公开(公告)号：US20080213980A1

公开(公告)日：2008-09-04

申请号：US12104947

申请日：2008-04-17

申请人： Ru-Sheng Liu ,  Han-Lung Tsai ,  Cheng-Hsu Hsiao

发明人： Ru-Sheng Liu ,  Han-Lung Tsai ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/304

CPC分类号： H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A process applied to grinding, dicing, and/or stacking semiconductors is disclosed. One of its features is that after transparent material is stuck on its active surface, a semiconductor is ground from another surface thereof to become thinner, then take advantage of transparency of the transparent material to cut the transparent material and the semiconductor, to obtain at least one smaller semiconductor unit such as die or chip. Another feature is that the transparent material remains sticking to the active surface of the die by an adhesion layer until the die is attached to a carrier or another die, and then the transparent material and the adhesion layer are removed by taking advantage of a function of the adhesion layer: receiving a ray to lose adhesion between it and the active surface. Preferably the ray reaches the adhesion layer via the transparent material stuck on the active surface of the die.

摘要翻译： 公开了一种应用于研磨，切割和/或堆叠半导体的方法。 其特征之一是在将透明材料粘贴在其活性表面上之后，从其另一表面研磨半导体以变薄，然后利用透明材料的透明度来切割透明材料和半导体，以获得至少 一个较小的半导体单元，如芯片或芯片。 另一个特征是透明材料通过粘合层保持粘附到模具的活性表面，直到模具附接到载体或另一个模具，然后通过利用透明材料和粘合层的功能去除透明材料和粘附层 粘合层：接收光线以失去其与活性表面之间的粘附。 优选地，光线通过粘附在模具的有效表面上的透明材料到达粘附层。

公开(公告)号：US20080122070A1

公开(公告)日：2008-05-29

申请号：US11986359

申请日：2007-11-21

申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Chih-Wei Chang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/373 ,  H01L21/58

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L23/4334 ,  H01L24/16 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2224/0401

摘要： A heat dissipating semiconductor package and a fabrication method therefor are provided. The fabrication method for the heat dissipating semiconductor package mainly includes steps of: containing a substrate having a chip mounted thereon in an aperture of a carrier; mounting a heat dissipating sheet having supporting portions on the carrier with the heat dissipating sheet being attached on the chip; forming an encapsulant to encapsulate the semiconductor chip and the heat dissipating structure; removing a part of the encapsulant above the heat dissipating sheet with a part of the heat dissipating sheet exposed from the encapsulant by lapping; and forming a cover layer on the part of heat dissipating sheet to prevent it from oxidation; and cutting along a predetermined size of the semiconductor package, thereby heat generated from an operation of the chip is dissipated via the heat dissipating structure.

摘要翻译： 提供一种散热半导体封装及其制造方法。 用于散热半导体封装的制造方法主要包括以下步骤：将载置有孔的芯片安装在其上; 将散热板安装在载体上，并将散热板安装在芯片上; 形成密封剂以封装半导体芯片和散热结构; 通过研磨从所述密封剂暴露出的部分所述散热片去除所述散热片上方的所述密封剂的一部分; 在散热片的一部分上形成覆盖层以防止其氧化; 并且沿着预定尺寸的半导体封装进行切割，由此从芯片的操作产生的热量经由散热结构消散。

公开(公告)号：US20080105941A1

公开(公告)日：2008-05-08

申请号：US11982514

申请日：2007-11-02

申请人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Tse-Wen Chang ,  Chang-Yueh Chan ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L31/0203 ,  H01L21/00

CPC分类号： H01L31/0203 ,  H01L23/3128 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.

摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。

公开(公告)号：US20080061451A1

公开(公告)日：2008-03-13

申请号：US11900345

申请日：2007-09-10

申请人： Wen-Home Huang ,  Wen-Tsung Tseng ,  Chang-Fu Lin ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

发明人： Wen-Home Huang ,  Wen-Tsung Tseng ,  Chang-Fu Lin ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L23/3142 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package and a fabrication method thereof are disclosed. The fabrication method includes the steps of providing a semiconductor chip having an active surface and a non-active surface opposing to the active surface, roughening a peripheral portion of the non-active surface so as to divide the non-active surface into the peripheral portion formed with a roughened structure and a non-roughened central portion, mounting the semiconductor chip on a chip carrier via a plurality of solder bumps formed on the active surface, forming an encapsulant on the chip carrier to encapsulate the semiconductor chip. The roughened structure formed on the peripheral portion of the non-active surface of the semiconductor chip can reinforce the bonding between the semiconductor chip and the encapsulant, and the non-roughened central portion of the non-active surface of the semiconductor chip can maintain the structural strength of the semiconductor chip.

摘要翻译： 公开了半导体封装及其制造方法。 该制造方法包括以下步骤：提供具有与活性表面相对的活性表面和非活性表面的半导体芯片，粗糙化非活性表面的周边部分，以将非活性表面划分成周边部分 形成有粗糙结构和非粗糙化的中心部分，通过形成在有源表面上的多个焊料凸块将半导体芯片安装在芯片载体上，在芯片载体上形成密封剂以封装半导体芯片。 形成在半导体芯片的非活性表面的周边部分上的粗糙结构可以加强半导体芯片和密封剂之间的接合，并且半导体芯片的非活性表面的非粗糙化的中心部分可以保持 半导体芯片的结构强度。

公开(公告)号：US20070202633A1

公开(公告)日：2007-08-30

申请号：US11651708

申请日：2007-01-09

申请人： Wen-Tsung Tseng ,  Fang-Lin Tsai ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

发明人： Wen-Tsung Tseng ,  Fang-Lin Tsai ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

IPC分类号： H01L21/00

CPC分类号： H01L21/4882 ,  H01L23/3675 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A semiconductor package and a method for fabricating the same are provided. The method includes providing a substrate having recognition points and a heat sink having openings, and placing the heat sink on the substrate with the recognition points being exposed through the openings; using a checking system to inspect the recognition points through the openings so as to ensure that the heat sink is placed at a predetermined position on the substrate; and attaching the heat sink to the substrate via an adhesive. By the above semiconductor package and method, there is no need to form positioning holes in the substrate such that any adverse effect on the circuit layout and reliability of the semiconductor package is avoided, and any positional shifting of the heat sink relative to the substrate can be determined in a real time manner.

摘要翻译： 提供半导体封装及其制造方法。 该方法包括提供具有识别点的基板和具有开口的散热器，并且将散热器放置在基板上，识别点通过开口露出; 使用检查系统通过开口检查识别点，以确保散热器被放置在基板上的预定位置; 以及通过粘合剂将散热器附接到基板。 通过上述半导体封装和方法，不需要在衬底中形成定位孔，从而避免对半导体封装的电路布局和可靠性的任何不利影响，并且散热片相对于衬底的任何位置偏移可以 以实时的方式确定。

公开(公告)号：US20070164386A1

公开(公告)日：2007-07-19

申请号：US11648045

申请日：2006-12-28

申请人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

发明人： Cheng-Yi Chang ,  Chien-Ping Huang ,  Yu-Po Wang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L31/0203 ,  H01L21/56

CPC分类号： H01L27/14687 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/01033 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2224/85 ,  H01L2924/00014

摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.

摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。

公开(公告)号：US20070138632A1

公开(公告)日：2007-06-21

申请号：US11642439

申请日：2006-12-19

申请人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Fang-Lin Tsai ,  Ho-Yi Tsai ,  Chih-Ming Huang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34

CPC分类号： H05K3/3452 ,  H05K3/284 ,  H05K3/303 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic carrier board and a package structure thereof are provided. The electronic carrier board includes a carrier, at least one pair of bond pads formed on the carrier, and a protective layer covering the carrier. An opening is formed in the protective layer to expose at least three sides of each of the paired bond pads. The protective layer includes at least one independent residual portion located in the opening and between the paired bond pads, such that an electronic component is mounted on the independent residual portion and electrically connected to the bond pads. A groove without a dead space is formed between the electronic component and the carrier, such that a molding compound for encapsulating the electronic component can flow through the groove to fill the opening and a space under the electronic component and encapsulate the at least three sides of each of the bond pads.

摘要翻译： 提供电子载体板及其封装结构。 电子载板包括载体，形成在载体上的至少一对接合焊盘和覆盖载体的保护层。 在保护层中形成开口以暴露每个配对接合焊盘的至少三个侧面。 保护层包括至少一个独立的残留部分，位于开口内和成对的接合焊盘之间，使得电子部件安装在独立的残留部分上并电连接到接合焊盘。 在电子部件和载体之间形成没有死空间的凹槽，使得用于封装电子部件的模制化合物可以流过凹槽以填充开口和电子部件下方的空间，并将至少三个侧面 每个接合垫。

公开(公告)号：US20060137420A1

公开(公告)日：2006-06-29

申请号：US11319110

申请日：2005-12-27

申请人： Ru- Sheng Liu ,  Han-Lung Tsai ,  Cheng-Hsu Hsiao

发明人： Ru- Sheng Liu ,  Han-Lung Tsai ,  Cheng-Hsu Hsiao

IPC分类号： B21C23/00

CPC分类号： H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/32145 ,  H01L2924/3511

摘要： A process applied to grinding, dicing, and/or stacking semiconductors is disclosed. One feature of the process is that after transparent material is stuck on its active surface, a semiconductor is ground from another surface thereof to become thinner, then the semiconductor is diced, by taking advantage of transparency of the transparent material, from its active surface, to obtain at least one smaller semiconductor unit such as die/dice or chip(s). Another feature is that the transparent material remains sticking to the active surface of the die by an adhesion layer until the die is attached to a carrier or another die, and then the transparent material and the adhesion layer are removed by taking advantage of a function of the adhesion layer: receiving a ray to lose adhesion between it and the active surface. Preferably the ray reaches the adhesion layer via the transparent material stuck on the active surface of the die.

摘要翻译： 公开了一种应用于研磨，切割和/或堆叠半导体的方法。 该方法的一个特征是，在透明材料粘附在其有效表面上之后，从其另一表面研磨半导体以变薄，然后通过利用透明材料的透明度从其活性表面切割半导体， 以获得至少一个较小的半导体单元，例如芯片/芯片或芯片。 另一个特征是透明材料通过粘合层保持粘附到模具的活性表面，直到模具附接到载体或另一个模具，然后通过利用透明材料和粘合层的功能去除透明材料和粘附层 粘合层：接收光线以失去其与活性表面之间的粘附。 优选地，光线通过粘附在模具的有效表面上的透明材料到达粘附层。

公开(公告)号：US20060118944A1

公开(公告)日：2006-06-08

申请号：US11338056

申请日：2006-01-23

申请人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/053

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor package having conductive bumps on a chip and a fabrication method thereof are provided. A plurality of the conductive bumps are deposited respectively on bond pads of the chip. An encapsulation body encapsulates the chip and conductive bumps while exposing ends of the conductive bumps. A plurality of conductive traces are formed on the encapsulation body and electrically connected to the exposed ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with openings for exposing predetermined portions of the conductive traces. The exposed portions of the conductive traces are connected to a plurality of solder balls respectively. The conductive bumps on the bond pads of the chip allow easy positional recognition of the bond pads, making the conductive traces well electrically connected to the bond pads through the conductive bumps and assuring the quality and reliability of the semiconductor package.

摘要翻译： 提供了一种在芯片上具有导电凸块的半导体封装及其制造方法。 多个导电凸块分别沉积在芯片的接合焊盘上。 封装体封装芯片和导电凸块，同时暴露导电凸块的端部。 多个导电迹线形成在封装主体上并与导电凸块的暴露端电连接。 焊接掩模层施加在导电迹线上并形成有用于暴露导电迹线的预定部分的开口。 导电迹线的暴露部分分别连接到多个焊球。 芯片的接合焊盘上的导电凸块允许接合焊盘的容易的位置识别，使得导电迹线通过导电凸块良好地电连接到接合焊盘，并确保半导体封装的质量和可靠性。

公开(公告)号：US06919630B2

公开(公告)日：2005-07-19

申请号：US10437557

申请日：2003-05-13

申请人： Cheng-Hsu Hsiao

发明人： Cheng-Hsu Hsiao

IPC分类号： H01L21/56 ,  H01L23/10 ,  H01L23/36 ,  H01L23/34

CPC分类号： H01L23/36 ,  H01L21/563 ,  H01L23/10 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16315 ,  Y10S257/93 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor package with an embedded heat spreader (EHS) is proposed, which can be used for the fabrication of a semiconductor package, such as a FCBGA (Flip-Chip Ball Grid Array) package with a heat spreader, and which is characterized by the provision of a plurality of recessed portions, either in the heat spreader attach area of the substrate, or in the support portion of the heat spreader, or in both, so as to allow the fill-in portions of the adhesive layer that are filled in these recessed portions to form anchor structures to benefit the heat spreader against crosswise shear stress. Moreover, since the provision of these recessed portions allows an increase in the contact area of the adhesive layer with the substrate and the heat spreader, it can help increase the adhesive strength to provide the heat spreader more securely adhered in position on the substrate.

摘要翻译： 提出了具有嵌入式散热器（EHS）的半导体封装，其可用于制造半导体封装，例如具有散热器的FCBGA（倒装芯片球栅阵列）封装，其特征在于： 在基板的散热器安装区域或散热器的支撑部分中或在两者中设置多个凹部，以便允许填充的粘合剂层的填充部分 这些凹陷部分形成锚结构，以便使散热器免受横向剪切应力的影响。 此外，由于设置这些凹部可以增加粘合剂层与基材和散热器的接触面积，所以可以有助于提高粘合强度，从而使散热器更牢固地粘附在基板上的适当位置。