Abstract:
At least one junction diode fabricated in standard CMOS logic processes can be used as program selectors for the memory cells that can be programmed based on the directions of current flow. These memory cells are MRAM, RRAM, CBRAM, or other memory cells that have a resistive element coupled to the P terminal of the first diode and to the N terminal of a second diode. The diodes can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diodes. By applying a high voltage to a resistive element and switching the N terminal of the first diode to a low voltage while disabling the second diode, a current flows through the memory cell can change the resistance into one state. Similarly, by applying a low voltage to a resistive element and switching the P terminal of the second diode to a high voltage while disabling the first diode, a current flows through the memory cell can change the resistance into another state. The P+ active region of the diode can be isolated from the N+ active region in an N well by using dummy MOS gate, SBL, or STI isolations.
Abstract:
Gate oxide breakdown anti-fuse suffers notorious soft breakdown that reduces yield and reliability. This invention discloses circuit and system to enhance electrical field by blocking LDD so that the electrical field is higher and more focused near the drain junction, to make electrical field in the channel more uniform by creating slight conductive or conductive in part or all of the channel, or to neutralize excess carriers piled up in the oxide by applying alternative polarity pulses. The embodiments can be applied in part, all, or any combinations, depending on needs. This invention can be embodied as a 2 T anti-fuse cell having an access and a program MOS with drain area in the program MOS, or 1.5 T anti-fuse cell without any drain in the program MOS. Similarly this invention can also be embodied as a 1 T anti-fuse cell having a portion of the channel made conductive or slightly conductive to merge the access and program MOS into one device with drain area, or 0.5 T anti-fuse cell without any drain.
Abstract:
A programmable resistive memory has a plurality of programmable resistive devices (PRD) and at least one sensing circuit. The at least one of the programmable resistive device can include at least one programmable resistive element (PRE). The sensing circuit can include one PRD unit and a reference unit. Each unit has at least one capacitor to charge to a second supply voltage line and to discharge to the first supply voltage line through the PRE and the reference element, respectively. The capacitors are also coupled to comparators to monitor discharging voltages with respect to a reference voltage. By comparing the time difference when the comparators change their outputs, the magnitude of the PRE resistance with respect to the reference element resistance can be determined and converted into logic states.
Abstract:
A programmable resistive device cell using at least one MOS device as selector can be programmed or read by turning on a source junction diode of the MOS or a channel of the MOS. A programmable resistive device cell can include at least one programmable resistive element and at least one MOS device. The programmable resistive element can be coupled to a first supply voltage line. The MOS can have a source coupled to the programmable resistive element, a bulk coupled to a drain, a drain coupled to a second supply voltage line, and a gate coupled to a third supply voltage line. The programmable resistive element can be configured to be programmable or readable by applying voltages to the first, second, and/or third supply voltage lines to turn on the source junction of the MOS and/or to turn on the channel of the MOS.
Abstract:
A low-pin-count non-volatile (NVM) memory with no more than two control signals that can at least program NVM cells, load data to be programmed into output registers, or read the NVM cells. At least one of the NVM cells has at least one NVM element coupled to at least one selector and to a first supply voltage line. The selector is coupled to a second supply voltage line and having a select signal. At least one of the selected NVM cells can be coupled to at least one output register. No more than two control signals can be used to select the at least one NVM cells in the NVM sequentially for programming the data into the at least one NVM cells or loading data into the at least one output registers controlled by the pulse of the first signal and voltage level and/or timing of the second signal. Programming into the NVM cells, or loading data into output registers, can be determined by the voltage levels of the first to the second supply voltage lines. Reading at least one of the NVM cells can be activated by a third signal or by detecting ramping of the first or the second supply voltage line.
Abstract:
A programmable resistive device cell using at least one MOS device as selector can be programmed or read by turning on a source junction diode of the MOS or a channel of the MOS. A programmable resistive device cell can include at least one programmable resistive element and at least one MOS device. The programmable resistive element can be coupled to a first supply voltage line. The MOS can have a source coupled to the programmable resistive element, a bulk coupled to a drain, a drain coupled to a second supply voltage line, and a gate coupled to a third supply voltage line. The programmable resistive element can be configured to be programmable or readable by applying voltages to the first, second, and/or third supply voltage lines to turn on the source junction of the MOS and/or to turn on the channel of the MOS.
Abstract:
A low-pin-count non-volatile (NVM) memory to be provided in an integrated circuit for a 3D IC to repair defects, trim devices, or adjust parameters is presented here. At least one die in a 3D IC can be built with at least one low-pin-count OTP memory. The low-pin-count OTP memory can be built with a serial interface such as I2C-like or SPI-like of interface. The pins of the low-pin-count OTP in at least one dies can be coupled together to have only one set of low-pin-count bus for external access. With proper device ID, each dies in a 3D IC can be accessed individually for soft programming, programming, erasing, or reading. This technique can improve the manufacture yield, device, circuit, or logic performance or to store configuration parameters for customization after 3D IC are built.
Abstract:
Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for One-Time Programmable (OTP) devices, such as electrical fuses. At least one portion of the electrical fuse can have at least one extended area to accelerate programming. An extended area is an extension of the fuse element beyond contact or via longer than required by design rules. The extended area also has reduced or substantially no current flowing through. The program selector can be at least one MOS. The OTP device can have the at least one OTP element coupled to at least one diode in a memory cell.
Abstract:
Junction diodes or MOS devices fabricated in standard FinFET technologies can be used as program selectors or One-Time Programmable (OTP) element in a programmable resistive device, such as interconnect fuse, contact/via fuse, anti-fuse, or emerging nonvolatile memory such as MRAM, PCRAM, CBRAM, or RRAM. The MOS or diode can be built on at least one fin structure or at least one active region that has at least one first active region and a second active region. The first and the second active regions can be isolated by a dummy MOS gate or silicide block layer (SBL) to construct a diode.
Abstract:
Circuits and systems for concurrently programming a plurality of OTP cells in an OTP memory are disclosed. Each OTP cell can have an electrical fuse element coupled a program selector having a control terminal. The control terminals of a plurality of OTP cells can be coupled to a plurality of local wordlines, and a plurality of the local wordlines can be coupled to at least one global wordline. A plurality of banks of bitlines can have each bitline coupled to a plurality of the OTP cells via the control terminal of the program selector. A plurality of bank selects can enable turning on the wordlines or bitlines in a bank. A plurality of the OTP cells can be configured to be programmable concurrently into a different logic state by applying voltages to at least one selected global wordline and at least one selected bitline to a plurality of the selected OTP cells in a plurality of banks, if a plurality of banks are enabled.