Drilling method and laser machining apparatus
    41.
    发明授权
    Drilling method and laser machining apparatus 有权
    钻孔方法和激光加工设备

    公开(公告)号:US07952050B2

    公开(公告)日:2011-05-31

    申请号:US11843807

    申请日:2007-08-23

    IPC分类号: B23K26/38

    摘要: A drilling method and a laser machining apparatus which can shorten the measuring time of workpiece surface height and improve the machining efficiency in spite of irregularities of about 10-30 μm high in the surface of a table. Surface heights of the table is measured at lattice points in advance. Top surface height at a desired point of the workpiece mounted on the table is measured. Surface height of the point is arithmetically obtained using heights of four points surrounding the point. The difference between the measured height and the arithmetically obtained height is set as the plate thickness of the workpiece. Top surface height of the workpiece at a machining position is regarded as the sum of the plate thickness and the height at that position obtained from the table surface heights.

    摘要翻译: 一种钻孔方法和激光加工装置,其可以缩短工件表面高度的测量时间,并提高加工效率,尽管在表的表面上具有约10-30μm高的不规则性。 表格的表面高度预先在格点测量。 测量安装在工作台上的工件的所需点上的顶部表面高度。 使用围绕点的四个点的高度算术地获得点的表面高度。 将测得的高度与算术获得的高度之差设定为工件的板厚度。 在加工位置的工件的顶面高度被认为是从台面高度获得的板厚度和该位置处的高度之和。

    Exposure apparatus and exposing method and method of manufacturing a printed wiring board
    42.
    发明授权
    Exposure apparatus and exposing method and method of manufacturing a printed wiring board 有权
    曝光装置及曝光方法以及制造印刷电路板的方法

    公开(公告)号:US07760328B2

    公开(公告)日:2010-07-20

    申请号:US11370044

    申请日:2006-03-08

    IPC分类号: G03B27/72

    摘要: The mask-less exposure apparatus includes: a stage which moves with the substrate having a photosensitive resin layer with sensitivity to ultraviolet radiation formed thereon; a first light source for emitting light containing a wavelength component in the wavelength range of 300 to 410 nm; a first light irradiation optical system for modulating a radiant flux emitted from the first light source based on data of a desired exposure pattern to image a pattern on the photosensitive resin layer; a second light source for emitting light containing a wavelength component in the wavelength range of 450 to 2500 nm; and a second light irradiation optical system for guiding a radiant flux emitted from the second light source to a second light irradiation area that is set so as to include at least a first light irradiation area.

    摘要翻译: 无掩模曝光装置包括:具有对其上形成的紫外线辐射敏感的感光性树脂层的基板移动的台阶; 用于发射包含波长范围为300〜410nm的波长成分的光的第一光源; 第一光照射光学系统,用于基于期望的曝光图案的数据来调制从第一光源发射的辐射通量,以在感光性树脂层上成像; 第二光源,用于发射包含在波长范围为450至2500nm的波长分量的光; 以及第二光照射光学系统,用于将从第二光源发射的辐射通量引导到被设定为至少包括第一光照射区域的第二光照射区域。

    Substrate exposure apparatus and illumination apparatus
    43.
    发明授权
    Substrate exposure apparatus and illumination apparatus 有权
    基板曝光装置和照明装置

    公开(公告)号:US07755741B2

    公开(公告)日:2010-07-13

    申请号:US11839863

    申请日:2007-08-16

    IPC分类号: G03B27/54 G03B27/52 G03B27/72

    摘要: An illumination apparatus and an exposure apparatus that achieves higher quality exposure to light and higher operating speed even where the ratio Hx/Hy between the transverse dimension Hx and the longitudinal dimension Hy of the plane of optical modulation of a two-dimensional optical space modulator is 1.5 or above, for instance, are to be provided. The focal distance fx in an x-direction and the focal distance fy in a y-direction of a second optical system that guides light emitted from an integrator to a two-dimensional optical space modulator are made different, in a ratio of fx/fy=1.6, for instance. In this way, the number of rod lenses in the integrator can be made equal between transverse and longitudinal directions and the value of Hx/Hy can be made 2.5 by bringing the aspect ratio dx:dy of rod lenses to 1.6:1, close to 1.

    摘要翻译: 即使二维光学空间调制器的光学调制平面的横向尺寸Hx与纵向尺寸Hy之间的比率Hx / Hy为 例如提供1.5或以上。 将从积分器发射的光引导到二维光学空间调制器的第二光学系统的沿x方向的焦距fx和y方向的焦距fy被制成不同的fx / fy = 1.6,例如。 以这种方式,积分器中的棒状透镜的数量可以在横向和纵向方向上相等,并且通过将棒透镜的纵横比dx:dy设置为1.6:1,可以使得Hx / Hy的值为2.5 1。

    Inspection method and apparatus for partially drilled microvias
    44.
    发明授权
    Inspection method and apparatus for partially drilled microvias 有权
    部分钻孔微孔检查方法和装置

    公开(公告)号:US07668364B2

    公开(公告)日:2010-02-23

    申请号:US11411977

    申请日:2006-04-26

    IPC分类号: G06K9/00

    摘要: Inspection of partially drilled microvias by fluorescence based optical imaging techniques, selective coaxial illumination and multivariable off-axis illumination and the use of comparative image analysis and the transformation of back reflected radiation by means of an integrated fluorescing plate mounted to the surface of a CCD or EMCCD array.

    摘要翻译: 通过基于荧光的光学成像技术,选择性同轴照明和多变量离轴照明来检查部分钻孔的微血管,以及使用比较图像分析和通过安装到CCD的表面上的集成荧光板来反射反射辐射的转换,或 EMCCD阵列。

    Displacement and flatness measurements by use of a laser with diffractive optic beam shaping and a multiple point sensor array using the back reflection of an illuminating laser beam
    46.
    发明授权
    Displacement and flatness measurements by use of a laser with diffractive optic beam shaping and a multiple point sensor array using the back reflection of an illuminating laser beam 失效
    使用具有衍射光束成形的激光器和使用照明激光束的背反射的多点传感器阵列的位移和平坦度测量

    公开(公告)号:US07548323B2

    公开(公告)日:2009-06-16

    申请号:US11284559

    申请日:2005-11-22

    申请人: Todd E. Lizotte

    发明人: Todd E. Lizotte

    IPC分类号: G01B11/30

    CPC分类号: G01B11/25 G01B11/306

    摘要: A laser beam system for measuring an aspect of a surface wherein a laser beam is reshaped into a corrected shaped laser beam having a corrected energy profile and subsequently reshaped into a measurement shaped laser beam having an measurement energy profile shaped to be effected by the at least one aspect of the surface. The measurement shaped laser beam is reflected from the surface, being modified by the aspect of interest of the surface, and to a sensor array wherein the sensors measure the reflected laser beam to determine the aspect of interest of the surface.

    摘要翻译: 一种用于测量表面的一个方面的激光束系统,其中激光束被重新整形成具有校正的能量分布的校正的成形激光束,并且随后重新成形为测量能量分布,该测量能量分布的形状至少由至少 表面的一个方面。 测量形状的激光束从表面反射,被表面感兴趣的方面改变,并且传感器阵列,其中传感器测量反射的激光束以确定表面感兴趣的方面。

    Method for determining position of reference point
    47.
    发明授权
    Method for determining position of reference point 有权
    确定参考点位置的方法

    公开(公告)号:US07522262B2

    公开(公告)日:2009-04-21

    申请号:US11141393

    申请日:2005-06-01

    IPC分类号: G03B27/42 G01B11/00

    摘要: A method for determining a position of a reference point in which there is no influence of aberration of a camera lens or the like, but an error caused by a failure in shape of an alignment mark can be reduced. An alignment mark consisting of a plurality of pattern portions (and background portions) centering at a design reference point is provided in advance. Positions of centers of border lines of the patterns are calculated. Obtained coordinate values of the centers are averaged in each axial direction. The averaged coordinate values are regarded as coordinate values of a machining reference point. Thus, even when a defect occurs in any pattern portion, an error caused by the defect is reduced so that the accuracy in machining can be improved.

    摘要翻译: 用于确定不影响照相机镜头等的像差的参考点的位置的方法,但是可以减少由对准标记的形状的故障引起的误差。 预先设置由以设计基准点为中心的多个图案部分(和背景部分)构成的对准标记。 计算模式边界线中心的位置。 获得的中心坐标值在每个轴向平均。 平均坐标值被认为是加工参考点的坐标值。 因此,即使当在任何图案部分发生缺陷时,由缺陷引起的误差降低,从而可以提高加工精度。

    Laser Direct Imaging Apparatus
    48.
    发明申请
    Laser Direct Imaging Apparatus 有权
    激光直接成像设备

    公开(公告)号:US20090080047A1

    公开(公告)日:2009-03-26

    申请号:US12191684

    申请日:2008-08-14

    IPC分类号: G02B26/10

    CPC分类号: G03F7/2006 G03F7/70383

    摘要: A laser direct imaging apparatus which can expose photosensitive materials having various sensitivities and which can correct an imaging position in accordance with deformation of a workpiece. In the laser direct imaging apparatus, the workpiece is moved in a sub-scanning direction while a cylindrical lens is used to converge a laser beam, which has been modulated based on raster data, in the sub-scanning direction and deflect the laser beam toward a main scanning direction so as to image a desired pattern on the workpiece. The cylindrical axis of the cylindrical lens is designed to be able to rotate horizontally and to be able to change an angle with respect to the main scanning direction.

    摘要翻译: 一种激光直接成像装置,其可以暴露具有各种灵敏度并且可以根据工件的变形校正成像位置的感光材料。 在激光直接成像装置中,工件在副扫描方向上移动,同时使用柱面透镜在副扫描方向上将基于光栅数据调制的激光束会聚在一起,并将激光束朝向 主扫描方向,以便对工件上的期望图案进行成像。 柱面透镜的圆柱轴被设计成能够水平旋转并且能够相对于主扫描方向改变角度。

    Laser machining apparatus
    49.
    发明授权
    Laser machining apparatus 有权
    激光加工设备

    公开(公告)号:US07473867B2

    公开(公告)日:2009-01-06

    申请号:US11037222

    申请日:2005-01-19

    IPC分类号: B23K26/02 B23K26/08

    CPC分类号: B23K26/043

    摘要: A laser machining apparatus that excels in precision in terms of machining position and shape is provided with an optical axis adjusting unit disposed on a basal optical axis of a laser beam outputted from a laser oscillator so as to adjust the laser beam outputted from the laser oscillator onto a workpiece. The laser machining apparatus is provided further with mirrors, disposed between the laser oscillator and the optical axis adjusting unit, for freely deflecting the optical axis of the laser beam. The laser machining apparatus also includes an optical axis position detecting means, disposed between the optical axis adjusting unit and the optical axis deflecting means, for detecting the position of the optical axis of the laser beam. The apparatus aligns the optical axis of the laser beam incident on the optical axis adjusting unit with the basal optical axis by means of the mirrors based on a result detected by the optical axis position detecting means.

    摘要翻译: 在加工位置和形状方面精度优异的激光加工装置设置有设置在从激光振荡器输出的激光束的基础光轴上的光轴调节单元,以便调节从激光振荡器输出的激光束 到工件上。 激光加工装置还设置有设置在激光振荡器和光轴调节单元之间的反射镜,用于自由地偏转激光束的光轴。 激光加工装置还包括光轴位置检测装置,设置在光轴调整单元和光轴偏转装置之间,用于检测激光束的光轴的位置。 该装置基于由光轴位置检测装置检测到的结果,通过反射镜将入射在光轴调节单元上的激光束的光轴与基准光轴对准。

    Machining Apparatus for Drilling Printed Circuit Board
    50.
    发明申请
    Machining Apparatus for Drilling Printed Circuit Board 有权
    钻孔印刷电路板加工装置

    公开(公告)号:US20080223833A1

    公开(公告)日:2008-09-18

    申请号:US12034317

    申请日:2008-02-20

    申请人: Yasunobu UENO

    发明人: Yasunobu UENO

    IPC分类号: B23K26/00

    摘要: A machining apparatus in which the machining efficiency can be improved even if characters are machined in a printed circuit board. A coordinate transformation unit is provided for transforming central coordinates of each dot d of each character of a character string into coordinates in a machining coordinate system with which the holes will be machined. Prior to machining, based on a character string and position information of the character string described in a machining program, central coordinates of each dot of each character of the character string are transformed into coordinates in the machining coordinate system with which the holes will be machined. Each dot d is regarded as a hole and machined. The number of times of movement of a table can be thus minimized so that the machining efficiency can be improved.

    摘要翻译: 即使在印刷电路板中加工了字符,也能够提高加工效率的加工装置。 提供了一个坐标变换单元,用于将字符串的每个字符的每个点d的中心坐标转换成加工坐标系中加工孔的坐标。 在加工之前,基于加工程序中描述的字符串的字符串和位置信息,将字符串的每个字符的每个点的中心坐标转换成加工坐标系中的加工坐标系的坐标,其中将加工孔 。 每个点d被认为是一个孔并加工。 因此,能够使台的移动次数最小化,能够提高加工效率。