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公开(公告)号：US08312623B2
公开(公告)日：2012-11-20
申请号：US12052166
申请日：2008-03-20
申请人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
IPC分类号： H05K3/02
CPC分类号： H01B1/02 , H05K1/0393 , H05K1/092 , H05K3/207 , H05K2201/0347 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed.
摘要翻译： 提供了一种包括热敏基板和设置在其上的电导体的装置。 在某些实施例中，热敏基材可以被配置为在烧结温度以上或以上降解。 在其他示例中，可以在处理在热敏基板上之前，在能够承受烧结温度的第二基板上的烧结温度下处理电导体。 还公开了方法和试剂盒。
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公开(公告)号：US20080236874A1
公开(公告)日：2008-10-02
申请号：US12052166
申请日：2008-03-20
申请人： Oscar Khaselev , Nitin Desai , Michael T Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Michael T Marczi , Bawa Singh
CPC分类号： H01B1/02 , H05K1/0393 , H05K1/092 , H05K3/207 , H05K2201/0347 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed.
摘要翻译： 提供了一种包括热敏基板和设置在其上的电导体的装置。 在某些实施例中，热敏基材可以被配置为在烧结温度以上或以上降解。 在其他示例中，可以在处理在热敏基板上之前，在能够承受烧结温度的第二基板上的烧结温度下处理电导体。 还公开了方法和试剂盒。
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公开(公告)号：US10123430B2
公开(公告)日：2018-11-06
申请号：US11873838
申请日：2007-10-17
IPC分类号： B23K26/00 , H05K3/34 , B23K35/26 , B23K35/30 , H01L31/02 , H01L31/048 , H01L23/373 , H01L23/00
摘要： Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
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公开(公告)号：US09615463B2
公开(公告)日：2017-04-04
申请号：US11857871
申请日：2007-09-19
申请人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
CPC分类号： H05K3/125 , H05K1/09 , H05K3/0011 , H05K3/1258 , H05K3/22 , H05K3/245 , H05K2201/0203 , H05K2201/0224 , H05K2201/09909 , H05K2203/013 , H05K2203/0568 , H05K2203/0769 , H05K2203/1131 , H05K2203/1476 , Y10T29/49155
摘要： Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
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公开(公告)号：US08555491B2
公开(公告)日：2013-10-15
申请号：US12175375
申请日：2008-07-17
申请人： Monnir Boureghda , Nitin Desai , Anna Lifton , Oscar Khaselev , Michael T. Marczi , Bawa Singh
发明人： Monnir Boureghda , Nitin Desai , Anna Lifton , Oscar Khaselev , Michael T. Marczi , Bawa Singh
CPC分类号： H05K13/0465 , B22F1/0062 , H01L23/373 , H01L24/03 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/0381 , H01L2224/2731 , H01L2224/27312 , H01L2224/2732 , H01L2224/27416 , H01L2224/2745 , H01L2224/27452 , H01L2224/29101 , H01L2224/29111 , H01L2224/29294 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/2949 , H01L2224/32225 , H01L2224/45139 , H01L2224/45144 , H01L2224/48227 , H01L2224/83075 , H01L2224/83192 , H01L2224/83203 , H01L2224/83204 , H01L2224/8321 , H01L2224/83211 , H01L2224/83438 , H01L2224/83801 , H01L2224/8384 , H01L2224/83907 , H01L2224/8393 , H01L2224/83931 , H01L2224/8584 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/203 , H01L2924/3512 , Y10T29/4913 , Y10T29/49133 , Y10T29/49155 , Y10T428/24893 , H01L2924/00 , H01L2924/00014 , H01L2924/0002 , H01L2924/00012 , H01L2924/01014
摘要： Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.
摘要翻译： 公开了将模具附接到基板的方法。 在某些实施例中，该方法包括在衬底上设置封盖的纳米材料，在设置的封盖的纳米材料上设置管芯，干燥所设置的封盖的纳米材料和所设置的管芯，并在300℃的温度下烧结经干燥的设置的管芯和干燥的封盖的纳米材料 ℃以下以将管芯附着到基板上。
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公开(公告)号：US10535628B2
公开(公告)日：2020-01-14
申请号：US13287820
申请日：2011-11-02
申请人： Oscar Khaselev , Bin Mo , Michael T. Marczi , Bawa Singh , Monnir Boureghda
发明人： Oscar Khaselev , Bin Mo , Michael T. Marczi , Bawa Singh , Monnir Boureghda
摘要： Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
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公开(公告)号：US20120114927A1
公开(公告)日：2012-05-10
申请号：US13287820
申请日：2011-11-02
申请人： Oscar Khaselev , Bawa Singh , Bin Mo , Michael T. Marczi , Monnir Boureghda
发明人： Oscar Khaselev , Bawa Singh , Bin Mo , Michael T. Marczi , Monnir Boureghda
摘要： Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
摘要翻译： 用于多芯片和单个部件的芯片连接的方法可以包括在基板上或在模具的背面上印刷烧结膏。 打印可能涉及模版印刷，丝网印刷或分配过程。 糊剂可以在切割之前或者在单个模具的背面上印刷在整个晶片的背面上。 也可以制造烧结膜并将其转移到晶片，管芯或衬底。 后烧结步骤可以增加生产量。
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公开(公告)号：US07968008B2
公开(公告)日：2011-06-28
申请号：US11462089
申请日：2006-08-03
申请人： Sachin Parashar , Siuli Sarkar , Oscar Khaselev , Brian G. Lewis , Michael T. Marczi , Bawa Singh , Nitin Desai , Michael Liberatore
发明人： Sachin Parashar , Siuli Sarkar , Oscar Khaselev , Brian G. Lewis , Michael T. Marczi , Bawa Singh , Nitin Desai , Michael Liberatore
CPC分类号： C09D11/03 , B22F1/0018 , B22F1/0022 , B22F1/0062 , B22F9/24 , B82Y30/00 , C01P2002/84 , C01P2004/62 , C01P2004/64 , C08K3/08 , C08K9/04 , C09D7/62 , C09D7/67 , C09D11/00 , C09D11/38 , C23C24/08 , C23C26/00 , H01B1/02 , H01L51/0022 , H05K1/097 , H05K2201/0224 , Y10T428/2982 , Y10T428/2991
摘要： Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
摘要翻译： 提供颗粒和颗粒膜。 在某些实例中，由单相工艺生产的颗粒可用于提供用于诸如印刷线路板的装置中的颗粒的工业规模合成。
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公开(公告)号：US20090061169A1
公开(公告)日：2009-03-05
申请号：US12175381
申请日：2008-07-17
CPC分类号： H05K3/38 , H01L31/022425 , H05K1/0306 , H05K1/097 , H05K3/125 , H05K3/246 , H05K2201/0347 , H05K2203/013 , H05K2203/1131 , Y02E10/50 , Y10T428/12535 , Y10T428/12583 , Y10T428/12597 , Y10T428/12896 , Y10T428/24802 , Y10T428/24917
摘要： Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.
摘要翻译： 本文公开的某些示例涉及包括设置在基板上的基板和导体的装置。 在一些实例中，导体和基底中的每一个可以包括彼此相互不溶解的材料。 在其他示例中，导体还可以包括基本上纯的金属。 在某些实例中，布置的导体可以被配置为通过粘合带测试ASTM D3359-02。 还提供了形成导体的方法。
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公开(公告)号：US09362424B2
公开(公告)日：2016-06-07
申请号：US12052104
申请日：2008-03-20
申请人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
发明人： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
IPC分类号： H01L31/0224 , H01L31/18 , H05K3/00
CPC分类号： H01L31/022425 , H01L31/18 , H05K3/002 , H05K2203/0793 , Y02E10/50
摘要： Certain embodiments are directed to methods, devices and systems designed to remove selected portions of a material to expose an underlying material or substrate. One or more electrical components may be coupled to the underlying substrate through an electrical contact. Kits and systems for producing electrical contacts are also provided.
摘要翻译： 某些实施例涉及设计用于移除材料的选定部分以暴露下面的材料或基底的方法，装置和系统。 一个或多个电气部件可以通过电触点耦合到下面的基板。 还提供了用于生产电触头的套件和系统。
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