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公开(公告)号:US20240039536A1
公开(公告)日:2024-02-01
申请号:US18347376
申请日:2023-07-05
Applicant: Rambus Inc.
Inventor: Ian Shaeffer
IPC: H03K19/00 , G11C5/06 , G11C7/10 , H03K19/0175 , G11C11/4063 , G11C11/413 , G11C16/06 , G11C5/14
CPC classification number: H03K19/0005 , G11C5/063 , G11C7/1084 , H03K19/017545 , G11C11/4063 , G11C11/413 , G11C16/06 , G11C5/14
Abstract: Local on-die termination controllers for effecting termination of a high-speed signaling links simultaneously engage on-die termination structures within multiple integrated-circuit memory devices disposed on the same memory module, and/or within the same integrated-circuit package, and coupled to the high-speed signaling link. A termination control bus is coupled to memory devices on a module, and provides for peer-to-peer communication of termination control signals.
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公开(公告)号:US20230410880A1
公开(公告)日:2023-12-21
申请号:US18209976
申请日:2023-06-14
Applicant: Rambus Inc.
Inventor: Thomas J. Giovannini , Alok Gupta , Ian Shaeffer , Steven C. Woo
IPC: G11C11/4076 , G06F3/06 , G06F5/06 , G06F1/08 , G11C7/10 , G11C29/02 , G06F13/16 , G06F12/06 , G11C11/409
CPC classification number: G11C11/4076 , G06F3/0629 , G06F5/06 , G06F1/08 , G11C7/1087 , G11C7/1093 , G11C29/023 , G11C29/028 , G11C7/1078 , G06F13/1689 , G06F3/0634 , G06F12/0646 , G11C11/409 , G11C2207/2254 , G11C11/4096
Abstract: A system that calibrates timing relationships between signals involved in performing write operations is described. This system includes a memory controller which is coupled to a set of memory chips, wherein each memory chip includes a phase detector configured to calibrate a phase relationship between a data-strobe signal and a clock signal received at the memory chip from the memory controller during a write operation. Furthermore, the memory controller is configured to perform one or more write-read-validate operations to calibrate a clock-cycle relationship between the data-strobe signal and the clock signal, wherein the write-read-validate operations involve varying a delay on the data-strobe signal relative to the clock signal by a multiple of a clock period.
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公开(公告)号:US11816047B2
公开(公告)日:2023-11-14
申请号:US17191469
申请日:2021-03-03
Applicant: Rambus Inc.
Inventor: Ian Shaeffer , Thomas J. Giovannini
CPC classification number: G06F13/1689 , G06F12/00 , G11C7/10 , G11C7/1066 , G11C7/1093 , G11C7/222 , G11C2207/2254
Abstract: Apparatus and methods for operation of a memory controller, memory device and system are described. During operation, the memory controller transmits a read command which specifies that a memory device output data accessed from a memory core. This read command contains information which specifies whether the memory device is to commence outputting of a timing reference signal prior to commencing outputting of the data. The memory controller receives the timing reference signal if the information specified that the memory device output the timing reference signal. The memory controller subsequently samples the data output from the memory device based on information provided by the timing reference signal output from the memory device.
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公开(公告)号:US11742855B2
公开(公告)日:2023-08-29
申请号:US17527511
申请日:2021-11-16
Applicant: Rambus Inc.
Inventor: Ian Shaeffer
IPC: H03K19/00 , G11C5/06 , G11C7/10 , H03K19/0175 , G11C11/4063 , G11C11/413 , G11C16/06 , G11C5/14
CPC classification number: H03K19/0005 , G11C5/063 , G11C5/14 , G11C7/1084 , G11C11/4063 , G11C11/413 , G11C16/06 , H03K19/017545
Abstract: Local on-die termination controllers for effecting termination of a high-speed signaling links simultaneously engage on-die termination structures within multiple integrated-circuit memory devices disposed on the same memory module, and/or within the same integrated-circuit package, and coupled to the high-speed signaling link. A termination control bus is coupled to memory devices on a module, and provides for peer-to-peer communication of termination control signals.
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公开(公告)号:US20220336008A1
公开(公告)日:2022-10-20
申请号:US17717632
申请日:2022-04-11
Applicant: Rambus Inc.
Inventor: Ian Shaeffer , Ely Tsern , Craig Hampel
IPC: G11C11/4093 , G06F13/16 , G06F13/40 , G11C5/02 , G11C5/04 , G11C5/06 , G11C7/10 , G11C7/22 , G11C11/4076 , G11C11/4091 , G11C11/4094 , G11C11/4096 , H01L25/065 , H01L25/10
Abstract: Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrated circuit buffer device using separate segmented (or point-to-point link) signal paths in response to control/address information provided from the integrated circuit buffer device to the plurality of integrated circuit buffer devices using a single fly-by (or bus) signal path. An integrated circuit buffer device enables configurable effective memory organization of the plurality of integrated circuit memory devices. The memory organization represented by the integrated circuit buffer device to a memory controller may be different than the actual memory organization behind or coupled to the integrated circuit buffer device. The buffer device segments and merges the data transferred between the memory controller that expects a particular memory organization and actual memory organization.
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公开(公告)号:US11474957B2
公开(公告)日:2022-10-18
申请号:US17022746
申请日:2020-09-16
Applicant: Rambus Inc.
Inventor: Ian Shaeffer , Frederick A. Ware
Abstract: A multi-rank memory system in which calibration operations are performed between a memory controller and one rank of memory while data is transferred between the controller and other ranks of memory. A memory controller performs a calibration operation that calibrates parameters pertaining to transmission of data via a first data bus between the memory controller and a memory device in a first rank of memory. While the controller performs the calibration operation, the controller also transfers data with a memory device in a second rank of memory via a second data bus.
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47.
公开(公告)号:US11302371B2
公开(公告)日:2022-04-12
申请号:US16027336
申请日:2018-07-04
Applicant: Rambus Inc.
Inventor: Ian Shaeffer
Abstract: Described are memory modules that support dynamic point-to-point extensibility using fixed-width memory die. The memory modules include data-width translators that allow the modules to vary the effective width of their external memory interfaces without varying the width of the internal memory interfaces extending between the translators and associated fixed-width dies. The data-width translators use a data-mask signal to selectively prevent memory accesses to subsets of physical addresses. This data masking divides the physical address locations into two or more temporal subsets of the physical address locations, effectively increasing the number of uniquely addressable locations in a given module. Reading temporal addresses in write order can introduce undesirable read latency. Some embodiments reorder read data to reduce this latency.
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公开(公告)号:US11211105B2
公开(公告)日:2021-12-28
申请号:US16987157
申请日:2020-08-06
Applicant: Rambus Inc.
Inventor: Ian Shaeffer , Lawrence Lai , Fan Ho , David A. Secker , Wayne S. Richardson , Akash Bansal , Brian S. Leibowitz , Kyung Suk Oh
Abstract: A memory device comprising a programmable command-and-address (CA) interface and/or a programmable data interface is described. In an operational mode, two or more CA interfaces may be active. In another operational mode, at least one, but not all, CA interfaces may be active. In an operational mode, all of the data interfaces may be active. In another operational mode, at least one, but not all, data interfaces may be active. The memory device can include circuitry to select: an operational mode; a sub-mode within an operational mode; one or more CA interfaces as the active CA interface(s); a main CA interface from multiple active CA interfaces; and/or one or more data interfaces as the active data interfaces. The circuitry may perform these selection(s) based on one or more bits in one or more registers and/or one or more signals received on one or more pins.
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公开(公告)号:US20210358535A1
公开(公告)日:2021-11-18
申请号:US17341048
申请日:2021-06-07
Applicant: Rambus Inc.
Inventor: Ian Shaeffer , Lei Luo , Liji Gopalakrishnan
IPC: G11C11/4076 , G11C11/4096 , G11C7/10 , G11C7/20 , G11C7/22 , G11C11/4072 , G11C11/4074 , G06F1/3237 , G06F1/04 , G06F1/3234 , G06F1/08 , G11C11/408
Abstract: An integrated circuit includes a physical layer interface having a control timing domain and a data timing domain, and circuits that enable the control timing domain during a change in power conservation mode in response to a first event, and that enable the data timing domain in response to a second event. The control timing domain can include interface circuits coupled to a command and address path, and the data timing domain can include interface circuits coupled to a data path.
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公开(公告)号:US11150982B2
公开(公告)日:2021-10-19
申请号:US16678159
申请日:2019-11-08
Applicant: Rambus Inc.
Inventor: Ian Shaeffer , Craig E. Hampel
Abstract: Systems and methods are provided for detecting and correcting address errors in a memory system. In the memory system, a memory device generates an error-detection code based on an address transmitted via an address bus and transmits the error-detection code to a memory controller. The memory controller transmits an error indication to the memory device in response to the error-detection code. The error indication causes the memory device to remove the received address and prevent a memory operation.
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