公开(公告)号：US10672531B2

公开(公告)日：2020-06-02

申请号：US15326224

申请日：2015-07-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US10465295B2

公开(公告)日：2019-11-05

申请号：US15312799

申请日：2015-05-19

Applicant: Alpha Assembly Solutions Inc

Inventor： Steven Prokopiak ,  Ellen S. Tormey ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: C23F1/16 ,  C23F1/02 ,  H01L21/3213 ,  H01L31/18 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/0236

Abstract: A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents,

公开(公告)号：US10322471B2

公开(公告)日：2019-06-18

申请号：US15326180

申请日：2015-07-15

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravindra Bhatkal ,  Bawa Singh

IPC: B23K31/02 ,  B23K35/26 ,  B23K35/00 ,  C22C13/00 ,  C22C13/02 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  B23K35/02 ,  H01L23/00 ,  B23K101/40 ,  B23K101/42

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

公开(公告)号：US10123430B2

公开(公告)日：2018-11-06

申请号：US11873838

申请日：2007-10-17

Applicant: Michael T. Marczi ,  Paul Koep ,  Michiel A. de Monchy ,  Martinus N Finke ,  Brian Lewis

Inventor： Michael T. Marczi ,  Paul Koep ,  Michiel A. de Monchy ,  Martinus N Finke ,  Brian Lewis

IPC: B23K26/00 ,  H05K3/34 ,  B23K35/26 ,  B23K35/30 ,  H01L31/02 ,  H01L31/048 ,  H01L23/373 ,  H01L23/00

Abstract: Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.

公开(公告)号：US20250063830A1

公开(公告)日：2025-02-20

申请号：US18719593

申请日：2022-12-09

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  P M KRITHIKA ,  Siuli SARKAR

IPC: H01L31/05 ,  B23K35/36 ,  B23K35/362 ,  B23K101/38 ,  H01L31/18

Abstract: A method of manufacturing a solar module, the method comprising: connecting a metallic interconnector to two or more solar cells; and applying a transparent cover sheet to the two or more solar cells, wherein connecting the metallic interconnector to each solar cell of the two or more solar cells comprises: providing a solar cell having a bus bar on a surface thereof; providing a metallic interconnector having solder flux on a contact surface thereof; providing solder between the bus bar and the contact surface; and reflowing the solder to connect the metallic interconnector to the bus bar, wherein the solder flux comprises a reflective additive.

公开(公告)号：US20250026645A1

公开(公告)日：2025-01-23

申请号：US18901595

申请日：2024-09-30

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalyakumar Chaki ,  Supriya Devarajan ,  Barun Das ,  Chetan Pravinchandra Shah ,  Venodh Manoharan ,  Rahul Raut ,  Bawa Singh ,  Ranjit Pandher

IPC: C01B32/194 ,  B29C51/14 ,  B29K67/00 ,  B29K69/00 ,  C08K3/04 ,  C09K5/14 ,  H01B1/04

Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

公开(公告)号：US20240282742A1

公开(公告)日：2024-08-22

申请号：US18582801

申请日：2024-02-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghosal ,  Remya Chandran ,  Venodh Manoharan ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/00 ,  B22F9/24 ,  B23K35/02 ,  B23K35/30 ,  B82Y40/00

CPC classification number: H01L24/29 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/006 ,  B22F9/24 ,  B23K35/025 ,  B23K35/302 ,  B22F2301/10 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2304/058 ,  B82Y40/00

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

公开(公告)号：US20240198460A1

公开(公告)日：2024-06-20

申请号：US18555829

申请日：2022-04-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit PANDHER ,  Niveditha NAGARAJAN ,  Girard SIDONE ,  Carl BILGRIEN

IPC: B23K35/02 ,  B23K1/19 ,  B23K35/26 ,  B23K35/30

CPC classification number: B23K35/0238 ,  B23K1/19 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3093

Abstract: A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

公开(公告)号：US20230340642A1

公开(公告)日：2023-10-26

申请号：US18215929

申请日：2023-06-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Md Hasnine ,  Lik Wai Kho

IPC: C22C13/00 ,  B23K35/26 ,  C22C13/02

CPC classification number: C22C13/00 ,  B23K35/262 ,  C22C13/02 ,  B23K35/0244

Abstract: A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.

公开(公告)号：US20230330788A1

公开(公告)日：2023-10-19

申请号：US18205590

申请日：2023-06-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K35/02 ,  B23K1/012 ,  B23K1/005 ,  B23K35/26 ,  B23K1/08 ,  B23K1/00 ,  H05K3/34 ,  C22C13/02 ,  B23K1/20 ,  B23K1/002 ,  B23K1/19 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  B23K2103/12 ,  Y10T403/479

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.