/14 ,  G06F1/18 ,  G06F13/40 ,  H05K5/02 ,  G08C17/02 ,  H04L12/24 ,  H04L29/08 ,  H04L12/26 ,  H04L12/851 ,  G06F9/50 ,  H04L12/911 ,  G06F12/109 ,  H04L29/06 ,  G11C14/00 ,  G11C5/02 ,  G11C11/56 ,  G02B6/44 ,  G06F8/65 ,  G06F12/14 ,  G06F13/16 ,  H04B10/25 ,  G06F9/4401 ,  G02B6/38 ,  G02B6/42 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L12/931 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H05K1/02 ,  H04L12/781 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/933 ,  H04L12/947 ,  G06F9/30 ,  G06F9/38 ,  G06F9/54

Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds and racks can be arranged to be autonomously manipulated, such as, by a robot. The sleds and racks can include features to facilitate automated installation, removal, maintenance, and manipulation by a robot.

公开(公告)号：US10474460B2

公开(公告)日：2019-11-12

申请号：US16120419

申请日：2018-09-03

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Aaron Gorius ,  Myles Wilde ,  Michael T. Crocker

IPC: H04J14/00 ,  G06F9/30 ,  H03M7/40 ,  H03M7/30 ,  G06F16/901 ,  G06F3/06 ,  G11C7/10 ,  H05K7/14 ,  G06F1/18 ,  G06F13/40 ,  H05K5/02 ,  G08C17/02 ,  H04L12/24 ,  H04L29/08 ,  H04L12/26 ,  H04L12/851 ,  H04Q11/00 ,  G06F9/50 ,  H04L12/911 ,  G06F12/109 ,  H04L29/06 ,  G11C14/00 ,  G11C5/02 ,  G11C11/56 ,  G02B6/44 ,  G06F8/65 ,  G06F12/14 ,  G06F13/16 ,  H04B10/25 ,  G06F9/4401 ,  G02B6/38 ,  G02B6/42 ,  B25J15/00 ,  B65G1/04 ,  H05K7/20 ,  H04L12/931 ,  H04L12/939 ,  H04W4/02 ,  H04L12/751 ,  G06F13/42 ,  H05K1/18 ,  G05D23/19 ,  G05D23/20 ,  H04L12/927 ,  H05K1/02 ,  H04L12/781 ,  H04Q1/04 ,  G06F12/0893 ,  H05K13/04 ,  G11C5/06 ,  G06F11/14 ,  G06F11/34 ,  G06F12/0862 ,  G06F15/80 ,  H04L12/919 ,  G06F12/10 ,  G06Q10/06 ,  G07C5/00 ,  H04L12/28 ,  H04L29/12 ,  H04L9/06 ,  H04L9/14 ,  H04L9/32 ,  H04L12/933 ,  H04L12/947 ,  H04L12/811 ,  G06F9/38 ,  G06F9/54 ,  H04W4/80 ,  G06Q10/08 ,  G06Q10/00 ,  G06Q50/04

Abstract: Technologies for optical communication in a rack cluster in a data center are disclosed. In the illustrative embodiment, a network switch is connected to each of 1,024 sleds by an optical cable that enables communication at a rate of 200 gigabits per second. The optical cable has low loss, allowing for long cable lengths, which in turn allows for connecting to a large number of sleds. The optical cable also has a very high intrinsic bandwidth limit, allowing for the bandwidth to be upgraded without upgrading the optical infrastructure.

公开(公告)号：US20190173211A1

公开(公告)日：2019-06-06

申请号：US16208543

申请日：2018-12-03

Applicant: Intel Corporation

Inventor： Russell Aoki ,  Aaron Gorius ,  Michael T. Crocker ,  Matthew J. Adiletta

IPC: H01R12/72 ,  G06F1/18 ,  H05K1/14

Abstract: Sleds for operation in racks of data centers are disclosed herein. A sled includes a circuit board substrate, one or more physical resources, and one or more memory devices. The circuit board substrate has a top side and a bottom side arranged opposite the top side. The one or more physical resources are coupled to the top side of the circuit board substrate. The one or more memory devices are coupled to the bottom side of the circuit board substrate. Additionally, the sled includes a connector to electrically couple the one or more physical resources to the one or more memory devices.

公开(公告)号：US20190121682A1

公开(公告)日：2019-04-25

申请号：US16091206

申请日：2016-04-26

Applicant: Intel Corporation

Inventor： Matthew J. Adiletta ,  Myles Wilde ,  William R. Wheeler ,  Michael F. Fallon ,  Aaron Gorius ,  Amit Kumar ,  Chengda Yang

IPC: G06F9/54 ,  G06F13/42 ,  G06F13/362 ,  G06F9/48 ,  G06F9/451

Abstract: Techniques for implementing assess to Android applications and native Window application on Android devices and systems. A processor board includes a processor that is configured to run a full version of a Windows operating system and Windows applications. The processor board is configured to be communicatively coupled to the processor board in an Android device, such as a Smartphone or tablet. Upon operations and when the processor board is communicatively coupled to the Android device, a user of the Android device is enabled to selectively run Android applications and Windows applications, with the Windows applications being executed natively on the processor board. The processor board may be implemented in a computing card that is approximately the size of a credit card or smaller, which in turn may be coupled to the Android device via a backpack or similar means. The processor board may also be disposed within the same housing as the Android device.