公开(公告)号：US20240234180A1

公开(公告)日：2024-07-11

申请号：US18409400

申请日：2024-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Youngtek Oh ,  Dongkyun Kim ,  Junsik Hwang ,  Minchul Yu

IPC: H01L21/67

CPC classification number: H01L21/67132

Abstract: Provided are a wiper for transferring a micro semiconductor chip and an apparatus for collecting a micro semiconductor chip. The wiper includes an absorber for absorbing a solution used to wet transfer a micro semiconductor chip, and a protective layer coated on the absorber.

公开(公告)号：US20240162403A1

公开(公告)日：2024-05-16

申请号：US18220974

申请日：2023-07-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongkyun KIM ,  Dongho KIM ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/505 ,  H01L2933/0016 ,  H01L2933/0041 ,  H01L2933/0066

Abstract: Provided are a multifold micro emitting device, a display apparatus, a method of manufacturing the multifold micro emitting device, and method of manufacturing the display apparatus. The multifold micro light emitting device includes a plurality of sub light emitting devices, a first electrode configured to apply a voltage to each of the plurality of sub light emitting devices, a second electrode configured to apply a common voltage to the plurality of sub light emitting devices, and a separator configured to separate the plurality of sub light emitting devices from each other, and the plurality of sub light emitting devices are configured as a single chip.

公开(公告)号：US20240079385A1

公开(公告)日：2024-03-07

申请号：US18120166

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonyong PARK ,  Dongkyun KIM ,  Sanghoon SONG ,  Minchul YU ,  Kyungwook HWANG ,  Junsik HWANG

IPC: H01L25/075 ,  H01L33/38

CPC classification number: H01L25/0753 ,  H01L33/38

Abstract: Provided are a micro semiconductor chip transferring structure and a display device employing a display transferring structure. A transferring structure includes a transfer substrate having a plurality of grooves, and a plurality of micro semiconductor chips transferred to the plurality of grooves, respectively, wherein a minimum space between adjacent two of the plurality of micro semiconductor chips transferred to the plurality of grooves is 100% to 200% inclusive of a width of each of the plurality of micro semiconductor chips.

公开(公告)号：US20240006199A1

公开(公告)日：2024-01-04

申请号：US18086992

申请日：2022-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG ,  Dongkyun KIM ,  Dongho KIM ,  Joonyong PARK ,  Minchul YU ,  Seogwoo HONG ,  Junsik HWANG

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/68

CPC classification number: H01L21/67132 ,  H01L21/68 ,  H01L21/67333

Abstract: A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first chip alignment module configured to align the large amount of micro-semiconductor chips in a plurality of grooves, a second chip supply module configured to supply a small amount of micro-semiconductor chips, and a second chip alignment module configured to align the small amount of micro-semiconductor chips.

公开(公告)号：US20230420251A1

公开(公告)日：2023-12-28

申请号：US18086380

申请日：2022-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik HWANG ,  Dongho KIM ,  Joonyong PARK

IPC: H01L21/02 ,  H01L33/00 ,  H01L33/32 ,  C30B25/18 ,  C30B25/04 ,  H01L25/075

CPC classification number: H01L21/02639 ,  H01L33/0066 ,  H01L33/32 ,  H01L33/0093 ,  C30B25/18 ,  C30B25/04 ,  H01L21/0262 ,  H01L21/02403 ,  H01L25/0753

Abstract: A method of manufacturing a semiconductor device, including: forming a membrane forming pattern on a substrate; forming a membrane material layer on the substrate, wherein the membrane material layer covers the membrane forming pattern; forming a membrane having a protruding pattern by crystallizing the membrane material layer; forming a two-dimensional (2D) material pattern on the protruding pattern by growing a 2D material on the membrane; and transferring the 2D material pattern to a transfer substrate

公开(公告)号：US20230275184A1

公开(公告)日：2023-08-31

申请号：US18144566

申请日：2023-05-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junsik HWANG ,  Sungjin KANG ,  Kyungwook HWANG ,  Junhee CHOI

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L33/20 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/382

Abstract: A light-emitting diode (LED) includes a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked, and includes a first electrode pad, a second electrode pad and a third electrode pad disposed on the second semiconductor layer in a direction from a corner of the second semiconductor layer to an opposite corner of the second semiconductor layer. An LED includes a first electrode pad disposed at a center of the LED and in contact with a P-type semiconductor layer and a second electrode pad in contact with an N-type semiconductor layer, wherein the second electrode pad is disposed a maximum distance away from the first electrode pad on the same surface.

公开(公告)号：US20230154769A1

公开(公告)日：2023-05-18

申请号：US17736352

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dongkyun KIM ,  Hyunjoon KIM ,  Joonyong PARK ,  Seogwoo HONG ,  Kyungwook HWANG

IPC: H01L21/67 ,  H01L21/673 ,  B65G51/02

CPC classification number: H01L21/67121 ,  H01L21/67333 ,  B65G51/02

Abstract: A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.

公开(公告)号：US20230064207A1

公开(公告)日：2023-03-02

申请号：US17982347

申请日：2022-11-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon Kim ,  Joonyong Park ,  Seogwoo Hong

IPC: H01L25/16

Abstract: Provided is a method of fabricating a hybrid element substrate, the method including forming a plurality of first elements on a first substrate which is a silicon substrate or a silicon-on-insulator (SOI) substrate; forming a plurality of second elements on a second substrate which has a material different from a material of the first substrate; separating a plurality of second elements from the second substrate; primarily transferring the plurality of second elements onto a transfer substrate comprising a plurality of grooves by a fluidic self-assembly method such that the plurality of second elements are arranged in the plurality of grooves of the transfer substrate, respectively; and secondarily transferring, onto the first substrate, the plurality of second elements transferred onto the transfer substrate such that the plurality of second elements are next to the first elements on the first substrate and spaced apart from each other, or overlap upper portions of the first elements, respectively.

公开(公告)号：US20220262667A1

公开(公告)日：2022-08-18

申请号：US17736676

申请日：2022-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjoon KIM ,  Kyungwook HWANG

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/20 ,  H01L33/62

Abstract: A method of aligning micro light emitting elements includes supplying the plurality of micro light emitting elements on a substrate including a plurality of grooves having different shapes, the plurality of micro light emitting elements being configured to be inserted exclusively and respectively into the plurality of grooves; respectively inserting the plurality of micro light emitting elements into the plurality of grooves; and aligning the plurality of micro light emitting elements, wherein at least one groove of the plurality of grooves has a shape that is different from a shape of a respective micro light emitting element inserted into the at least one groove.

公开(公告)号：US20220246675A1

公开(公告)日：2022-08-04

申请号：US17591934

申请日：2022-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwook HWANG ,  Seogwoo HONG ,  Junsik Hwang ,  Dongho Kim ,  Hyunjoon KIM ,  Joonyong PARK

IPC: H01L27/15 ,  H01L33/38 ,  H01L33/42

Abstract: Provided is a light-emitting device including a plurality of light-emitting cells, each of the plurality of light-emitting cells being configured to independently emit light, a common semiconductor layer provided on the plurality of light-emitting cells, a first electrode provided on the common semiconductor layer, and a plurality of second electrodes provided spaced apart from the first electrode and respectively provided on the plurality of light-emitting cells.