公开(公告)号：US09082799B2

公开(公告)日：2015-07-14

申请号：US13623428

申请日：2012-09-20

申请人： Varian Semiconductor Equipment Associates, Inc.

发明人： William T. Weaver ,  Charles T. Carlson ,  Scott A. Smith ,  Michael A. Beck ,  Aaron P. Webb ,  James D. Strassner ,  Lawrence R. Gravell ,  Michael C. Simmons

IPC分类号： H01L21/673 ,  H01L21/68 ,  H01L21/687 ,  C23C14/04 ,  C23C14/48 ,  C23C14/50

CPC分类号： H01L21/67333 ,  C23C14/042 ,  C23C14/48 ,  C23C14/50 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68778 ,  Y10T29/49899

摘要： A carrier capable of holding one or more workpieces is disclosed. The carrier includes movable projections located along the sides of each cell in the carrier. This carrier, in conjunction with a separate alignment apparatus, aligns each workpiece within its respective cell against several alignment pins, using a multiple step alignment process to guarantee proper positioning of the workpiece in the cell. First, the workpieces are moved toward one side of the cell. Once the workpieces have been aligned against this side, the workpieces are then moved toward an adjacent orthogonal side such that the workpieces are aligned to two sides of the cell. Once aligned, the workpiece is held in place by the projections located along each side of each cell. In addition, the alignment pins are also used to align the associated mask, thereby guaranteeing that the mask is properly aligned to the workpiece.

摘要翻译： 公开了能够容纳一个或多个工件的承载件。 载体包括沿着载体中的每个单元的侧面定位的可移动凸起。 该载体与单独的对准装置一起使用多步对准工艺将其各自的电池内的每个工件对准几个对准销，以保证工件在电池中的正确定位。 首先，将工件朝向电池的一侧移动。 一旦工件已经对准该侧面，工件就移动到相邻的正交侧，使得工件与单元的两侧对齐。 一旦对准，工件通过位于每个单元的每一侧的凸起保持就位。 此外，对准销还用于对准相关联的掩模，从而保证掩模适当地对准工件。

公开(公告)号：US20140021605A1

公开(公告)日：2014-01-23

申请号：US13552375

申请日：2012-07-18

申请人： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Ming-Da Cheng

发明人： Chen-Hua Yu ,  Yung Ching Chen ,  Chien-Hsun Lee ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Ming-Da Cheng

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L25/0657 ,  H01L21/4853 ,  H01L21/68778 ,  H01L23/3142 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06565 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2224/16225 ,  H01L2924/00012 ,  H01L2924/014

摘要： Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a stick region, a first ball region coupled to a first end of the stick region, and a second ball region coupled to a second end of the stick region. The metal stud bumps include a portion that is partially embedded in a solder joint.

摘要翻译： 封装封装（PoP）器件和封装半导体管芯的方法被公开。 PoP器件包括第一封装管芯和耦合到第一封装管芯的第二封装管芯。 在第一封装模具和第二封装模具之间设置金属凸块凸块。 金属柱凸块包括一个棒状区域，一个耦合到该棒状区域的第一端的第一球形区域和一个耦合到该棒状区域的第二端的第二球形区域。 金属柱凸块包括部分嵌入焊点中的部分。

公开(公告)号：US07988817B2

公开(公告)日：2011-08-02

申请号：US11874272

申请日：2007-10-18

申请人： Hyoung Kyu Son

发明人： Hyoung Kyu Son

IPC分类号： C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC分类号： H01L21/68742 ,  H01L21/68778 ,  Y10T74/2101

摘要： A lift pin driving device and a flat panel display (FPD) manufacturing apparatus having the device are provided. The lift pin driving device can precisely move a plurality of lift pins using one motor, thus realizing a simple lift pin driving structure and a simple motor control structure. This allows a space below a chamber body of the manufacturing apparatus to be configured in a variety of ways, thus reducing the cost of equipment and the production cost of products.

摘要翻译： 提供具有该装置的升降销驱动装置和平板显示器（FPD）制造装置。 提升销驱动装置可以使用一个电动机精确地移动多个提升销，从而实现简单的升降销驱动结构和简单的电机控制结构。 这允许以各种方式构造制造装置的室主体下方的空间，从而降低设备的成本和产品的生产成本。

公开(公告)号：US07942623B2

公开(公告)日：2011-05-17

申请号：US12824956

申请日：2010-06-28

申请人： Chul-Joo Hwang ,  Sang-Do Lee

发明人： Chul-Joo Hwang ,  Sang-Do Lee

IPC分类号： H01L21/677 ,  C23C16/00 ,  C23F1/00

CPC分类号： C23C16/4585 ,  H01L21/67748 ,  H01L21/6875 ,  H01L21/68778

摘要： An apparatus includes: a process chamber for treating a substrate; a susceptor in the process chamber; a supporting frame over the susceptor; and at least one wire connected to the supporting frame.

摘要翻译： 一种装置，包括：处理基板的处理室; 处理室中的基座; 在基座上的支撑框架; 以及连接到支撑框架的至少一根线。

公开(公告)号：US07764355B2

公开(公告)日：2010-07-27

申请号：US11779571

申请日：2007-07-18

申请人： Tadahiro Ohmi ,  Yusuke Muraoka ,  Yasuyoshi Miyaji ,  Yasushi Nagashima

发明人： Tadahiro Ohmi ,  Yusuke Muraoka ,  Yasuyoshi Miyaji ,  Yasushi Nagashima

IPC分类号： G03B27/52 ,  G03B27/58 ,  G03B27/62

CPC分类号： H01L21/6875 ,  C25D11/04 ,  C25D11/16 ,  H01L21/67103 ,  H01L21/68757 ,  H01L21/68778

摘要： A stage body has a holding surface for placing a substrate thereon. A predetermined embossed configuration is formed by embossing on the holding surface, and thereafter an alumina film in an amorphous state is formed by an anodic oxidation process on the holding surface. The alumina film having an amorphous structure is dense and strong to provide high wear resistance and to substantially prevent separation electrification. This provides a substrate stage having high wear resistance and capable of preventing separation electrification.

摘要翻译： 台体具有用于在其上放置基板的保持表面。 通过在保持表面上压花来形成预定的压花构造，然后通过阳极氧化工艺在保持表面上形成非晶状态的氧化铝膜。 具有非晶结构的氧化铝膜是致密且坚固的以提供高耐磨性并且基本上防止分离带电。 这提供了具有高耐磨性并且能够防止分离带电的基底台。

公开(公告)号：US20090243988A1

公开(公告)日：2009-10-01

申请号：US12056849

申请日：2008-03-27

申请人： Ware Bedell

发明人： Ware Bedell

IPC分类号： G09G3/36

CPC分类号： H01L21/68742 ,  G02F1/1303 ,  H01L21/682 ,  H01L21/68778 ,  Y10T29/49815 ,  Y10T29/49826 ,  Y10T29/53048 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53265

摘要： A device for aligning a LCD panel having circuit elements with driver circuit card assemblies, consisting of retractable pins located around a central platform. The retractable pins extend in order to receive the LCD panel and circuit element assembly and hold it in place as the circuit elements are aligned with driver circuit card assemblies. Once aligned, the drivers and LCD panel can be bonded together. Once bonded, the pins are retracted and the LCD panel and driver assembly is released. The present invention also relates to a method of aligning LCD panels and drivers using retractable pin tools.

摘要翻译： 一种用于将具有电路元件的LCD面板与驱动器电路卡组件对准的装置，包括位于中央平台周围的可伸缩销。 可伸缩销延伸以接收LCD面板和电路元件组件，并且当电路元件与驱动器电路卡组件对准时将其保持在适当位置。 一旦对准，驱动器和LCD面板可以粘合在一起。 一旦粘合，销缩回，LCD面板和驱动器组件被释放。 本发明还涉及使用伸缩销工具对准LCD面板和驱动器的方法。

公开(公告)号：US07467901B2

公开(公告)日：2008-12-23

申请号：US11489339

申请日：2006-07-19

申请人： Kenji Kamei

发明人： Kenji Kamei

IPC分类号： G03D5/00 ,  G03F7/00 ,  H05B3/68

CPC分类号： H01L21/68778 ,  H01L21/67109 ,  H01L21/68742 ,  H01L21/6875

摘要： A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate for supporting the substrate, and a cover disposed above the bake plate and temperature-controlled for securing a heat-treating atmosphere of the bake plate. An adjusting device adjusts a space between the cover and the bake plate. A control device adjusts the space, through the adjusting device, successively to a transport space for allowing transport of the substrate, a transitional space smaller than the transport space and close to the bake plate, and a steady space smaller than the transport space and larger than the transitional space.

摘要翻译： 用于热处理基板的基板热处理装置包括：用于支撑基板的烘烤板和设置在烘烤板上方的盖子，并且用于确保烘烤板的热处理气氛的温度控制。 调节装置调节盖和烘烤板之间的空间。 控制装置通过调节装置将空间连续地调整到用于允许衬底的传送的传送空间，小于传送空间并靠近烘烤板的过渡空间以及比传送空间小的稳定空间和较大的 比过渡空间。

公开(公告)号：US20080024742A1

公开(公告)日：2008-01-31

申请号：US11779571

申请日：2007-07-18

申请人： Tadahiro Ohmi ,  Yusuke Muraoka ,  Yasuyoshi Miyaji ,  Yasushi Nagashima

发明人： Tadahiro Ohmi ,  Yusuke Muraoka ,  Yasuyoshi Miyaji ,  Yasushi Nagashima

IPC分类号： G03B27/58 ,  G03B27/52

CPC分类号： H01L21/6875 ,  C25D11/04 ,  C25D11/16 ,  H01L21/67103 ,  H01L21/68757 ,  H01L21/68778

摘要： A stage body has a holding surface for placing a substrate thereon. A predetermined embossed configuration is formed by embossing on the holding surface, and thereafter an alumina film in an amorphous state is formed by an anodic oxidation process on the holding surface. The alumina film having an amorphous structure is dense and strong to provide high wear resistance and to substantially prevent separation electrification. This provides a substrate stage having high wear resistance and capable of preventing separation electrification.

摘要翻译： 台体具有用于在其上放置基板的保持表面。 通过在保持表面上压花来形成预定的压花构造，然后通过阳极氧化工艺在保持表面上形成非晶状态的氧化铝膜。 具有非晶结构的氧化铝膜是致密且坚固的以提供高耐磨性并且基本上防止分离带电。 这提供了具有高耐磨性并且能够防止分离带电的基底台。

公开(公告)号：US20060275547A1

公开(公告)日：2006-12-07

申请号：US11421385

申请日：2006-05-31

申请人： Chung Lee ,  Atul Kumar ,  George Tzeng ,  Oanh Nguyen

发明人： Chung Lee ,  Atul Kumar ,  George Tzeng ,  Oanh Nguyen

IPC分类号： C23C16/00

CPC分类号： C23C14/50 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/68721 ,  H01L21/68778

摘要： A system for depositing a vapor phase organic compound onto a substrate, comprising a vacuum chamber comprising a wall, a wall heater in thermal communication with the wall of the vacuum chamber, at least one of an evaporative source and a transport polymerization source configured to introduce the vapor phase organic compound into the chamber, and a substrate holder disposed within the vacuum chamber, wherein the substrate holder comprises a cooled chuck, a heat transfer gas source for introducing a heat transfer gas to a space between the cooled chuck and the substrate, and a substrate clamping mechanism comprising at least one of an electrostatic, mechanical and magnetic clamping mechanism.

摘要翻译： 一种用于将气相有机化合物沉积到基底上的系统，包括真空室，包括壁，与真空室的壁热连通的壁加热器，蒸发源和运输聚合源中的至少一个，其配置成引入 所述气相有机化合物进入所述室，以及衬底保持器，其设置在所述真空室内，其中所述衬底保持器包括冷却的卡盘，用于将传热气体引入所述冷却的卡盘和所述衬底之间的空间的传热气体源， 以及包括静电，机械和磁性夹紧机构中的至少一个的衬底夹持机构。

公开(公告)号：US20060274474A1

公开(公告)日：2006-12-07

申请号：US11421389

申请日：2006-05-31

申请人： Chung Lee ,  Atul Kumar ,  George Tzeng ,  Oanh Nguyen

发明人： Chung Lee ,  Atul Kumar ,  George Tzeng ,  Oanh Nguyen

IPC分类号： H01H47/00

CPC分类号： C23C14/12 ,  C23C14/50 ,  C23C14/541 ,  H01L21/67109 ,  H01L21/68721 ,  H01L21/68778

摘要： A substrate holder for holding and cooling a substrate during a film deposition process is disclosed, wherein the substrate holder comprises a cooled chuck, and a clamping member movably associated with the cooled chuck, wherein the clamping member is movable between an unclamped position in which a substrate is removable from the substrate holder and a clamped position in which a substrate is clamped to the substrate holder substantially adjacent the cooled chuck.

摘要翻译： 公开了一种用于在膜沉积工艺期间保持和冷却衬底的衬底保持器，其中衬底保持器包括冷却的卡盘以及与冷却卡盘可移动地相关联的夹紧构件，其中夹紧构件可在松开位置之间移动， 衬底可从衬底保持器和夹持位置移除，其中衬底被夹持到衬底保持器基本上邻近冷却的卡盘。