Low resistance source and drain extensions for ETSOI

    公开(公告)号:US08486778B2

    公开(公告)日:2013-07-16

    申请号:US13183666

    申请日:2011-07-15

    IPC分类号: H01L21/8238 H01L21/336

    摘要: A gate dielectric is patterned after formation of a first gate spacer by anisotropic etch of a conformal dielectric layer to minimize overetching into a semiconductor layer. In one embodiment, selective epitaxy is performed to sequentially form raised epitaxial semiconductor portions, a disposable gate spacer, and raised source and drain regions. The disposable gate spacer is removed and ion implantation is performed into exposed portions of the raised epitaxial semiconductor portions to form source and drain extension regions. In another embodiment, ion implantation for source and drain extension formation is performed through the conformal dielectric layer prior to an anisotropic etch that forms the first gate spacer. The presence of the raised epitaxial semiconductor portions or the conformation dielectric layer prevents complete amorphization of the semiconductor material in the source and drain extension regions, thereby enabling regrowth of crystalline source and drain extension regions.

    Conductive liner at an interface between a shallow trench isolation structure and a buried oxide layer
    46.
    发明授权
    Conductive liner at an interface between a shallow trench isolation structure and a buried oxide layer 有权
    在浅沟槽隔离结构和掩埋氧化物层之间的界面处的导电衬垫

    公开(公告)号:US07855428B2

    公开(公告)日:2010-12-21

    申请号:US12115699

    申请日:2008-05-06

    IPC分类号: H01L21/76

    CPC分类号: H01L21/76283

    摘要: The invention relates to a design structure, and more particularly, to a design structure for a conductive liner for rad hard total dose immunity and a structure thereof. The structure includes at least one shallow trench isolation structure having oxide material and formed in an SOI. A dielectric liner is formed at an interface of the SOI within the at least one shallow trench isolation structure. A metal or metal alloy layer is formed in the at least one shallow trench isolation structure and between the dielectric liner and the oxide material.

    摘要翻译: 本发明涉及一种设计结构,更具体地,涉及一种用于辐射硬总剂量免疫的导电衬垫的设计结构及其结构。 该结构包括至少一个具有氧化物材料并在SOI中形成的浅沟槽隔离结构。 在所述至少一个浅沟槽隔离结构内的SOI的界面处形成电介质衬垫。 在所述至少一个浅沟槽隔离结构中以及所述电介质衬垫和所述氧化物材料之间形成金属或金属合金层。

    POLYMER COMPOSITION WITH ENHANCED GAS BARRIER, ARTICLES AND METHODS
    48.
    发明申请
    POLYMER COMPOSITION WITH ENHANCED GAS BARRIER, ARTICLES AND METHODS 审中-公开
    具有增强气体阻隔器的聚合物组合物,文章和方法

    公开(公告)号:US20100234501A1

    公开(公告)日:2010-09-16

    申请号:US12280283

    申请日:2007-02-21

    摘要: The present invention relates to a thermoplastic polymer composition with enhanced gas barrier properties comprising a thermoplastic polymer, an antiplasticizer and a chain extender. Suitable antiplasticizers and suitable chain extenders are disclosed herein. Other embodiments of the present invention include a method to produce such a thermoplastic composition, an article comprising such a thermoplastic composition, and a method for making such an article.

    摘要翻译: 本发明涉及具有增强的阻气性的热塑性聚合物组合物,其包含热塑性聚合物,抗增塑剂和扩链剂。 本文公开了合适的抗增塑剂和合适的增链剂。 本发明的其它实施方案包括制备这种热塑性组合物的方法,包含这种热塑性组合物的制品以及制备这种制品的方法。