公开(公告)号：US06274325B1

公开(公告)日：2001-08-14

申请号：US08314432

申请日：1994-09-28

申请人： Arno Deger ,  François Guillot ,  Michael Berger ,  Dittmar Schlieper

发明人： Arno Deger ,  François Guillot ,  Michael Berger ,  Dittmar Schlieper

IPC分类号： G01N3353

CPC分类号： G01N33/6857 ,  G01N33/54306

摘要： The invention concerns a homogeneous immunoassay based on agglutination using an Fab′-biotin material and agglutinatable particles which carry streptavidin or avidin. The invention also concerns the Fab′-biotin which is bound or linked via linkage groups to a label compound which can electrochemiluminescence and the particles having avidin or streptavidin on their surface are magnetic.

摘要翻译： 本发明涉及使用Fab'-生物素材料和携带链霉亲和素或抗生物素蛋白的可凝集颗粒的凝集的均匀免疫测定。 本发明还涉及通过连接基团与能够进行电化学发光的标记化合物结合或连接的Fab'-生物素，并且其表面上具有抗生物素蛋白或链霉亲和素的颗粒是磁性的。

公开(公告)号：US6114450A

公开(公告)日：2000-09-05

申请号：US304610

申请日：1999-05-04

申请人： Krishna Gandhi Sachdev ,  Michael Berger ,  Anson Jay Call ,  Frank Louis Pompeo Jr.

发明人： Krishna Gandhi Sachdev ,  Michael Berger ,  Anson Jay Call ,  Frank Louis Pompeo Jr.

IPC分类号： C08L61/06 ,  C08L61/14 ,  C09D179/04 ,  C09J163/00 ,  C09J163/02 ,  C09J179/04 ,  H01L21/58 ,  C08K3/08 ,  C08L63/00 ,  C08L63/02 ,  C08L79/00

CPC分类号： H01L24/28 ,  C08L61/06 ,  C08L61/14 ,  C09D179/04 ,  C09J163/00 ,  C09J179/04 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351

摘要： An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.

摘要翻译： 用于结合集成电路芯片的芯片的粘合剂包括与四氢吡喃基保护的羟甲基化酚醛树脂或羟甲基化聚（羟基苯乙烯）混合的芳基氰酸酯（酯）树脂和/或二环氧树脂，任选地还含有导电或导热填料。

公开(公告)号：US5948057A

公开(公告)日：1999-09-07

申请号：US805454

申请日：1997-02-25

申请人： Michael Berger ,  Alexander Jarczyk

发明人： Michael Berger ,  Alexander Jarczyk

IPC分类号： G06F17/30 ,  G06Q10/00 ,  G06F17/00 ,  G06F17/24

CPC分类号： G06Q10/10 ,  G06F17/30194 ,  Y10S707/99952 ,  Y10S707/99953

摘要： In a method for the computer-supported matching of a number of data copies of a stored data file stored in at least one computer, in the reintegration of a number of data copies that were changed during decoupled work phases by users of a shared work environment, and thus exhibit inconsistencies, the reintegration is conducted so that the number of matchings is reduced on the basis of protocol data files.

摘要翻译： 在用于计算机支持的存储在至少一台计算机中的存储数据文件的数据副本的匹配的方法中，在由共享工作环境的用户在解耦工作阶段期间改变的多个数据副本的重新集成 ，因此表现出不一致之处，进行重新整合，以便根据协议数据文件减少匹配次数。

公开(公告)号：US5700581A

公开(公告)日：1997-12-23

申请号：US670463

申请日：1996-06-26

申请人： Krishna G. Sachdev ,  Michael Berger ,  Mark S. Chace

发明人： Krishna G. Sachdev ,  Michael Berger ,  Mark S. Chace

IPC分类号： C08G59/30 ,  C08G59/62 ,  C09J163/00 ,  H01L21/52 ,  H01L21/58 ,  B32B9/04

CPC分类号： H01L24/83 ,  C08G59/306 ,  C09J163/00 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15787 ,  Y10T428/31663

摘要： The present invention discloses chip (die) bond adhesive formulations preferably comprising a siloxane containing epoxide preferably a diglycidyl ether derivative, an anhydride curing additive which is soluble in the epoxide without the use of a solvent, and, optionally comprising, and oligomeric/polymeric co-additive of the type poly(alkylacrylate or -methacrylate), in conjunction with thermal and electrically conductive fillers and conventional co-catalysts used for curing epoxy systems to provide reworkable epoxy adhesives. Also disclosed are adhesive formulations comprising a siloxane containing epoxide and a hydroxybenzophenone curing additive which is soluble in the epoxide without the use of a solvent. The chips can be bonded to the substrate by conventional heating and curing techniques. With epoxy adhesive compositions comprising polyacrylate additives, the die bonded assembly can be reworked by heating the assembly to about 180.degree. C. to 250.degree. C. removing the chip, and rebonding a new chip on the same surface without any effect on the shear strength for die bonded on to gold, copper, silver or a ceramic die pad. Die shear strength using the adhesives remains unchanged when exposed to thermal shock involving -65.degree. C. to +150.degree. C. excursions, and HAST test at 130.degree. C. /85 percent RH (Relative Humidity) or 85.degree. C./85% RH. A method is also provided for using the adhesives to make electronic component assemblies.

摘要翻译： 本发明公开了优选包含环氧化物的硅氧烷优选二缩水甘油醚衍生物的芯片（模具）粘合剂制剂，可溶于环氧化物而不使用溶剂的酸酐固化添加剂，以及任选包含低聚物/聚合物共聚物 （丙烯酸烷基酯或甲基丙烯酸烷基酯），以及用于固化环氧树脂体系以提供可再加工的环氧粘合剂的热导电填料和常规助催化剂。 还公开了包含含有环氧化物的硅氧烷和可溶于环氧化物而不使用溶剂的羟基二苯甲酮固化添加剂的粘合剂制剂。 芯片可以通过常规的加热和固化技术结合到基底上。 使用包含聚丙烯酸酯添加剂的环氧粘合剂组合物，可以通过将组件加热至约180℃至250℃来重新加工模具接合组件，去除芯片，并在同一表面上重新粘接新的芯片，而不影响剪切强度 用于裸焊接在金，铜，银或陶瓷芯片上。 当暴露于涉及-65℃至+ 150℃偏移的热冲击时，使用粘合剂的模头剪切强度保持不变，并且在130℃/ 85％RH（相对湿度）或85℃/ 85℃下进行HAST测试 ％RH。 还提供了一种使用粘合剂来制造电子部件组件的方法。

公开(公告)号：US5493076A

公开(公告)日：1996-02-20

申请号：US378411

申请日：1995-01-26

申请人： James M. Levite ,  Michael Berger ,  Richard L. Chartrand ,  Mary A. Emmett ,  Raymond A. Jackson ,  James J. Petrone ,  Richard F. Shortt ,  Roger A. Stinemire

发明人： James M. Levite ,  Michael Berger ,  Richard L. Chartrand ,  Mary A. Emmett ,  Raymond A. Jackson ,  James J. Petrone ,  Richard F. Shortt ,  Roger A. Stinemire

IPC分类号： H01L21/48 ,  H05K1/00 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/22 ,  H05K3/46 ,  H05K1/18

CPC分类号： H05K3/222 ,  H01L21/485 ,  H05K3/225 ,  H05K1/0298 ,  H05K1/095 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/1338 ,  H05K2203/173 ,  H05K3/0017 ,  H05K3/107 ,  H05K3/4685 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49167 ,  Y10T29/49742

摘要： The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed. This invention also provides means for impedance matching of the net that is repaired.

摘要翻译： 本发明一般涉及用于修复半导体衬底的新结构和方法，更具体地，本发明包括通过在缺陷板上提供电线来修复印刷电路板或其它电子衬底的结构和方法。 在具有开放或电气不连续性的基板上，在不连续性已经建立之后，从电气不连续部分横跨的一部分电线被暴露，并且在两个或多个暴露部分之间形成一个或多个沟槽或凹槽 电线。 暴露的电线的两个暴露部分然后通过通过沟槽穿过的电线或使用标准沉积工艺连接，一个或多个金属或材料沉积在开放沟槽中，以提供或恢复电连续性， 去除沉积材料。 本发明还提供了用于修复网络的阻抗匹配的装置。

公开(公告)号：US5288007A

公开(公告)日：1994-02-22

申请号：US996366

申请日：1992-12-23

申请人： Mario J. Interrante ,  Michael Berger ,  Edward F. Handford ,  Eugene Tas

发明人： Mario J. Interrante ,  Michael Berger ,  Edward F. Handford ,  Eugene Tas

IPC分类号： B23K20/10 ,  H01L21/607 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34

CPC分类号： H01L24/78 ,  B23K20/10 ,  H01L24/80 ,  H05K3/225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K2201/10287 ,  H05K2203/0285 ,  H05K2203/049 ,  H05K2203/173 ,  H05K3/328 ,  H05K3/3457

摘要： The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

摘要翻译： 本发明一般涉及用于同时进行电连接的装置和方法，更具体地说，涉及使用新的接合端头配置同时进行这些电连接。 正在公开各种方法和过程以同时在电导线或焊盘之间进行电连接。 电连接通过将导电线放置在必须电连接的一对电线或焊盘上，然后通过使用特殊尖端，导电线的两端同时固定到两条导电线或 垫

公开(公告)号：US5212063A

公开(公告)日：1993-05-18

申请号：US521121

申请日：1990-05-09

申请人： Beatus Ofenloch-Hahnle ,  Michael Berger ,  Arno Deger

发明人： Beatus Ofenloch-Hahnle ,  Michael Berger ,  Arno Deger

IPC分类号： G01N33/531 ,  G01N33/538 ,  G01N33/543 ,  G01N33/544 ,  G01N33/546 ,  G01N33/548 ,  G01N33/573

CPC分类号： G01N33/54306 ,  G01N33/538 ,  G01N33/54313 ,  G01N33/54393 ,  Y10S435/962 ,  Y10T436/25125

摘要： The present invention provides a process for the detection of analytes in body fluids containing free biotin by immunoassay with the use of biotin conjugates for the labelling, immobilization or complexing of immunological reagents, wherein the biotin present in free form is removed from the immunological reaction by incubating the sample solution with polymer particles consisting of a core and a covering which, as core, contain a polymer which has a plurality of binding sites for biotin and, as covering, at least one layer of protein, peptide, carbohydrate or co-polymer of carbohydrate and amino acids, the layer thickness of the covering being so adjusted that the coating is permeable for the free biotin but not for the biotin conjugate.

摘要翻译： 本发明提供了一种通过免疫测定法检测含有游离生物素的体液中的分析物的方法，其中使用生物素偶联物进行免疫试剂的标记，固定或络合，其中以游离形式存在的生物素通过免疫反应从免疫反应中除去 将样品溶液与由核心和覆盖物组成的聚合物颗粒孵育，所述聚合物颗粒作为核心，其包含聚合物，所述聚合物具有多个用于生物素的结合位点，并且覆盖至少一层蛋白质，肽，碳水化合物或共聚物 的碳水化合物和氨基酸，覆盖层的层厚度被调节，使得涂层对于游离生物素是可渗透的，而不是生物素缀合物。

公开(公告)号：US4386151A

公开(公告)日：1983-05-31

申请号：US400906

申请日：1982-07-22

申请人： Michael Berger ,  Charles H. Byers ,  John J. Magenheimer

发明人： Michael Berger ,  Charles H. Byers ,  John J. Magenheimer

IPC分类号： G03C8/06 ,  G03C5/54 ,  G03C1/48 ,  G03C7/00

CPC分类号： G03C8/06

摘要： A silver diffusion transfer film unit which comprises, in order, a support, a silver precipitating layer, a protective layer comprising chitosan having a copper salt and a polyol selected from the group consisting of glycerol, sorbitol, polyvinyl alcohol, inositol, ethylene glycol, propylene glycol and hydroxyethyl cellulose disposed therein, a release layer, and a photosensitive silver halide layer. In a particularly preferred embodiment, the film unit is an additive color diffusion transfer film unit.

摘要翻译： 银扩散转移膜单元，其依次包括载体，银沉淀层，包含具有铜盐的壳聚糖的保护层和选自甘油，山梨醇，聚乙烯醇，肌醇，乙二醇， 设置在其中的丙二醇和羟乙基纤维素，脱模层和感光卤化银层。 在一个特别优选的实施方案中，胶片单元是一种加色扩散转移膜单元。

公开(公告)号：US4366227A

公开(公告)日：1982-12-28

申请号：US277921

申请日：1981-06-26

申请人： Michael Berger ,  John J. Magenheimer

发明人： Michael Berger ,  John J. Magenheimer

IPC分类号： G03C8/06 ,  G03C8/52 ,  G03C1/40 ,  G03C1/48 ,  G03C1/90 ,  G03C5/54

CPC分类号： G03C8/06 ,  G03C8/52

摘要： A diffusion transfer film unit comprising a support, a photosensitive silver halide emulsion layer, an image-receiving layer and, intermediate said silver halide emulsion layer and said image-receiving layer, a release layer which comprises a water-soluble polymer and a styrenated acid functional acrylic resin. In a preferred embodiment, the film unit is a silver diffusion transfer film unit.

摘要翻译： 扩散转移膜单元，其包含载体，感光卤化银乳剂层，图像接收层，以及所述卤化银乳剂层和所述图像接受层之间的中间层，其包含水溶性聚合物和苯乙烯酸 功能性丙烯酸树脂。 在优选实施例中，膜单元是银扩散转移膜单元。

公开(公告)号：US09208359B2

公开(公告)日：2015-12-08

申请号：US13993048

申请日：2011-12-22

申请人： Michael Berger

发明人： Michael Berger

IPC分类号： G06F21/00 ,  G06F21/88 ,  H04W12/12

CPC分类号： G06F21/88 ,  H04W12/12

摘要： A platform including an always-available theft protection system is described. In one embodiment, the system comprises a power management logic to selectively power elements of the system, a disarming logic to disarm the platform from an armed mode when a disarming command is received via an interface, the interface powered when the platform is in the armed and suspecting modes to detect the disarming command. The system further comprises, in one embodiment, a risk behavior logic to detect a potential problem via a interface, the interface powered when the platform is in the armed mode to detect the potential problem, and a core logic component to provide logic to analyze the potential problem, and to move the platform to a suspecting mode, when the potential problem indicates a theft suspicion, the core logic powered when the risk behavior logic detects the potential problem.

摘要翻译： 描述了包括始终可用的盗窃保护系统的平台。 在一个实施例中，系统包括用于选择性地为系统的元件供电的电源管理逻辑，当经由接口接收到撤防命令时将解除武装的武器解除武装的逻辑，当平台处于武装 和怀疑的方式来检测撤防命令。 该系统在一个实施例中还包括风险行为逻辑，以经由接口来检测潜在的问题，所述接口在所述平台处于所述武装模式中以检测所述潜在问题时供电;以及核心逻辑组件来提供逻辑来分析 潜在的问题，并将平台移动到怀疑模式，当潜在问题表示盗窃嫌疑时，核心逻辑在风险行为逻辑检测到潜在问题时动力。