公开(公告)号：US08395904B2

公开(公告)日：2013-03-12

申请号：US12821938

申请日：2010-06-23

Applicant: Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

Inventor： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

IPC: H05K7/00

CPC classification number: H01L24/11 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

Abstract translation: 多芯片模块包括封装基板，第一半导体器件，第二半导体器件和导电凸块。 第一半导体器件被倒装芯片结合到封装衬底。 第一半导体器件包括在其表面上的第一芯片焊盘。 第二半导体器件安装在第一半导体器件上。 第二半导体器件包括面向第一芯片焊盘的第二芯片焊盘。 导电凸块将第一芯片焊盘连接到第二芯片焊盘。 导电凸块包括具有第一扩散速率的第一金属体和具有低于第一扩散速率的第二扩散速率的第二金属体。

公开(公告)号：US08390277B2

公开(公告)日：2013-03-05

申请号：US12908591

申请日：2010-10-20

Applicant: Shuichi Takeuchi

Inventor： Shuichi Takeuchi

IPC: G01B7/30

CPC classification number: H02K29/12 ,  G01D5/2458

Abstract: A rotational angle detector provided with a circular rotary plate integrally rotatable with a rotor of a motor and including a circumferential surface having marks, which are spaced apart by different angular intervals in a circumferential direction. A rotational angle detection unit is arranged along the circumferential direction of the rotary plate to detect a rotational angle of each mark, rotated together with the rotary plate, in a predetermined detection zone. The rotational angle detector determines, when adjacent marks are located in the detection zone, angular intervals between the adjacent marks based on the rotational angle of each mark, specifies a mark that is located in the detection zone based on the determined angular intervals, and detects the rotational angle of the rotor based on the rotational angle of the specified mark rotating in the detection zone.

Abstract translation: 一种旋转角度检测器，其设置有与电动机的转子一体地旋转的圆形旋转板，并且包括具有沿圆周方向以不同角度间隔间隔的标记的圆周表面。 旋转角度检测单元沿着旋转板的圆周方向布置，以检测与旋转板一起旋转的每个标记的旋转角度在预定检测区域中。 当相邻标记位于检测区域中时，旋转角度检测器基于每个标记的旋转角度确定相邻标记之间的角度间隔，基于确定的角度间隔指定位于检测区域中的标记，并且检测 基于在检测区域中旋转的指定标记的旋转角度的转子的旋转角度。

公开(公告)号：US08279738B2

公开(公告)日：2012-10-02

申请号：US12330861

申请日：2008-12-09

Applicant: Satoshi Inoue ,  Daisuke Koreeda ,  Shuichi Takeuchi

Inventor： Satoshi Inoue ,  Daisuke Koreeda ,  Shuichi Takeuchi

IPC: G11B7/00 ,  G11B7/135 ,  G02B23/24

CPC classification number: G11B7/13922 ,  G11B7/0908 ,  G11B7/1374 ,  G11B2007/0006

Abstract: There is provided an objective lens for information recording/reproducing for three types of optical discs, which includes a first area contributing to converging a third light beam onto a record surface of a third optical disc. The first area includes a phase shift structure having refractive surface zones concentrically formed about a predetermined axis. The phase shift structure includes first and second step groups. The first step group is configured such that an optical path length difference ΔOPD1 (nm) given by each step of the first step group to a first light beam satisfies a condition: 2N1+1.10

Abstract translation: 提供了一种用于三种类型的光盘的信息记录/再现的物镜，其包括有助于将第三光束会聚到第三光盘的记录表面上的第一区域。 第一区域包括具有围绕预定轴线同心地形成的折射表面区域的相移结构。 相移结构包括第一和第二步骤组。 第一步骤组被配置为使得第一步骤组的每个步骤给出的第一光束的光程长度差Dgr; OPD1（nm）满足条件：2N1 + 1.10 <|＆Dgr; OPD1 /λ1| <2N1 +1.40，其中N1是整数或零，并且第二步骤组被配置为使得由第二步骤组的每个步骤给予的第一光束的光程长度差Dgr; OPD2（nm）满足条件：2N2 -0.10 <|＆Dgr; OPD2 /λ1| <2N2 + 0.10，其中N2是整数。

公开(公告)号：US08223442B2

公开(公告)日：2012-07-17

申请号：US12021516

申请日：2008-01-29

Applicant: Naoki Yamagata ,  Shuichi Takeuchi

Inventor： Naoki Yamagata ,  Shuichi Takeuchi

IPC: G02B13/18 ,  G02B3/02

CPC classification number: G11B7/13922 ,  G11B7/1374

Abstract: There is provided an objective lens for an optical pick-up. The objective lens is formed to be a single-element plastic lens having a first surface and a second surface. The first surface is configured to have, within an effective diameter, an inflection point at which a second derivative of a sag of the first surface takes a value of 0. Further, the objective lens having a numerical aperture larger than or equal to 0.75.

Abstract translation: 提供了用于光学拾取器的物镜。 物镜形成为具有第一表面和第二表面的单元塑料透镜。 第一表面被配置为在有效直径内具有第一表面的下垂的二次导数取值为0的拐点。此外，具有大于或等于0.75的数值孔径的物镜。

公开(公告)号：US08189448B2

公开(公告)日：2012-05-29

申请号：US12949023

申请日：2010-11-18

Applicant: Daisuke Koreeda ,  Shuichi Takeuchi

Inventor： Daisuke Koreeda ,  Shuichi Takeuchi

IPC: G11B7/00

CPC classification number: G11B7/13922 ,  G02B5/1895 ,  G11B7/1353 ,  G11B7/1374 ,  G11B2007/0006

Abstract: An objective optical system for an optical information recording/reproducing apparatus for recording/reproducing for first, second and third optical discs by selectively using three types of substantially collimated light beams including first, second and third light beams respectively having first, second and third wavelengths, wherein at least one of optical surfaces of the objective optical system comprises a diffraction surface having a diffraction structure, the diffraction surface includes a first region defined by first and second optical path difference functions, a second region defined by at least one type of optical path difference function, and a third region defined by at least one type of optical path difference function, the first region satisfies a condition: −0.15

Abstract translation: 一种用于光信息记录/再现装置的物镜光学系统，用于通过选择性地使用分别具有第一，第二和第三波长的第一，第二和第三光束的三种基本上准直的光束来记录/再现第一，第二和第三光盘 其中所述物镜光学系统的至少一个光学表面包括具有衍射结构的衍射表面，所述衍射表面包括由第一和第二光程差函数限定的第一区域，由至少一种类型的光学 路径差分函数和由至少一种类型的光程差函数定义的第三区域，第一区域满足条件：-0.15

公开(公告)号：US08169075B2

公开(公告)日：2012-05-01

申请号：US12402881

申请日：2009-03-12

Applicant: Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

Inventor： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC: H01L29/40

CPC classification number: B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

Abstract: According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

Abstract translation: 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US07990831B2

公开(公告)日：2011-08-02

申请号：US12146883

申请日：2008-06-26

Applicant: Daisuke Koreeda ,  Shuichi Takeuchi

Inventor： Daisuke Koreeda ,  Shuichi Takeuchi

IPC: G11B7/00

CPC classification number: G11B7/13925 ,  G11B7/1367 ,  G11B7/1369 ,  G11B7/1374 ,  G11B7/13927 ,  G11B2007/0006

Abstract: An optical pickup device includes a first light source emitting first light with a first wavelength, a second light source emitting second light with a second wavelength, a third light source emitting third light with a third wavelength, an objective lens having a step structure, the objective lens being disposed to satisfy predetermined conditions, at least one first coupling lens making the first light and the second light incident onto the objective lens as converged light, a second coupling lens making the third light incident onto the objective lens as diverging light, and a liquid crystal aberration correcting element.

Abstract translation: 一种光学拾取装置包括：发射具有第一波长的第一光的第一光源，发射具有第二波长的第二光的第二光源;发射具有第三波长的第三光的第三光源;具有阶梯结构的物镜; 将物镜设置为满足预定条件，使作为会聚光入射到物镜上的第一光和第二光的至少一个第一耦合透镜，使作为发散光入射到物镜上的第三光的第二耦合透镜，以及 液晶像差校正元件。

公开(公告)号：US07960215B2

公开(公告)日：2011-06-14

申请号：US12559219

申请日：2009-09-14

Applicant: Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

Inventor： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/24 ,  H01L23/28 ,  H01L23/04

CPC classification number: H01L23/16 ,  G06K19/077 ,  G06K19/07728 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2224/16

Abstract: An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

Abstract translation: 电子设备包括：基座; 形成在基座上的导体图案; 以及与导体图形电连接的电路芯片。 该电子设备还包括一个加强件，该加强件设置在基座上以围绕电路芯片，其外形像环形，并且包括沿基座的厚度方向堆叠的层。 层的最下层最靠近基底并且比作为剩余层中的至少一层的层更柔软。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US07880615B2

公开(公告)日：2011-02-01

申请号：US11966375

申请日：2007-12-28

Applicant: Hiroshi Kobayashi ,  Shuichi Takeuchi

Inventor： Hiroshi Kobayashi ,  Shuichi Takeuchi

IPC: G08B13/14 ,  H01L21/00 ,  H01P11/00 ,  B44C1/17 ,  G06K19/06

CPC classification number: G06K19/07749 ,  G06K19/07718 ,  G06K19/0775 ,  H01L21/67144 ,  H01L2224/16 ,  H01L2224/75252 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K1/0393 ,  H05K3/0097 ,  H05K2201/09227 ,  H05K2203/1545 ,  Y10T29/49016 ,  H01L2224/0401

Abstract: A tag manufacturing system includes an antenna forming apparatus which forms multiple antennas in such a way that the antennas are formed in a point-symmetrical arrangement including antenna orientations, on a long base sheet large enough to place multiple bases, and winds the base sheet into a roll body; an IC chip mounting apparatus which pulls the base sheet out of the roll body, mounts an IC chip on each of the antennas formed on the pulled base sheet in an orientation corresponding to an orientation of each antenna, and electrically connects the IC chip with the antenna; and a post-processing apparatus which performs post-processing of the base sheet with the IC chips mounted on the antennas to work up the base sheet into finished RFID tags.

Abstract translation: 标签制造系统包括天线形成装置，其形成多个天线，使得天线以包括天线取向的点对称布置形成，在长的基片上，足以放置多个基底，并将基片卷绕成 卷体; 将基片从辊体拉出的IC芯片安装装置以与每个天线的取向对应的取向安装在形成在拉动基片上的每个天线上的IC芯片，并将IC芯片与 天线; 以及后处理装置，其利用安装在天线上的IC芯片对基片执行后处理，以将基片加工成成品的RFID标签。

公开(公告)号：US07868437B2

公开(公告)日：2011-01-11

申请号：US11936332

申请日：2007-11-07

Applicant: Shuichi Takeuchi

Inventor： Shuichi Takeuchi

IPC: H01L23/02 ,  H01L23/20

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3426 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A mounting structure for an IC tag where an IC chip for mounting (10) is mounted so as to be electrically connected to antenna patterns (44a), (44b). The assembly process that mounts the IC chip for mounting (10) on the antenna patterns (44a), (44b) is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mounting 10 is formed by winding conductive wires (12a), (12b) so as to encircle an outer surface of an IC chip (20) between two opposite edges of the IC chip (20) in a state where the conductive wires (12a), (12b) mechanically contact electrodes formed on the IC chip (20) and are electrically connected to the electrodes, so that the IC chip for mounting (10) is joined to the antenna patterns (44a), (44b) via the conductive wires (12a), (12b).

Abstract translation: 一种用于安装IC芯片（10）的IC标签的安装结构，以电连接到天线图案（44a），（44b）。 将用于安装（10）的IC芯片安装在天线图案（44a），（44b）上的组装过程被简化，这使得可以降低IC标签的制造成本。 用于安装的IC芯片10通过在导电（12a），（12b）之间缠绕以在IC芯片（20）的两个相对边缘之间环绕IC芯片（20）的外表面的方式形成，其中导电 电线（12a），（12b）机械地接触形成在IC芯片（20）上的电极，并与电极电连接，使得安装用IC芯片（10）与天线图案（44a），（44b） 经由导线（12a），（12b）。