公开(公告)号：US5193732A

公开(公告)日：1993-03-16

申请号：US771706

申请日：1991-10-04

申请人： Mario J. Interrante ,  Michael Berger ,  Edward F. Handford ,  Eugene Tas

发明人： Mario J. Interrante ,  Michael Berger ,  Edward F. Handford ,  Eugene Tas

IPC分类号： B23K20/10 ,  H01L21/607 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

CPC分类号： H01L24/85 ,  B23K20/10 ,  H01L24/48 ,  H01L24/78 ,  H05K3/225 ,  H01L2224/45109 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/4518 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/8501 ,  H01L2224/85191 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/19041 ,  H05K2201/10287 ,  H05K2203/0285 ,  H05K2203/049 ,  H05K2203/173 ,  H05K3/328 ,  H05K3/3457

摘要： The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

公开(公告)号：US5288007A

公开(公告)日：1994-02-22

申请号：US996366

申请日：1992-12-23

申请人： Mario J. Interrante ,  Michael Berger ,  Edward F. Handford ,  Eugene Tas

发明人： Mario J. Interrante ,  Michael Berger ,  Edward F. Handford ,  Eugene Tas

IPC分类号： B23K20/10 ,  H01L21/607 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34

CPC分类号： H01L24/78 ,  B23K20/10 ,  H01L24/80 ,  H05K3/225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K2201/10287 ,  H05K2203/0285 ,  H05K2203/049 ,  H05K2203/173 ,  H05K3/328 ,  H05K3/3457

摘要： The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

摘要翻译： 本发明一般涉及用于同时进行电连接的装置和方法，更具体地说，涉及使用新的接合端头配置同时进行这些电连接。 正在公开各种方法和过程以同时在电导线或焊盘之间进行电连接。 电连接通过将导电线放置在必须电连接的一对电线或焊盘上，然后通过使用特殊尖端，导电线的两端同时固定到两条导电线或 垫

公开(公告)号：US5543584A

公开(公告)日：1996-08-06

申请号：US843684

申请日：1992-02-28

申请人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

发明人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L23/498 ,  H01L23/52 ,  H01L23/525 ,  H01L23/538 ,  H05K3/00 ,  H05K3/02 ,  H05K3/22 ,  H05K3/34 ,  H05K1/11

CPC分类号： H01L21/76892 ,  H01L23/49866 ,  H01L23/525 ,  H05K3/225 ,  H01L2924/0002 ,  H05K2201/10181 ,  H05K2201/10234 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/34 ,  Y10T29/49124

摘要： The present invention relates generally to a new method of repairing electrical lines, and more particularly to repairing electrical lines having an opening at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.

摘要翻译： 本发明一般涉及一种修复电线的新方法，更具体地说，涉及在装置的适当位置修复具有模块级开口的电线。 使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。 它可以通过将跨接线或熔核固定在整个开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热 焊接并允许焊料熔化并修复开路。 本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。 本发明还允许修复通常不能通过常规技术修复的细线图案。

公开(公告)号：US5153408A

公开(公告)日：1992-10-06

申请号：US607969

申请日：1990-10-31

申请人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

发明人： Edward F. Handford ,  Joseph M. Harvilchuck ,  Mario J. Interrante ,  Raymond A. Jackson ,  Raj N. Master ,  Sudipta K. Ray ,  William E. Sablinski ,  Thomas A. Wassick

IPC分类号： H01L21/3205 ,  H01L21/768 ,  H01L23/498 ,  H01L23/52 ,  H01L23/525 ,  H01L23/538 ,  H05K3/00 ,  H05K3/02 ,  H05K3/22 ,  H05K3/34

CPC分类号： H01L21/76892 ,  H01L23/49866 ,  H01L23/525 ,  H05K3/225 ,  H01L2924/0002 ,  H05K2201/10181 ,  H05K2201/10234 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/0017 ,  H05K3/027 ,  H05K3/34 ,  Y10T29/49124

摘要： The present invention relates generally to a new method of repairing electrical lines, and more praticularly to repairing electrical lines having an open at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the open with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.

摘要翻译： 本发明一般涉及一种修复电线的新方法，并且更具体地涉及在装置就位时修复在模块级具有开路的电线。 使用各种方法和过程来修复电导体线中的这个开路或有缺陷的部分。 它可以通过将跨接线或熔核固定在开口处进行修复，或者可以通过沉积工艺进行修复，该沉积工艺包括但不限于用焊料型材料填充开口或插入焊料涂覆的电线并加热 焊接并允许焊料熔化并修复开路。 本发明的一个特征是在其上附着有诸如引脚，电容器等的诸如芯片和无源部件的有源部件的基板或模块上进行修复的能力。 本发明还允许修复通常不能通过常规技术修复的细线图案。

公开(公告)号：US06287126B1

公开(公告)日：2001-09-11

申请号：US09344887

申请日：1999-06-25

申请人： Michael Berger ,  Lewis S. Goldmann ,  Harvey C. Hamel ,  Mario J. Interrante ,  Marlene W. Moyer ,  Thomas P. Moyer ,  Karl J. Puttlitz, Sr.

发明人： Michael Berger ,  Lewis S. Goldmann ,  Harvey C. Hamel ,  Mario J. Interrante ,  Marlene W. Moyer ,  Thomas P. Moyer ,  Karl J. Puttlitz, Sr.

IPC分类号： H01R1200

CPC分类号： H01R4/64

摘要： An electrical connector arrangement for connecting electronic devices to one another. The connector arrangement uses tensile members and compression members, at least the tensile members of which act to provide both an electrical connection between electronic devices and force over a range of distances to hold the devices together. The tensile members provides tensile force acting to hold the electronic devices together while the compression members provide an opposing compressive force over a range of distances which balances the tensile force to thereby form a cellforce connector used to connect an array of electrical contact points on one electronic device to a corresponding array of electrical contact points on another electronic device.

摘要翻译： 一种用于将电子设备彼此连接的电连接器装置。 连接器装置使用拉伸构件和压缩构件，其至少其拉伸构件用于提供电子装置之间的电连接并在一定距离范围内施力以将装置保持在一起。 拉伸构件提供作用以将电子装置保持在一起的张力，同时压缩构件在一定距离范围内提供相反的压缩力，其平衡拉伸力从而形成用于连接一个电子装置上的电接触点阵列的电池单元连接器 设备到另一电子设备上的对应的电接触点阵列。

公开(公告)号：US20080206960A1

公开(公告)日：2008-08-28

申请号：US11679226

申请日：2007-02-27

申请人： Bing Dang ,  Mario J. Interrante ,  John Knickerbocker ,  Edmund J. Sprogis

发明人： Bing Dang ,  Mario J. Interrante ,  John Knickerbocker ,  Edmund J. Sprogis

IPC分类号： H01L21/30

CPC分类号： G01R31/2898 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552

摘要： A method for removing a thinned silicon structure from a substrate, the method includes selecting the silicon structure with soldered connections for removal; applying a silicon structure removal device to the silicon structure and the substrate, wherein the silicon structure removal device comprises a pre-determined temperature setpoint for actuation within a range from about eighty percent of a melting point of the soldered connections to about the melting point; heating the silicon structure removal device and the soldered connections of the silicon structure to within the range to actuate the silicon structure removal device; and removing the thinned silicon structure. Also disclosed is a structure including a plurality of layers, at least one layer including a thinned silicon structure and solder coupling the layer to another layer of the plurality; wherein the solder for each layer has a predetermined melting point.

摘要翻译： 一种用于从衬底去除薄化硅结构的方法，所述方法包括用焊接连接选择硅结构以便去除; 将硅结构去除装置施加到所述硅结构和所述衬底，其中所述硅结构去除装置包括用于在所述焊接连接的熔点的约80％到约熔点范围内的致动的预定温度设定点; 将硅结构去除装置和硅结构的焊接连接加热到致动硅结构去除装置的范围内; 并去除薄的硅结构。 还公开了包括多个层的结构，至少一个层，包括薄化硅结构和将该层耦合到多个层中的另一层的焊料; 其中每层的焊料具有预定的熔点。

公开(公告)号：US06574859B2

公开(公告)日：2003-06-10

申请号：US09785787

申请日：2001-02-16

申请人： Shaji Farooq ,  Mario J. Interrante ,  Sudipta K. Ray ,  William E. Sablinski

发明人： Shaji Farooq ,  Mario J. Interrante ,  Sudipta K. Ray ,  William E. Sablinski

IPC分类号： H05K336

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

摘要： An interconnection structure and methods for making and detaching the same are presented for column and ball grid array (CGA and BGA) structures by using a transient solder paste on the electronic module side of the interconnection that includes fine metal powder additives to increase the melting point of the solder bond. The metal powder additives change the composition of the solder bond such that the transient melting solder composition does not completely melt at temperatures below +230° C. and detach from the electronic module during subsequent ref lows. A Pb—Sn eutectic with a lower melting point is used on the opposite end of the interconnection structure. In the first method a transient melting solder paste is applied to the I/O pad of an electronic module by means of a screening mask. Interconnect structures are then bonded to the I/O pad. In a second method, solder preforms in a composition of the transient melting solder paste are wetted onto electronic module I/O pads and interconnect columns or balls are then bonded. Detachment of an electronic module from a circuit card can then be performed by heating the circuit card assembly to a temperature above the eutectic solder melting point, but below the transient solder joint melting point.

摘要翻译： 通过使用包括细金属粉末添加剂的电子模块侧的瞬态焊膏来提供柱和球栅阵列（CGA和BGA）结构的互连结构及其分离方法，以增加熔点 的焊点。 金属粉末添加剂改变焊料接合的组成，使得瞬态熔融焊料组合物在低于+ 230℃的温度下不会完全熔化，并且在后续参考低温期间与电子模块分离。 在互连结构的另一端使用具有较低熔点的Pb-Sn共晶体。在第一种方法中，通过掩模掩模将瞬态熔融焊膏施加到电子模块的I / O焊盘。 然后将互连结构结合到I / O焊盘。在第二种方法中，将瞬态熔融焊膏的组成中的焊料预成型件润湿到电子模块I / O焊盘上，然后连接互连柱或焊球。连接电子 然后可以通过将电路卡组件加热到高于共熔焊料熔点但低于瞬态焊点熔点的温度来执行电路卡的模块。

公开(公告)号：US06518674B2

公开(公告)日：2003-02-11

申请号：US09805596

申请日：2001-03-13

申请人： Mario J. Interrante ,  Thomas E. Lombardi ,  Frank L. Pompeo ,  William E. Sablinski

发明人： Mario J. Interrante ,  Thomas E. Lombardi ,  Frank L. Pompeo ,  William E. Sablinski

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： A temporary attach article of a first component to a second component which includes a first component having a first volume of a fusible material; a second component having a second volume of fusible material; and the first and second components being joined together through the first and second volumes of fusible material, wherein the first volume of fusible material has a melting point higher than a melting point of the second volume of fusible material so that the first and second components may be joined together without melting of the first volume of fusible material and wherein the second volume of fusible material is 5 to 20% of the first volume of fusible material. Also disclosed is a method for temporary attach of devices to an electronic substrate.

摘要翻译： 将第一部件临时附接到第二部件，其包括具有第一容积的可熔材料的第一部件; 具有第二容积的可熔材料的第二部件; 并且所述第一和第二部件通过所述第一和第二体积的可熔材料连接在一起，其中所述第一容积的可熔材料的熔点高于所述第二容积的可熔材料的熔点，使得所述第一和第二部件可以 在不熔化第一体积的可熔材料的情况下连接在一起，并且其中第二体积的可熔材料是第一体积的可熔材料的5至20％。 还公开了一种用于将设备临时附接到电子基板的方法。

公开(公告)号：US5945735A

公开(公告)日：1999-08-31

申请号：US797678

申请日：1997-01-31

申请人： Laertis Economikos ,  Lester Wynn Herron ,  Mario J. Interrante

发明人： Laertis Economikos ,  Lester Wynn Herron ,  Mario J. Interrante

IPC分类号： H01L23/02 ,  H01L23/10 ,  H01L23/08 ,  H01L23/48

CPC分类号： H01L23/10 ,  H01L2224/16 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/163

摘要： The present invention relates generally to a new process for hermetically sealing of a high thermally conductive substrate, such as, an aluminum nitride substrate, using a low thermally conductive interposer and structure thereof. More particularly, the invention encompasses a hermetic cap which is secured to an aluminum nitride substrate using the novel thermal interposer. The novel thermal interposer basically comprises of layers of relatively high thermal conductive metallic materials sandwiching a core layer of low thermal conductive metallic material.

公开(公告)号：US5478009A

公开(公告)日：1995-12-26

申请号：US288521

申请日：1994-08-10

申请人： Mario J. Interrante ,  Laertis Economikos

发明人： Mario J. Interrante ,  Laertis Economikos

IPC分类号： B26F3/00 ,  B23K1/018 ,  B23K1/06 ,  B23K3/02 ,  H01L21/304 ,  H01L21/60 ,  H05K3/34 ,  H01L21/00

CPC分类号： B23K1/018 ,  B23K1/06 ,  Y10T225/10 ,  Y10T225/30

摘要： A solder ball removal tool uses ultrasonic vibrations to remove specific solder balls from high density chips, substrate solder ball terminal connections, card or board solder ball connections, or other solder ball array for the purpose of customizing the electrical functionality of a module. The tool also allows for the removal of damaged or defective solder balls for the purpose of replacement with defect free solder balls.

摘要翻译： 焊球去除工具使用超声波振动来从高密度芯片，衬底焊球端子连接，卡或板焊球连接或其它焊球阵列去除特定的焊球，以便定制模块的电功能。 该工具还允许去除损坏或有缺陷的焊球，以更换无缺陷焊球。