摘要:
A semiconductor device of which manufacturing steps can be simplified by doping impurities at a time, and a manufacturing method thereof. The manufacturing method of the semiconductor device comprises the steps of: forming first and second semiconductor layers over a substrate, forming a first insulating film over the first and second semiconductor layers, forming first and second conductive films thereover, forming a first gate electrode having a stacked layer of the first and second conductive films, in which a portion of the first conductive film is exposed from the second conductive film, over the first semiconductor layer with the first insulating film interposed therebetween, forming a second insulating film over the first insulating film, forming third and fourth conductive films thereover, and forming a second gate electrode having a stacked layer of the third and fourth conductive films, in which a portion of the third conductive film is exposed from the fourth conductive film, over the second semiconductor layer with the first and second insulating films interposed therebetween.
摘要:
A semiconductor device that can be manufactured with a reduced cost by decreasing the number of masks is disclosed, and a method for manufacturing the semiconductor device is disclosed. The method for manufacturing the semiconductor device comprises the steps of: forming a semiconductor layer 3 having a source and a drain regions 10, 11, and LDD regions 16, 17; a gate insulating film 5; and a gate electrode 6; forming a first and a second interlayer insulating films 24, 25 over the gate electrode 6 and the gate insulating film 5; forming contact holes 25a, 25c to these interlayer insulating films so as to be located over each of the source region and the drain region; and an opening portion 25b to these interlayer insulating films so as to be located over the gate electrode and the LDD region; forming a second gate electrode 26b by a conductive film in the opening portion so as to cover the gate electrode and the LDD region; and a pixel electrode 26a over the second interlayer insulating film; removing the gate insulating film in the contact hole; and forming wirings 27, 28 connected to each the source region and the drain region.
摘要:
In a TFT with a GOLD structure, there is provided a structure which is able to improve an operating characteristic and reliability and reduce an off current value in order to reduce power consumption of a semiconductor device. The surface of LDD region (4) overlapped with a portion (7a) of a gate electrode through a gate insulating film (6) interposed therebetween is extremely flattened. Thus, it is possible to obtain a TFT structure which is capable of reducing a parasitic capacitance in the LDD region of the TFT with the GOLD structure, reducing an off current value, improving reliability, and enabling high speed operation.
摘要:
A semiconductor device that can be manufactured with a reduced cost by decreasing the number of masks is disclosed, and a method for manufacturing the semiconductor device is disclosed. The method for manufacturing the semiconductor device comprises the steps of: forming a semiconductor layer 3 having a source and a drain regions 10, 11, and LDD regions 16, 17; a gate insulating film 5; and a gate electrode 6; forming a first and a second interlayer insulating films 24, 25 over the gate electrode 6 and the gate insulating film 5; forming contact holes 25a, 25c to these interlayer insulating films so as to be located over each of the source region and the drain region; and an opening portion 25b to these interlayer insulating films so as to be located over the gate electrode and the LDD region; forming a second gate electrode 26b by a conductive film in the opening portion so as to cover the gate electrode and the LDD region; and a pixel electrode 26a over the second interlayer insulating film; removing the gate insulating film in the contact hole; and forming wirings 27, 28 connected to each the source region and the drain region.
摘要:
By adding a novel improvement to the technique disclosed in JP 8-78329 A, a manufacturing method in which film characteristics of a semiconductor film having a crystalline structure are improved is provided. In addition, a TFT having superior TFT characteristics, such as field effect mobility, which uses the semiconductor film as an active layer, and a method of manufacturing the TFT, are also provided. A metallic element which promotes the crystallization of silicon is added to a semiconductor film having an amorphous structure and an oxygen concentration within the film of less than 5×1018/cm3. The semiconductor film having an amorphous structure is then heat-treated, forming a semiconductor film having a crystalline structure. Subsequently, an oxide film on the surface is removed. Oxygen is introduced to the semiconductor film having a crystalline structure, and processing is performed such that the concentration of oxygen within the film is from 5×1018/cm3 to 1×1021/cm3. After removing an oxide film on the surface of the semiconductor film, the semiconductor film surface is leveled by irradiating laser light under an inert gas atmosphere or in a vacuum.
摘要翻译:通过添加对JP 8-78329A中公开的技术的新颖改进,提供了具有改善晶体结构的半导体膜的膜特性的制造方法。 此外,还提供了具有优异TFT特性的TFT,例如使用半导体膜作为有源层的场效应迁移率,以及TFT的制造方法。 将促进硅结晶的金属元素加入到膜内的非晶结构和氧浓度小于5×10 18 / cm 3的半导体膜中。 然后对具有非晶结构的半导体膜进行热处理,形成具有晶体结构的半导体膜。 随后,除去表面上的氧化物膜。 将氧气引入具有晶体结构的半导体膜,并且进行处理,使得膜内的氧浓度为5×10 18 / cm 3至1×10 21 / cm 3。 在去除半导体膜表面上的氧化物膜之后,通过在惰性气体气氛或真空中照射激光来平整半导体膜表面。
摘要:
A semiconductor device which has satisfactory characteristics is provided. The semiconductor device includes a TFT manufactured by using a satisfactory crystalline semiconductor film and a circuit manufactured by using the TFT. An n-type impurity element (typically, phosphorous) is added to a gettering region of an n-channel TFT. A p-type impurity element (typically, boron) and a rare gas element (typically, argon) are added to a gettering region of a p-channel TFT. Then, there is performed heat treatment for gettering a catalytic element that remains in a semiconductor film.
摘要:
A catalytic element for promoting crystallization of an amorphous silicon film is efficiently gettered to provide a highly reliable TFT, and an electro-optical device using the TFT and a method of manufacturing the electro-optical device are provided. The electro-optical device has an n-channel TFT and a p-channel TFT. A semiconductor layer of the p-channel TFT has a channel forming region (13), a region (11) containing an n-type impurity element and a p-type impurity element, and a region (12) containing only a p-type impurity element. In the p-channel TFT, a wiring line for electrically connecting the TFTs is connected to the region (12) containing only a p-type impurity element. The region containing an n-type impurity element in the p-channel TFT is narrower than a region doped with an n-type impurity element in a semiconductor layer of the n-channel TFT.
摘要:
A thin film transistor includes: a substrate; a gate electrode, a source electrode and a drain electrode formed above the substrate; and an insulating film and a semiconductor film formed between the gate electrode, and the source electrode and the drain electrode, wherein the semiconductor film includes an i-type silicon film, and a portion of the semiconductor film within 50 nm from the insulating film has a microcrystalline structure having a conductivity of 5×10−10 S/cm or more.
摘要翻译:薄膜晶体管包括:基板; 形成在基板上的栅电极,源电极和漏电极; 以及形成在所述栅电极与所述源电极与所述漏电极之间的绝缘膜和半导体膜,其中,所述半导体膜包括i型硅膜,所述半导体膜的距绝缘膜50nm以内的部分具有 导电率为5×10 -10 S / cm以上的微晶结构。
摘要:
The present invention is to provide a solid oxide fuel cell capable of improving the overall energy efficiency. The present invention is directed to a solid oxide fuel cell and comprising: a fuel cell module; a fuel supply device; a combustion chamber for burning excess fuel and heating; a heat storing material, a power demand detecting sensor; a temperature detection device, and a control device for controlling so that the fuel utilization rate is high when generated power is large, and also for changing output power at a delay to the fuel supply rate; whereby the control device comprises a stored heat amount estimating circuit, and when it is estimated that a utilizable heat amount has accumulated in the heat storing material, the fuel supply rate is reduced so that the fuel utilization rate increases vs. the same generated power.
摘要:
To provide a solid oxide fuel cell system capable of efficiently and simply controlling a low speed fuel cell module and a high speed inverter. The invention is a solid oxide fuel cell system, comprising: a fuel cell module, a fuel flow regulator unit, a control section comprising a first power demand detection circuit for controlling the fuel supply amount and for setting the value of current extractable from the fuel cell module; an inverter for extracting current from fuel cell module; and a second power demand detection circuit; and having an inverter control section for controlling the inverter independently from the fuel cell controller so that a current responsive to power demand is extracted from the fuel cell module in a range not exceeding the extractable current value input from the fuel cell controller.