摘要:
A method of forming a pattern in at least one device layer in or on a substrate comprises: coating the device layer with a first photoresist layer; exposing the first photoresist using a first mask; developing the first photoresist layer to form a first pattern on the substrate; coating the substrate with a protection layer; treating the protection layer to cause a change therein where it is in contact with the first photoresist, to render the changed protection layer substantially immune to a subsequent exposure and/or developing step; coating the substrate with a second photoresist layer; exposing the second photoresist layer using a second mask; and developing the second photoresist layer to form a second pattern on the substrate without significantly affecting the first pattern in the first photoresist layer, wherein the first and second patterns together define interspersed features having a spartial frequency greater than that of the features defined in each of the first and second patterns separately. The process has particular utility in defining source, drain and fin features of finFET devices with a smaller feature size than otherwise achievable with the prevailing lithography tools.
摘要:
The invention relates to a method of determining a parameter relating to image blur in an imaging system (IS) comprising the step of illuminating an object having a test pattern (MTP) by means of the imaging system (IS), thereby forming an image of the test pattern. The test pattern (MTP) has a size smaller than the resolution of the imaging system (IS), which makes the image of the test pattern independent of illuminator aberrations. The test pattern (MTP) is an isolated pattern, which causes the image to be free of optical proximity effects. The image is blurred due to stochastic fluctuations in the imaging system and/or in the detector detecting the blurred image. The parameter relating to the image blur is determined from a parameter relating to the shape of the blurred image. According to the invention, resist diffusion and/or focus noise may be characterized. In the method of designing a mask, the parameter relating to the image blur due to diffusion in the resist is taken into account. The computer program according to the invention is able to execute the step of determining the parameter relating to the image blur from a parameter relating to a shape of the blurred image.
摘要:
A lithographic apparatus includes a radiation system that provides a beam of radiation, and a support structure that supports a patterning structure. The patterning structure is configured to pattern the beam of radiation according to a desired pattern. The apparatus also includes a substrate support that supports a substrate, and a projection system that projects the patterned beam onto a target portion of the substrate. The projection system includes an optical element that has a beam exit area through each of which the patterned beam passes. The apparatus further includes a fluid cleaning system that cleans a fluid to be introduced into a region in between the optical element and the substrate. The fluid cleaning system includes a fluid inlet, a fluid outlet, and a cleaning zone disposed between the inlet and outlet. The cleaning zone includes a nucleated surface provided with a plurality of nucleation sites.
摘要:
A method of irradiating to pattern a photosensitive layer such as a resist (L2) immersed in a fluid (L3), involves applying a removable transparent layer (L4, L5), projecting the radiation onto the resist through the immersion fluid and through the transparent layer, such that imperfections in the fluid are out of focus as projected on the surface, and subsequently removing the transparent layer. The transparent layer can help distance such imperfections from the focus of the radiation on the surface and so can reduce or eliminate shadowing. Hence the irradiation can be more complete, and defects reduced. It can be particularly effective for imperfections in the form of small bubbles or particles in the immersion fluid especially at the fluid/surface interface for example. The radiation can be for any purpose including inspection, processing, patterning and so on. The removal of the transparent layer can be combined with a step of developing the resist layer.
摘要:
The performance of an illumination system in, for example, a lithographic projection apparatus can be measured accurately and reliably by means of a test object (55) comprising at least one Fresnel zone lens (30) and an associated reference mark, preferably a ring (40). By superposed imaging of these and detecting and evaluating the composed image (56), telecentricity errors and aberrations of the illumination can be measured.
摘要:
For lithographically manufacturing a device with a very high density, a design mask pattern (120) is distributed on a number of sub-patterns (120a, 120b, 120c) by means of a new method. The sub-patterns do not comprise “forbidden” structures (135) and can be transferred by conventional apparatus to a substrate layer to be patterned. For the transfer, a new stack of layers is used, which comprise a pair of a processing layer (22; 26) and an inorganic anti-reflection layer (24; 28) for each sub-pattern. After a first processing layer (26) has been patterned with a first sub-pattern, it is coated with a new resist layer (30) which is exposed with a second sub-pattern, and a second processing layer (22) under the first processing layer is processed with the second sub-pattern.
摘要:
The performance of a scanning electron microscope (SEM) (10) is determined by scanning, with this SEM, porous silicon surface areas (PSF, PSC) each having a different average pore size, calculating the Fourier transform spectra (Fc) of the images of the surface areas and extrapolating the resolution (R) at a zero signal-to-noise ratio (SNR) from the width (W(1/e)), the signal amplitude (Sa) and the noise offset (NL) of the spectra. A test sample provided with the different surface areas is obtained by anodizing a silicon substrate (Su) at a constant electric current, while continuously decreasing the substrate area exposed to the etching electrolyte (El).
摘要:
A lithographic apparatus is disclosed. The apparatus includes a radiation system that provides a beam of radiation, and a support structure that supports a patterning structure. The patterning structure is configured to pattern the beam of radiation according to a desired pattern. The apparatus also includes a substrate support that supports a substrate, and a projection system that projects the patterned beam onto a target portion of the substrate. The projection system includes an optical element that has a beam entry area and an optical element that has a beam exit area through each of which the patterned beam passes. The apparatus further includes a nucleated surface that is associated with the projection system on which a plurality of nucleation sites are provided. The surface is disposed away from at least one of the beam entry area and the beam exit area.
摘要:
A method is described for imaging, by means of projection radiation, a phase-shifting mask pattern on a substrate for the purpose of configuring device features in the substrate. By using a mask pattern comprising mask features constituted by a phase transition (22) and two sub-resolution assist features (40,41), arranged symmetrically with respect to the phase transition and having a mutual distance (p), device features having a wide variety of widths can be obtained by varying only the mutual distance.
摘要:
A differential interferometer system for measuring the mutual positions and movements of a first object (WH) and a second object (MH). The system comprises a first interferometer unit (1, 2, 3, 4) having a first measuring reflector (RW) and a second interferometer unit (5, 6, 7, 8) having a second measuring reflector (RM). Since a measuring beam (b.sub.m) passes through both the first and the second interferometer unit and is reflected by both the first and the second measuring reflector, and since the measuring beam and the reference beam (b.sub.r) traverse the same path at least between the two interferometer units, accurate measurements can be preformed very rapidly. The interferometer system may be used to great advantage in a step-and-scan-lithographic projection apparatus.