公开(公告)号：US08129632B2

公开(公告)日：2012-03-06

申请号：US12453742

申请日：2009-05-20

申请人： Takao Shinoda ,  Shingo Yamaguchi

发明人： Takao Shinoda ,  Shingo Yamaguchi

IPC分类号： H01L23/045 ,  H01L23/055

CPC分类号： H04M1/0216 ,  H04M1/18

摘要： In order to provide a portable electronic device improved in water tightness by a simple method, the portable electronic device includes: a housing assembled from a plurality of housing pieces via a sealing member and having a built-in electronic circuit; and a flat cable group in which a plurality of flat cables having a plurality of electric signal lines aligned and connected to the electronic circuit are stacked in a thickness direction, and adjacent flat cables are bonded to each other via an adhesive material at least at a point in an overall length, the flat cable group being integrally molded with the sealing member of the housing at the point.

摘要翻译： 为了通过简单的方法提供改进的防水性的便携式电子设备，便携式电子设备包括：通过密封构件从多个壳体件组装并具有内置电子电路的壳体; 以及扁平电缆组，其中具有排列并连接到电子电路的多个电信号线的多条扁平电缆在厚度方向上堆叠，并且相邻的扁平电缆至少通过粘合材料彼此接合 在整个长度上指示，扁平电缆组在该点处与壳体的密封构件整体模制。

公开(公告)号：US08106312B2

公开(公告)日：2012-01-31

申请号：US12636188

申请日：2009-12-11

申请人： Takao Shinoda ,  Shingo Yamaguchi ,  Hidehiko Hizuka

发明人： Takao Shinoda ,  Shingo Yamaguchi ,  Hidehiko Hizuka

IPC分类号： H01L23/045 ,  H01L23/055

CPC分类号： H05K5/069 ,  H04M1/18 ,  Y10T29/49002

摘要： A sealing structure to seal housings includes a sealing member disposed between housings to be bonded to allow penetration of at least one signal line; and an adhesive material disposed between the signal lines penetrating the sealing member to bond the signal lines to be overlapped.

摘要翻译： 用于密封壳体的密封结构包括设置在待接合的壳体之间的密封构件，以允许穿透至少一条信号线; 以及设置在穿过密封构件的信号线之间以将要重叠的信号线结合的粘合材料。

公开(公告)号：US20090152547A1

公开(公告)日：2009-06-18

申请号：US12328717

申请日：2008-12-04

申请人： DongSam Park ,  YoungSik Cho ,  Sang-Ho Lee

发明人： DongSam Park ,  YoungSik Cho ,  Sang-Ho Lee

IPC分类号： H01L23/045 ,  H01L23/12 ,  H01L21/02

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a substrate; mounting a base integrated circuit on the substrate; forming a leadframe interposer, over the base integrated circuit, by: providing a metal sheet, mounting an integrated circuit die on the metal sheet, injecting a molded package body on the integrated circuit die and the metal sheet, and forming a ball pad, a bond finger, or a combination thereof from the metal sheet that is not protected by the molded package body; coupling a circuit package on the ball pad; and forming a component package on the substrate, the base integrated circuit, and the leadframe interposer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成衬底; 将基底集成电路安装在基板上; 在基底集成电路上形成引线框架插入件，通过：提供金属片，在金属片上安装集成电路管芯，将模制封装体注入集成电路管芯和金属片上，并形成球垫， 粘合指状物或其组合从未被模制包装体保护的金属片材; 将电路封装耦合在球垫上; 以及在基板，基底集成电路和引线框架插入件上形成部件封装。

公开(公告)号：US20050035092A1

公开(公告)日：2005-02-17

申请号：US10881909

申请日：2004-06-30

申请人： Robert Eder ,  Friedrich Schulte ,  Juergen Leib

发明人： Robert Eder ,  Friedrich Schulte ,  Juergen Leib

IPC分类号： B23K15/00 ,  H01L23/045 ,  H01L23/10 ,  H01L23/367 ,  H01L23/473

CPC分类号： B23K15/0006 ,  H01L23/045 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

摘要： The hybrid housing includes a base housing and one or more separately made functional components joined in the base housing by electron beam welding to provide a hermetically sealed hybrid housing e.g. for use under water or in aircraft or spacecraft. The separately made functional components can included e.g. a KOVAR-glass feed-through device and/or a copper or molybdenum metal block for heat dissipation. The base housing can be made of aluminum, an aluminum alloy, stainless steel or VA steel.

摘要翻译： 混合壳体包括基座壳体和通过电子束焊接接合在基座壳体中的一个或多个单独制造的功能部件，以提供密封的混合壳体，例如， 在水下或在飞机或航天器中使用。 单独制成的功能组件可以包括例如。 KOVAR玻璃馈通装置和/或用于散热的铜或钼金属块。 底座可以由铝，铝合金，不锈钢或VA钢制成。

公开(公告)号：US5574959A

公开(公告)日：1996-11-12

申请号：US306955

申请日：1994-09-16

申请人： Masanori Tsujioka ,  Junzoh Matsumura

发明人： Masanori Tsujioka ,  Junzoh Matsumura

IPC分类号： H01L21/48 ,  H01L23/045 ,  H01L23/047 ,  H01L23/06 ,  H01L31/0203 ,  H01S5/022 ,  B22F3/16

CPC分类号： H01L31/0203 ,  H01L21/4817 ,  H01L23/045 ,  H01L23/047 ,  H01L23/06 ,  H01S5/02216 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01S5/02469

摘要： A metal casing for a semiconductor device is manufactured by a powder metallurgy injection molding process which uses infiltration. The metal casing includes a base member and an enclosure member arranged on the base member. The base member and the enclosure member are formed of an alloy including 20 to 50 percent by volume of copper, equal to or less than 1 percent by weight of nickel and remainder of tungsten or molybdenum. The metal casing is manufactured as a net-shape product by a process which includes the steps of mixing tungsten powder and nickel powder having average particles sizes equal to or less than 40 .mu.m so as to form mixed metal powder, kneading the mixed metal powder with an organic binder so as to form an admixture, injection molding said admixture so as to form a predetermined green shape, debinderizing said green shape, applying surface powder to at least one surface of the green shape so as to prevent effusion of copper during infiltration and infiltrating copper into the green shape so as to produce a net-shape product.

摘要翻译： 用于半导体器件的金属外壳通过使用渗透的粉末冶金注塑工艺制造。 金属外壳包括基座构件和布置在基座构件上的外壳构件。 基部构件和外壳构件由包含20至50体积％的铜，等于或小于1重量％的镍和其余的钨或钼的合金形成。 通过包括以下步骤制造金属外壳作为网状产品，该方法包括将钨粉末和平均粒径等于或小于40μm的镍粉混合以形成混合金属粉末，将混合的金属粉末 与有机粘合剂一起形成混合物，注射成型所述混合物以形成预定的绿色形状，剥离所述绿色形状，将表面粉末施加至至少一个绿色表面，以防止渗透时铜渗出 并将铜浸入绿色形状以产生网状产品。

公开(公告)号：US5111277A

公开(公告)日：1992-05-05

申请号：US677078

申请日：1991-03-29

申请人： Manuel Medeiros, III ,  Jay S. Greenspan

发明人： Manuel Medeiros, III ,  Jay S. Greenspan

IPC分类号： H01L23/06 ,  H01L23/043 ,  H01L23/045 ,  H01L23/08

CPC分类号： H01L23/043 ,  H01L23/045 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/16195

摘要： A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.

摘要翻译： 提供了一种用于封装电子设备的表面贴装封装。 该包装具有包含多个孔的陶瓷框架。 铜 - 钨复合金属部件结合到陶瓷框架上，并分别延伸穿过每个孔。 金属部件可以包括用于接合的凸缘和延伸到每个孔中的基座。

公开(公告)号：US4151479A

公开(公告)日：1979-04-24

申请号：US895978

申请日：1978-04-13

申请人： Tatsuo Baba

发明人： Tatsuo Baba

IPC分类号： H03F1/30 ,  H01L23/045 ,  H01L23/36 ,  H01L23/64 ,  H03F3/16 ,  H03F3/30 ,  H03F3/34 ,  H03F3/345 ,  H03F3/21

CPC分类号： H01L23/045 ,  H01L23/36 ,  H01L23/647 ,  H01L24/49 ,  H03F3/16 ,  H03F3/3001 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48464 ,  H01L2224/49107 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3011

摘要： A low frequency power amplifier uses MOS FET's each having a semiconductor device unit including a source electrode, a drain electrode and an insulated gate electrode filled in a can type casing with the source electrode being electrically connected to the can type casing. When the MOS FET having its source electrode connected to the can type casing is mounted on a heat sink and operated in a source follower configuration, a stray capacity between the can-shaped casing and the heat sink is connected in parallel with a load so that the amplifier oscillates. The heat sink is grounded through an impedance element and the stray capacity is isolated from the load to prevent the oscillation.

摘要翻译： 低频功率放大器使用各自具有半导体器件单元的MOS FET，该半导体器件单元包括源极电极，漏极电极和填充在罐型壳体中的绝缘栅电极，源电极电连接到罐型壳体。 当其源电极连接到罐型壳体的MOS FET安装在散热器上并且以源极跟随器构造操作时，罐形壳体和散热器之间的杂散电容与负载并联连接，使得 放大器振荡。 散热器通过阻抗元件接地，杂散电容与负载隔离，以防止振荡。

公开(公告)号：US3828425A

公开(公告)日：1974-08-13

申请号：US8135470

申请日：1970-10-16

申请人： TEXAS INSTRUMENTS INC

发明人： MANUS D

IPC分类号： H01L21/58 ,  H01L23/045 ,  H01L23/31 ,  H01L23/488 ,  H01L23/552 ,  B01J17/00

CPC分类号： H01L24/33 ,  H01L23/045 ,  H01L23/3157 ,  H01L23/488 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  Y10T29/49144 ,  Y10T29/49169 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/013 ,  H01L2924/00013

摘要： A semiconductor package fabricated from metals of atomic number less than 32 for use in any environment including a high radiation environment, and a process for fabricating a semiconductor package with reproducible electrical characteristics using mass production techniques. In the method, a base member, such as a metal header having metal terminal conductors and an area for attaching a semiconductor body, is first coated at least in part with a Soft Metal, such as copper, and then coated with a Hard Metal, such as nickel, or if a molybdenum-manganese metallized ceramic header is used, at least the metallization is coated with a metal strike, such as nickel, prior to coating the header with the Soft and Hard Metals, and then the base member is heat treated to form a header having an improved semiconductor body attachment area and electrical conductors.

摘要翻译： 由包括高辐射环境在内的任何环境中使用的原子序数小于32的金属制成的半导体封装，以及使用大规模生产技术制造具有可再现电特性的半导体封装的工艺。 在该方法中，首先用诸如铜的软金属至少部分地涂覆诸如具有金属端子导体的金属集管和用于附接半导体主体的区域的基底构件，然后涂覆有硬金属， 例如镍，或者如果使用钼 - 锰金属化陶瓷集管，则在用软和硬金属涂覆集管之前，至少金属化被涂覆有诸如镍的金属冲击，然后基体是热的 处理以形成具有改进的半导体本体附接区域和电导体的集管。

公开(公告)号：US3750271A

公开(公告)日：1973-08-07

申请号：US3750271D

申请日：1972-01-31

申请人： MICROSYSTEMS INT LTD

发明人： DUPUIS J

IPC分类号： H01L23/045 ,  B01J17/00

CPC分类号： H01L23/045 ,  H01L2924/0002 ,  Y10T29/49169 ,  H01L2924/00

摘要： This invention relates to an improved transistor structure, particularly a ''''12-type'''' germanium alloy transistor. The invention also relates to a method of manufacturing such a transistor, wherein the semiconductor device is free to move during attachment thereto of the connecting leads, thereby eliminating stress upon the device.

摘要翻译： 本发明涉及一种改进的晶体管结构，特别是涉及一种“12型”锗合金晶体管。 本发明还涉及一种制造这种晶体管的方法，其中半导体器件在连接引线的附接期间自由移动，从而消除器件上的应力。

公开(公告)号：US3735208A

公开(公告)日：1973-05-22

申请号：US3735208D

申请日：1971-08-26

申请人： RCA CORP

发明人： ROSWELL A ,  CLYMER G

IPC分类号： H01L23/34 ,  H01L21/52 ,  H01L21/60 ,  H01L23/045 ,  H01L3/00 ,  H01L5/00

CPC分类号： H01L24/29 ,  H01L23/045 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： The device includes a semiconductor die joined to a thermally conductive substrate with a solder having a high lead content. An enclosure surrounds the die and is sealed to the substrate. A substantially nonoxidizing atmosphere is provided within the enclosure.

摘要翻译： 该器件包括与具有高铅含量的焊料接合到导热衬底的半导体管芯。 外壳围绕模具并被密封到基底。 在外壳内提供基本上非氧化的气氛。