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公开(公告)号：US20210006215A1
公开(公告)日：2021-01-07
申请号：US16915766
申请日：2020-06-29
Applicant: STMicroelectronics SA , STMicroelectronics (Alps) SAS , STMicroelectronics razvoj polprevodnikov d.o.o.
Inventor： Kosta Kovacic , Christophe Grundrich , Bruno LEDUC , Anton Stern
Abstract: A method for controlling a signal envelope shape of modulation pulses in a driver of a wireless transmitter includes supplying a first voltage to the driver during a non-modulated state, supplying a second voltage configurable by a configurable modulation index value to the driver during a modulated state, switching between the non-modulated state and the modulated state comprising setting the modulation index value to configure the second voltage level at the same level as the first voltage and then switching between supplying the first voltage to the driver and supplying the second voltage to the driver, and filtering to a limited bandwidth the variations of the second voltage resulting from configuring the modulation index value.
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公开(公告)号：US10759168B2
公开(公告)日：2020-09-01
申请号：US16357077
申请日：2019-03-18
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US10543504B2
公开(公告)日：2020-01-28
申请号：US15636491
申请日：2017-06-28
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
Abstract: A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US10281512B2
公开(公告)日：2019-05-07
申请号：US15387370
申请日：2016-12-21
Applicant: STMicroelectronics S.r.l. , STMicroelectronics (Crolles 2) SAS , STMicroelectronics (Rousset) SAS
Inventor： Antonino Conte , Enrico Castaldo , Raul Andres Bianchi , Francesco La Rosa
Abstract: A method can be used for testing a charge-retention circuit for measurement of a time interval having a storage capacitor coupled between a first biasing terminal and a floating node, and a discharge element coupled between the floating node and a reference terminal. The discharge element is configured to implement discharge of a charge stored in the storage capacitor by leakage through a corresponding dielectric. The method includes biasing the floating node at a reading voltage, detecting a biasing value of the reading voltage, implementing an operation of integration of the discharge current in the discharge element with the reading voltage kept constant at the biasing value, and determining an effective resistance value of the discharge element as a function of the operation of integration.
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公开(公告)号：US10272684B2
公开(公告)日：2019-04-30
申请号：US15253601
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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Patent Agency Ranking
公开(公告)号：US10264667B2
公开(公告)日：2019-04-16
申请号：US14310601
申请日：2014-06-20
Applicant: STMicroelectronics, Inc. , STMicroelectronics S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Steve Bush , Faiz Sherman
Abstract: The present disclosure is directed to a system that is configured to eject fluid vertically away from a thermal microfluidic die for use with scented oils or other fluids. The die is coupled to a rigid planar support board that separates the die from a reservoir of the fluid. The support board includes an opening that is lined with an inert liner that protects an interior surface of the support board from the fluid. The support board includes contact to an external power supply and contacts to the die on a first surface. The die is coupled to this first surface such that the second surface remains free of electrical connections.
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57.发明申请公开(公告)号：US20180063638A1
公开(公告)日：2018-03-01
申请号：US15473812
申请日：2017-03-30
Applicant: STMicroelectronics (Rousset) SAS , STMicroelectronics Design and Application S.R.O. , STMicroelectronics (Alps) SAS
Inventor： Jean Claude Bini , Dragos Davidescu , Igor Cesko , Jonathan Cottinet
CPC classification number: H04R3/005 , G10K11/346 , H04R1/406 , H04R3/04 , H04R19/005 , H04R2201/003 , H04R2430/23
Abstract: Several first digital streams of first digital samples at a first sampling frequency are processed to issue corresponding stream that are converted into second digital streams sampled at a second sampling frequency lower than said first sampling frequency. At least one delay to be applied to at least one first digital stream to satisfy a condition on the second digital streams is determined and applied to at least one first digital stream before converting. The converting operation performed is decimation filtering of the first digital streams. The application of the at least one delay to at least one first steam involves skipping a number of first digital samples in the at least one first digital stream. The number skipped depends on the value of the at least one delay. Samples that are skipped are not delivered for decimation filtering.
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公开(公告)号：US09543214B2
公开(公告)日：2017-01-10
申请号：US14526081
申请日：2014-10-28
Inventor： Denis Rideau , Elise Baylac , Emmanuel Josse , Pierre Morin , Olivier Nier
IPC: H01L21/8234 , H01L21/84 , H01L21/762 , H01L29/78 , H01L21/02 , H01L21/265 , H01L21/3115 , H01L21/308 , H01L21/3105 , H01L21/324 , H01L27/12
CPC classification number: H01L21/823481 , H01L21/02356 , H01L21/02532 , H01L21/265 , H01L21/26506 , H01L21/3081 , H01L21/3105 , H01L21/31155 , H01L21/324 , H01L21/76224 , H01L21/76237 , H01L21/823431 , H01L21/845 , H01L27/1203 , H01L29/7831 , H01L29/7846 , H01L29/7847
Abstract: The invention concerns a method of forming a semiconductor layer having uniaxial stress including: forming, in a semiconductor structure having a stressed semiconductor layer, one or more first isolation trenches in a first direction for delimiting a first dimension of at least one transistor to be formed in said semiconductor structure; forming, in the semiconductor structure, one or more second isolation trenches in a second direction for delimiting a second dimension of the at least one transistor, the first and second isolation trenches being at least partially filled with an insulating material; and before or after the formation of the second isolation trenches, decreasing the viscosity of the insulating material in the first isolation trenches by implanting atoms of a first material into the first isolation trenches, wherein atoms of the first material are not implanted into the second isolation trenches.
Abstract translation: 本发明涉及一种形成具有单轴应力的半导体层的方法，包括：在具有应力半导体层的半导体结构中形成在第一方向上的一个或多个第一隔离沟槽，以限定待形成的至少一个晶体管的第一维度 在所述半导体结构中; 在所述半导体结构中，在第二方向上形成用于限定所述至少一个晶体管的第二尺寸的一个或多个第二隔离沟槽，所述第一和第二隔离沟槽至少部分地填充有绝缘材料; 并且在形成第二隔离沟槽之前或之后，通过将第一材料的原子注入到第一隔离沟槽中来降低第一隔离沟槽中的绝缘材料的粘度，其中第一材料的原子未被注入第二隔离层 沟渠
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59.发明授权Proximity sensor including reference detector for stray radiation detection 有权接近传感器，包括用于杂散辐射检测的参考检测器公开(公告)号：US09535157B2
公开(公告)日：2017-01-03
申请号：US14493553
申请日：2014-09-23
Applicant: STMicroelectronics (Research & Development) Limited , STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Crolles 2) SAS
Inventor： Adam Caley , Pierre-Jean Parodi-Keravec , Olivier Le Briz , Sandrine Lhostis
CPC classification number: G01S7/4811 , G01S7/497 , G01S17/026 , G01S17/36
Abstract: A proximity sensor includes a radiation source configured to emit a primary radiation beam and a primary detector configured to pick up a reflected primary radiation beam. The radiation source is further configured to emit stray radiation. The sensor further includes a reference detector arranged to receive the stray radiation. The stray radiation may, for example, be emitted from either a side of the radiation source or a bottom of the radiation source.
Abstract translation: 接近传感器包括被配置为发射主辐射束的辐射源和被配置为拾取反射的一次辐射束的主检测器。 辐射源还被配置成发射杂散辐射。 传感器还包括布置成接收杂散辐射的参考检测器。 杂散辐射可以例如从辐射源的一侧或辐射源的底部发射。
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公开(公告)号：US09401349B2
公开(公告)日：2016-07-26
申请号：US14723893
申请日：2015-05-28
Applicant: STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Malta) Ltd , STMicroelectronics S.r.l.
Inventor： Angelo Crobu , Kenneth Fonk , Romain Coffy
CPC classification number: H01L25/18 , G01L19/0084 , G01L19/147 , G01L19/148 , H01L23/24 , H01L23/3157 , H01L24/10 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/10135 , H01L2224/10165 , H01L2224/1319 , H01L2224/16145 , H01L2224/26122 , H01L2224/26135 , H01L2224/29007 , H01L2224/29021 , H01L2224/29036 , H01L2224/32014 , H01L2224/32111 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/48106 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49175 , H01L2224/73207 , H01L2224/73257 , H01L2224/73265 , H01L2224/83192 , H01L2224/83855 , H01L2225/06506 , H01L2225/0651 , H01L2225/06568 , H01L2225/06575 , H01L2924/00014 , H01L2924/14 , H01L2924/146 , H01L2924/16151 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
Abstract: A stack of chips is formed by a first integrated-circuit chip and a second integrated-circuit chip. The chips have opposing faces which are separated from each other by an interposed spacer. The spacer is fastened by adhesion to only one of the opposing faces. The opposing faces are fastened to each other by a local adhesive which is separate from spacer.
Abstract translation: 一堆芯片由第一集成电路芯片和第二集成电路芯片形成。 芯片具有通过插入的间隔件彼此分离的相对面。 间隔件通过粘合固定到只有一个相对的面。 相对的面通过与间隔物分离的局部粘合剂彼此紧固。
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