公开(公告)号：US10353125B2

公开(公告)日：2019-07-16

申请号：US14388153

申请日：2014-06-18

申请人： LG CHEM, LTD.

发明人： Sung-Hyun Nam ,  Eun-Mi Seo ,  Seung-Hee Nam ,  Dae-Woong Lee ,  Kyun-Il Rah

IPC分类号： G02B5/30 ,  G02F1/1335 ,  C09J163/00 ,  C09J163/10 ,  C08G59/18 ,  C08G59/20 ,  C08G59/22

摘要： The present disclosure relates to a polarizing plate including an adhesive layer, a primer layer and a polyethylene terephthalate film which are sequentially formed on at least one side of a polarizer, wherein the adhesive layer in the present disclosure is formed by an active energy ray-curable adhesive including a first epoxy compound of which a homopolymer has a glass transition temperature of 120° C. or higher, a second epoxy compound of which a homopolymer has a glass transition temperature of 60° C. or lower, and a cationic photopolymerization initiator, and wherein the primer layer is formed by a primer composition including one or more binder resins selected from the group consisting of polyester and polyvinyl alcohol-based resins, and one or more cross-linking agents selected from the group consisting of acrylic cross-linking agents, epoxy-based cross-linking agents and polyvinyl alcohol-based cross-linking agents.

公开(公告)号：US20190211138A1

公开(公告)日：2019-07-11

申请号：US16146084

申请日：2018-09-28

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Yen-Chun LIU ,  Min-Chian WANG ,  Hsiang-Yen TSAO ,  Kuo-Chan CHIOU

IPC分类号： C08G59/22 ,  C08G59/50 ,  C08K3/22 ,  C08G59/24 ,  C08G59/52 ,  C08G59/56 ,  C09D163/00 ,  C09K5/14

CPC分类号： C08G59/22 ,  C08G59/226 ,  C08G59/24 ,  C08G59/245 ,  C08G59/5026 ,  C08G59/5033 ,  C08G59/52 ,  C08G59/56 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2201/001 ,  C09D163/00 ,  C09K5/14

摘要： A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.

公开(公告)号：US10344160B1

公开(公告)日：2019-07-09

申请号：US14822052

申请日：2015-08-10

申请人： The United States of America, as represented by the Secretary of the Navy

发明人： Joseph W Tsang ,  Michael Garrison

IPC分类号： C09D163/02 ,  C08L63/02 ,  C08G59/22 ,  C08G59/24 ,  C08G59/44 ,  C08G59/50 ,  C08J5/24 ,  B32B27/38 ,  B32B27/26 ,  C08L63/00 ,  C09D163/00 ,  B05C1/08 ,  B05C1/06 ,  B32B27/24 ,  B23B27/24

摘要： An hydrophobic epoxy resin composition including at least one ortho-substituted glycidyl ether, at least one ortho, ortho′-disubstituted glycidyl ether, at least one ortho, meta′-disubstituted glycidyl ether, at least one amine/aniline curing agent, and at least one organic solvent.

公开(公告)号：US10280252B2

公开(公告)日：2019-05-07

申请号：US15375792

申请日：2016-12-12

申请人： Evonik Degussa GmbH

发明人： Martina Ortelt ,  Dirk Fuchsmann ,  Eike Langkabel ,  Britta Kohlstruk ,  Jaclyn Balthasar

IPC分类号： B32B27/26 ,  B32B27/38 ,  C08J5/24 ,  C08L63/00 ,  C08G59/50 ,  C08J5/04 ,  C08G59/56 ,  C08G59/22 ,  F03D1/06

摘要： Latent epoxy resin formulations are suitable for liquid impregnation processes for production of fiber composite materials.

公开(公告)号：US10259970B2

公开(公告)日：2019-04-16

申请号：US15487158

申请日：2017-04-13

申请人： CHANG CHUN PLASTICS CO., LTD.

发明人： Gai-Chi Chen ,  Chia-En Wu ,  An-Pang Tu ,  Kuen-Yuan Hwang

IPC分类号： C09D163/00 ,  C08G65/331 ,  C08G59/06 ,  C08G59/22 ,  C08L63/00 ,  C08G59/10

摘要： The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

公开(公告)号：US10242871B2

公开(公告)日：2019-03-26

申请号：US15519696

申请日：2015-10-16

申请人： NISSAN CHEMICAL INDUSTRIES, LTD.

发明人： Tokio Nishita ,  Noriaki Fujitani ,  Rikimaru Sakamoto

IPC分类号： H01L29/08 ,  H01L21/033 ,  C08G59/22 ,  C08F20/34 ,  C08F20/58 ,  C09D133/14 ,  G03F7/004 ,  G03F7/20 ,  H01L21/027 ,  G03F7/09

摘要： There is provided a composition that a resist pattern having a reduced LWR representing variations in line width of the resist pattern, compared to conventional resist patterns, can be formed. A resist underlayer film-forming composition for lithography comprising a polymer, 0.1 to 30 parts by mass of a compound having an amino group protected with a tert-butoxycarbonyl group and an unprotected carboxyl group, or a hydrate of the compound, relative to 100 parts by mass of the polymer, and a solvent.

公开(公告)号：US10240074B2

公开(公告)日：2019-03-26

申请号：US15537519

申请日：2015-05-27

申请人： SHENGYI TECHNOLOGY CO., LTD.

发明人： Zengbiao Huang ,  Huayang Deng ,  Yongjing Xu

IPC分类号： C09J163/00 ,  C08G59/40 ,  C08K9/00 ,  C08G59/50 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C08G59/22 ,  C08G59/66 ,  C01B13/00

摘要： The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.

公开(公告)号：US20180261757A1

公开(公告)日：2018-09-13

申请号：US15911799

申请日：2018-03-05

申请人： GENERAL ELECTRIC COMPANY

发明人： Matthew Harvey Krohn ,  Kwok Pong Chan

IPC分类号： H01L41/18 ,  C08L51/08 ,  B06B1/06 ,  C08K5/5415 ,  C08K5/5419 ,  C08G77/14 ,  C08L83/06 ,  C08L63/00 ,  C08G59/30 ,  C08G59/24 ,  C08G59/22 ,  H01L41/37

CPC分类号： H01L41/183 ,  B06B1/06 ,  B06B1/0622 ,  C08G59/223 ,  C08G59/24 ,  C08G59/306 ,  C08G77/14 ,  C08K5/5415 ,  C08K5/5419 ,  C08L51/085 ,  C08L63/00 ,  C08L83/06 ,  H01L41/37

摘要： A piezoelectric composite for use in an ultrasonic transducer and a method of forming the same is provided. The composite has a piezoelectric ceramic component and a hydrophobic polymer component arranged to form a 1-3, 2-2, or 3-3 composite type. In one embodiment, the hydrophobic polymer is selected to polymerize at a moderate temperature.

公开(公告)号：US20180215864A1

公开(公告)日：2018-08-02

申请号：US15935965

申请日：2018-03-26

申请人： CARL ZEISS SMART OPTICS GMBH

发明人： Hans-Joachim Weippert

IPC分类号： C08G59/66 ,  G01N1/36 ,  C08G59/24 ,  G02B27/01 ,  F21V8/00 ,  C08G59/22 ,  C09J163/00 ,  C08G59/68

CPC分类号： C08G59/66 ,  C08G59/226 ,  C08G59/245 ,  C08G59/4021 ,  C08G59/5053 ,  C08G59/686 ,  C08K5/3445 ,  C08K5/3462 ,  C08K5/37 ,  C08K5/54 ,  C09J163/00 ,  G01N1/36 ,  G01N2001/364 ,  G02B6/0001 ,  G02B27/0172 ,  G02B2027/0178 ,  C08L63/00

摘要： A composition containing an epoxide compound with two or more epoxide groups, a thiol ester with two or more ester groups and two or more thiol groups and/or a thiol ether with two or more thiol groups, and 0.005-2 wt. %, based on the total weight of the composition, of a tertiary amine which has a 5- or 6-membered aliphatic nitrogen heterocycle, said composition containing less than 1 wt.% of a primary amine. The composition can be used as an embedding medium for microscopy and as an adhesive and to an optical element which comprises the composition.

公开(公告)号：US20180162991A1

公开(公告)日：2018-06-14

申请号：US15375792

申请日：2016-12-12

申请人： Evonik Degussa GmbH

发明人： Martina ORTELT ,  Dirk FUCHSMANN ,  Eike LANGKABEL ,  Britta KOHLSTRUK ,  Jaclyn BALTHASAR

IPC分类号： C08G59/50 ,  C08J5/24 ,  C08J5/04 ,  C08G59/22 ,  F03D1/06

CPC分类号： C08G59/506 ,  C08G59/226 ,  C08G59/5026 ,  C08G59/504 ,  C08G59/56 ,  C08J5/04 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02 ,  F03D1/0675 ,  F05B2280/6003 ,  F05B2280/6015 ,  Y02E10/721

摘要： Latent epoxy resin formulations are suitable for liquid impregnation processes for production of fibre composite materials.