Abstract:
A fabrication process for a device such as a backplane for a flat panel display includes depositing thin film layers on a substrate, forming a 3D template overlying the thin film layers, and etching the 3D template and the thin film layers to form gate lines and transistors from the thin film layers. An insulating or passivation layer can then be deposited on the gate lines and the transistors, so that column or data lines can be formed on the insulating layer.
Abstract:
This invention provides a thin film device with minimized spatial variation of local mean height. More specifically, the thin film device has a substrate and at least one first structure having a first spatially varying weighted local mean height determined by a layer weighting function. The first structure has a first maximum height, a first minimum height and a first variation for a given averaging area. A compensation structure is also provided upon the substrate, the compensation structure having a second spatially varying weighted local mean height determined by the layer weighting function. The compensation structure also has a second maximum height, a second minimum height and a second variation for the given averaging area. The first structure and compensation structure combine to provide a combined structure upon the substrate with minimized spatial variation of a combined weighted local mean.
Abstract:
A large area display workstation provides a liquid crystal display, configured to produce an image. The electrical components of the liquid crystal display are disposed on a substrate through a large area fabrication technique. The workstation has a first, high-resolution video display, and the large area display is a second, lower-resolution file identification display. The computer displays a user-selected file in a high-resolution format on the high-resolution video display for manipulation, and displays a plurality of file indicators in a low-resolution format on the large area display.
Abstract:
An silver island anti-fuse including a first electrical conductor, an electrically resistive material in contact with the first conductor and at least one silver island disposed opposite the first electrical conductor and upon the electrically resistive material. A second electrical conductor disposed over the silver island intimately couples the silver island to the electrically resistive material. When a critical potential is applied across the anti-fuse, a metallic filament precipitates from the silver island through the electrically resistive material layer, establishing a short and thus switching the silver island anti-fuse from a high resistance to a low resistance. A method of making the silver island anti-fuse and a memory device incorporating the silver island anti-fuse are further provided.
Abstract:
Embodiments of the present invention include hierarchically-dimensioned, microfiber-based dry adhesive materials featuring dense arrays of microfibers with free tips terminating in numerous microfibrils. In certain embodiments, more than two levels of microfiber-dimension hierarchy may be employed, each dimension involving smaller microfibrils emanating from the tips of the microfibers or microfibrils of the next highest dimensional level. Various additional embodiments of the present invention are directed to methods for preparing hierarchically-dimensioned, microfiber-based dry adhesive materials. These methods include single-pass or multi-pass imprint-lithography, pattern masking and etching, and imprinting fiber-embedded substrates followed by etching.
Abstract:
Apparatus and method for making a multi-layered storage structure includes forming a device layer on a single-crystal wafer, cleaving the device layer from the wafer, repeating the forming and cleaving to provide a plurality of cleaved device layers, and bonding the cleaved device layers together to form the multi-layered storage structure.
Abstract:
An addressing circuit is operable to address one or more memory elements in a cross-point memory array. The addressing circuit includes first and second sets of address lines for addressing the cross-point memory array. The address circuit also includes pull-up and pull-down circuit elements. Both the pull-up and pull-down circuit elements and the address lines include cross-point resistive elements.
Abstract:
A resistive cross point array memory device comprising a plurality of word lines extending in a row direction, a plurality of bit lines extending in a column direction such that a plurality of cross points is formed at intersections between the word and bit lines, and at least one memory element formed in at least one of the cross points. The memory element comprises a first tunnel junction having a bottom conductor, a top conductor, a barrier layer adjacent the bottom conductor, and wherein the bottom conductor comprises a non-uniform upper surface.
Abstract:
Fuse-type and antifuse-type semiconducting-organic-polymer-film-based memory elements for use in memory devices are disclosed. Various embodiments of the present invention employ a number of different techniques to alter the electrical conductance or, equivalently, the resistance, of organic-polymer-film memory elements in order to produce detectable memory-state changes in the memory elements. The techniques involve altering the electronic properties of the organic polymers by application of heat or electric fields, often in combination with additional chemical compounds, to either increase or decrease the resistance of the organic polymers.
Abstract:
A multilayer structure is disclosed that includes a conductive layer, a layer of a negative differential resistance (NDR) material disposed above the conductive layer, a layer M2 disposed above the NDR material, a second layer of NDR material disposed above layer M2, and a conductive layer disposed above the second NDR layer. Layer M2 can include a conductive material interspersed with regions of a dielectric material or a layer of the dielectric material and regions of the conductive material disposed above and below the dielectric material.