摘要:
The present invention relates to an organic electroluminescent element and a display device exhibiting high emission efficiency and long life. The organic electroluminescent element contains a pair of electrodes having therebetween at least one constituting layer containing a phosphorescent light emitting layer, wherein one of the constituting layer contains a compound represented by Formula (1): wherein Z1 represents an aromatic heterocylic ring which may have a substituent; Z2 represents an aromatic heterocylic ring or an aromatic hydrocarbon ring both of which may have a substituent; Z3 represents a divalent linking group or a single bond; and R101 represents a hydrogen atom or a substituent.
摘要翻译:本发明涉及一种表现出高发光效率和长寿命的有机电致发光元件和显示装置。 有机电致发光元件包含一对电极,其间具有包含磷光发光层的至少一个构成层,其中,构成层中的一个包含由式(1)表示的化合物:其中Z 1表示 可以具有取代基的芳族杂环; Z 2代表可以具有取代基的芳香族杂环或芳香族烃环; Z 3表示二价连接基团或单键; R 101表示氢原子或取代基。
摘要:
The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
摘要:
A board piece 2 of the present invention comprises a non-thermoplastic resin film 11, a thermoplastic resin film 10 formed on the non-thermoplastic resin film 11 and a metal wiring 8 formed on the surface of the thermoplastic resin film 10. Metal wiring 8 is partially exposed on board piece 2 to form a contact 12. A low-melting metal coating 13 is formed on contact 12 and two board pieces 2a, 2b are pressed against each other under heating with contacts 12a, 12b thereof being in contact with each other so that thermoplastic resin films 10a, 10b soften to adhere board pieces 2a, 2b to each other and low-melting metal coatings 13a, 13b melt and then solidify to connect contacts 12a, 12b to each other. The region of metal wiring 8 not used for connection is wiring 17 connecting contacts 12 to each other and a cover film 19 can be provided on the surface thereof. Contacts 12a, 12b can also be connected by applying ultrasonic wave.
摘要:
A thermal transfer recording material comprising a support having thereon an image transferring layer containing a coloring material represented by Formula (I), Formula (I): wherein each R11 and R12 is independently a substituted or unsubstituted aliphatic group; R13 is a substituent and n is an integer of 0 to 4, provided that when n is 2 or more, a plurality of R13s are the same or different; R14 is an alkyl group; and each R15 and R16 is independently an alkyl group having 3 to 8 carbon atoms.
摘要翻译:一种热转印记录材料,其包括其上具有包含由式(I),式(I)表示的着色材料的图像转移层的载体:其中每个R 11和R 12独立地为取代或未取代的脂族基团; R 13为取代基,n为0〜4的整数,n为2以上时,多个R 13相同或不同, R14是烷基; 并且每个R 15和R 16独立地为具有3至8个碳原子的烷基。
摘要:
A silver halide color photographic light sensitive material is disclosed, comprising a support having thereon a silver halide emulsion layer containing silver halide grains, wherein said silver halide emulsion layer contains a cyan dye forming coupler represented by the following formula (1) or (2), ##STR1##
摘要:
A silver halide photographic light sensitive material comprising a support having thereon a silver halide emulsion layer containing a cyan dye-forming coupler represented by the following formula (I) or (II). ##STR1##
摘要:
A heat-curable resinous coating composition comprising as a binder component(A) 5 to 90% by weight of a hydroxyl-containing resin selected from hydroxyl-containing acrylic resins and hydroxyl-containing polyester resins,(B) 5 to 50% by weight of an amino resin, and(C) 1 to 90% by weight of a crosslinkable resin selected from (C-a) polyfunctional resins having a number average molecular weight of at least 1000 and containing at least two carboxyl groups and at least two epoxy groups on an average per molecule and (C-b) polyorganosiloxanes having a number average molecular weight of at least 500 and containing at least two silanol groups on an average per molecule and if required, further containing an epoxy group.