公开(公告)号：US07839156B2

公开(公告)日：2010-11-23

申请号：US12046879

申请日：2008-03-12

Applicant: Hiroshi Yamada ,  Masaru Suzuki

Inventor： Hiroshi Yamada ,  Masaru Suzuki

IPC: G01R31/02

CPC classification number: G01R31/2891

Abstract: An probe tip position detecting method detects tip positions of a plurality of probes by using a tip position detecting device including a sensor unit for detecting tips of the probes and a movable contact body belonging to the sensor unit, the method used in inspecting electrical characteristics of an object to be inspected by bringing the object supported on a movable mounting table into electrical contact with the probes. The method includes a first step for moving the tip position detecting device by using the mounting table to thereby bring the contact the object into contact with the tips of the probes; a second step for further moving the mounting table to thereby move the contact body toward the sensor unit without causing elastic deformation to the probes; and a third step of determining a movement starting position of the contact body as the tip positions of the probes.

Abstract translation: 探针尖端位置检测方法通过使用包括用于检测探针的尖端的传感器单元和属于传感器单元的可动接触体的尖端位置检测装置来检测多个探针的尖端位置，该方法用于检查 通过将支撑在可移动安装台上的物体与探针电接触来检查物体。 该方法包括：第一步骤，通过使用安装台移动尖端位置检测装置，从而使物体与探针的尖端接触; 第二步骤，用于进一步移动安装台，从而使接触体朝向传感器单元移动，而不会对探针造成弹性变形; 以及确定接触体的移动开始位置作为探针的尖端位置的第三步骤。

公开(公告)号：US20100283864A1

公开(公告)日：2010-11-11

申请号：US12776016

申请日：2010-05-07

Applicant: Jun KAWAI ,  Katsutoshi Yano ,  Toshiaki Gomi ,  Hiroshi Yamada

Inventor： Jun KAWAI ,  Katsutoshi Yano ,  Toshiaki Gomi ,  Hiroshi Yamada

IPC: H04N5/228

CPC classification number: H04N5/247 ,  G06T1/00 ,  H04N5/23238

Abstract: An image processing system including a plurality of image capture units and an image processing apparatus, each of image capture units including a camera taking image data, a storage unit storing use part information indicative of a use part of the image data and importance degree calculated per use part, an image clipping unit clipping segment image data serving as the use part from the image data, a transmit image data generating unit performing image processing according to the importance degree of the use part to generate transmit image data, and a transmitting unit transmitting the transmit image data, and the image processing apparatus including a network interface unit inputting a plurality of pieces of the transmit image data, an image generating unit generating the combined image data based on the plurality of pieces of transmit image data, and an display unit outputting the combined image data.

Abstract translation: 一种图像处理系统，包括多个图像捕获单元和图像处理装置，每个图像捕获单元包括拍摄图像数据的相机，存储单元，存储指示图像数据的使用部分的使用部分信息和每个所计算的重要程度 使用部分，图像剪辑单元，从图像数据剪辑用作使用部分的片段图像数据，发送图像数据生成单元，根据使用部分的重要程度执行图像处理以生成发送图像数据;发送单元发送 发送图像数据和包括输入多个发送图像数据的网络接口单元的图像处理装置，基于多个发送图像数据生成组合图像数据的图像生成单元和显示单元 输出组合的图像数据。

公开(公告)号：US20100254426A1

公开(公告)日：2010-10-07

申请号：US12730811

申请日：2010-03-24

Applicant: Tomomi OKAMOTO ,  Hiroshi Yamada ,  Ryuji Ito ,  Osamu Higashi

Inventor： Tomomi OKAMOTO ,  Hiroshi Yamada ,  Ryuji Ito ,  Osamu Higashi

IPC: G01K13/00

CPC classification number: G01K1/14 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: There is provided a heat sink for measuring temperature of electronic component. The heat sink includes a heat radiating plate, a fin, a heat receiving plate, and a temperature detector. The heat radiating plate has a first surface that receives heat from the electronic component. The fin is for radiating heat energy conducting through the heat radiating plate and is connected to the heat radiating plate. The heat receiving plate arranged apart from the heat radiating plate has a second surface movable to be parallel to the first surface. The temperature detector that detects a temperature is disposed on the heat receiving plate.

Abstract translation: 提供了用于测量电子部件的温度的散热器。 散热片包括散热板，散热片，受热板和温度检测器。 散热板具有从电子部件接收热量的第一表面。 散热片用于散发通过散热板传导的热能，并连接到散热板。 与散热板隔开的热接收板具有可平行于第一表面移动的第二表面。 检测温度的温度检测器设置在受热板上。

公开(公告)号：US07806216B2

公开(公告)日：2010-10-05

申请号：US11878281

申请日：2007-07-23

Applicant: Daisuke Tokumura ,  Toshihiko Kamio ,  Yuuji Watanuki ,  Shoji Yamamoto ,  Mikio Uchiyama ,  Hiroshi Yamada ,  Hiroyuki Maeda

Inventor： Daisuke Tokumura ,  Toshihiko Kamio ,  Yuuji Watanuki ,  Shoji Yamamoto ,  Mikio Uchiyama ,  Hiroshi Yamada ,  Hiroyuki Maeda

IPC: B62K21/08

CPC classification number: B60R13/00 ,  B60R13/10 ,  B60R13/105

Abstract: A vehicle number plate that allows a steering damper to be disposed without impairing the functions of the number plate, and is less susceptible to an effect of cross wind. The vehicle includes a front fork, which suspends a front wheel, disposed steerably on a head pipe on a vehicle body and a steering mechanism including a handlebar mounted on the front fork. The number plate is marked with a competition identification number and is disposed at a front portion of a fork bridge including a top bridge and a bottom bridge to connect left- and right-hand portions of the front fork. In the vehicle, the steering damper is disposed between the head pipe and the bottom bridge. The number plate includes a protruded portion that protrudes forwardly at a center thereof and narrows toward a lower portion, the lower portion covering an area forward of the steering damper.

Abstract translation: 能够在不损害铭牌的功能的情况下设置转向阻尼器的车辆编号板，并且不易受到横风的影响。 该车辆包括前叉，其将前轮悬挂在车身上的头管上，以及包括安装在前叉上的把手的转向机构。 铭牌上标有比赛识别号，并配置在包括顶桥和底桥的叉桥的前部，以连接前叉的左右两部分。 在车辆中，转向阻尼器设置在头管和底桥之间。 数字板包括在其中心向前突出并朝向下部变窄的突出部分，下部覆盖转向阻尼器前方的区域。

公开(公告)号：US07759779B2

公开(公告)日：2010-07-20

申请号：US12104516

申请日：2008-04-17

Applicant: Kazuo Okada ,  Hiroyuki Shinogi ,  Yoshinori Seki ,  Hiroshi Yamada

Inventor： Kazuo Okada ,  Hiroyuki Shinogi ,  Yoshinori Seki ,  Hiroshi Yamada

IPC: H01L23/02

CPC classification number: H01L24/97 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12043 ,  H01L2924/15311 ,  H01L2924/00

Abstract: The invention enhances moisture resistance between a supporting body and an adhesive layer to enhance the reliability of a semiconductor device. A semiconductor device of the invention has a first insulation film formed on a semiconductor element, a first wiring formed on the first insulation film, a supporting body formed on the semiconductor element with an adhesive layer being interposed therebetween, a third insulation film covering the back surface of the semiconductor element onto the side surface thereof and the side surface of the adhesive layer, a second wiring connected to the first wiring and extending onto the back surface of the semiconductor element with the third insulation film being interposed therebetween, and a protection film formed on the second wiring.

Abstract translation: 本发明提高了支撑体和粘合剂层之间的耐湿性，以提高半导体器件的可靠性。 本发明的半导体器件具有形成在半导体元件上的第一绝缘膜，形成在第一绝缘膜上的第一布线，形成在半导体元件上的支撑体，其间夹有粘合剂层，覆盖背面的第三绝缘膜 半导体元件的侧表面和粘合剂层的侧表面上的第二布线，连接到第一布线并且延伸到半导体元件的背表面上并且第三绝缘膜插入其间的第二布线，以及保护膜 形成在第二布线上。

公开(公告)号：US20100177154A1

公开(公告)日：2010-07-15

申请号：US12648482

申请日：2009-12-29

Applicant: Emi Ninomiya ,  Hiroshi Yamada ,  Katsuhiko Igarashi

Inventor： Emi Ninomiya ,  Hiroshi Yamada ,  Katsuhiko Igarashi

IPC: B41J2/335

CPC classification number: B41J2/3351 ,  B41J2/33515 ,  B41J2/3355 ,  B41J2/33575 ,  C03C3/062 ,  C03C8/04 ,  C03C8/18

Abstract: To provide a thermal head which provides an excellent adhesion between the common electrode and the heat element, and in which the content of Pb is sufficiently reduced. A thermal head 5, comprising a substrate 7, a glaze layer 3 provided on the substrate 7, a common electrode 4 provided on the glaze layer 3, a heat element 1 provided on the common electrode 4 and the glaze layer 3, and lead electrodes 2a and 2b provided on the heat element 1, wherein the common electrode 4 includes an electrically conductive material composed of metal and a glass frit, and the glass frit contains 15 to 35% by mass of ZnO, 14 to 34% by mass of SiO2, 2 to 25% by mass of Al2O3, 2 to 15% by mass of TiO2, 5 to 25% by mass of CaO, and 7 to 27% by mass of BaO.

Abstract translation: 提供一种在公共电极和加热元件之间提供优异的粘附性的热敏头，并且其中Pb的含量充分降低。 热敏打印头5，包括基板7，设置在基板7上的釉层3，设置在釉层3上的公共电极4，设置在公共电极4上的加热元件1和釉层3，以及引线电极 2a和2b设置在加热元件1上，其中公共电极4包括由金属和玻璃料构成的导电材料，玻璃料含有15〜35质量％的ZnO，14〜34质量％的SiO 2 ，2〜25质量％的Al 2 O 3，2〜15质量％的TiO 2，5〜25质量％的CaO和7〜27质量％的BaO。

公开(公告)号：US20100164086A1

公开(公告)日：2010-07-01

申请号：US12376917

申请日：2007-08-02

Applicant: Takashi Noma ,  Yuichi Morita ,  Hiroshi Yamada ,  Kazuo Okada ,  Katsuhiko Kitagawa ,  Noboru Okubo ,  Shinzo Ishibe ,  Hiroyuki Shinogi

Inventor： Takashi Noma ,  Yuichi Morita ,  Hiroshi Yamada ,  Kazuo Okada ,  Katsuhiko Kitagawa ,  Noboru Okubo ,  Shinzo Ishibe ,  Hiroyuki Shinogi

IPC: H01L25/065 ,  H01L23/488 ,  H01L21/60 ,  H01L21/77 ,  H01L23/52

CPC classification number: H01L25/105 ,  B81B7/007 ,  B81C1/00238 ,  H01L23/13 ,  H01L23/481 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/3511 ,  H01L2924/00

Abstract: This invention is directed to offer a package type semiconductor device that can realize a smaller size device and its manufacturing method as well as a small stacked layer type semiconductor device and its manufacturing method. A device component 1 and a pad electrode 4 electrically connected with the device component 1 are formed on a semiconductor substrate 2. A supporting member 7 is bonded to a surface of the semiconductor substrate 2 through an adhesive layer 6. There is formed a through-hole 15 in the supporting member 7 penetrating from its top surface to a back surface. Electrical connection with another device is made possible through the through-hole 15. A depressed portion 12 is formed in a partial region of the top surface of the supporting member 7. Therefore, all or a portion of another device or a component can be disposed utilizing a space in the depressed portion 12. When a stacked layer type semiconductor device is formed, stacking is made by fitting a portion of a semiconductor device 50 in an upper layer to an inside of the depressed portion 12.

Abstract translation: 本发明旨在提供一种能够实现较小尺寸的器件及其制造方法的封装型半导体器件以及小型堆叠层型半导体器件及其制造方法。 在半导体基板2上形成与器件部件1电连接的器件部件1和焊盘电极4.支撑部件7通过粘接层6与半导体基板2的表面接合。 支撑构件7中的孔15从其顶表面穿透到后表面。 通过通孔15可实现与另一装置的电连接。凹部12形成在支撑构件7的上表面的部分区域中。因此，可以设置其他装置或部件的全部或一部分 利用凹陷部分12中的空间。当形成层叠型半导体器件时，通过将上层的半导体器件50的一部分安装到凹陷部分12的内部来进行堆叠。

公开(公告)号：US20100144951A1

公开(公告)日：2010-06-10

申请号：US11815321

申请日：2006-02-01

Applicant: Hiroshi Yamada ,  Kazuhiro Yanagisawa

Inventor： Hiroshi Yamada ,  Kazuhiro Yanagisawa

IPC: C08K3/04

CPC classification number: C08K3/04 ,  C08C1/04 ,  C08J3/226 ,  C08J2321/00 ,  C08J2407/00 ,  C08K3/013 ,  C08L7/00 ,  C08L21/00

Abstract: A natural rubber wet masterbatch rubber composition comprising a mixture of a natural rubber latex with a slurry solution containing a carbon black dispersed therein, which satisfies the followings: (1) a CATB specific surface area (m2/g) in the range of 60 0.41×CTAB+81, and (4) a compounding amount of 10 to 100 parts by mass relative to 100 parts by mass of natural rubber. The natural rubber wet masterbatch rubber composition can be suitably used for improving the resistance to fracture and to crack propagation of a tire, a steel coating rubber for a rubber product for industrial use, and the like.

Abstract translation: 一种天然橡胶湿母料橡胶组合物，其包含天然橡胶胶乳与其中分散有炭黑的浆液的混合物，其满足以下条件：（1）CATB比表面积（m2 / g） CTAB <110，（2）在55 <24M4DBP <75的范围内的24M4DBP（m3 / 100g），（3）具有TINT> 0.41×CTAB +的关系的CATB比表面积和着色强度（TINT） 81和（4）相对于100质量份天然橡胶为10〜100质量份的配合量。 天然橡胶湿母粒橡胶组合物可以适用于提高轮胎的耐断裂性和裂纹扩展性，用于工业用橡胶制品的钢涂层橡胶等。

公开(公告)号：US20100134325A1

公开(公告)日：2010-06-03

申请号：US12585240

申请日：2009-09-09

Applicant: Toshiaki Gomi ,  Seiya Shimizu ,  Hiroshi Yamada

Inventor： Toshiaki Gomi ,  Seiya Shimizu ,  Hiroshi Yamada

IPC: G06T7/00 ,  G08G1/123 ,  G06T15/00 ,  H04N7/18

CPC classification number: G06T15/205 ,  B60R1/00 ,  B60R2300/105 ,  B60R2300/302 ,  B60R2300/303 ,  B60R2300/607 ,  G03B37/04 ,  G06T3/4038 ,  G06T19/00 ,  G06T2207/30252

Abstract: An image processing apparatus, includes: a state information obtaining unit obtaining state information that indicates a state of driving operation of the vehicle; an image storage unit storing a plurality of two-dimensional image data pieces obtained from the plurality of imaging devices whose viewing fields partly overlap with each other; a specifying unit compositing a plurality of two-dimensional image data pieces into a shape of a three-dimensional projection plane, and then specifying, in correspondence to the state information, a compositing method for overlapping portions of viewing fields to be used for transformation from a three-dimensional image into projection image data viewed from a position of a given viewpoint along a given line-of-sight direction; and an image transformation unit transforming the plurality of two-dimensional image data pieces into projection image data viewed from the position of the given viewpoint along the given line-of-sight direction, by using the compositing method.

Abstract translation: 一种图像处理装置，包括：状态信息获取单元，获取指示车辆的驾驶操作的状态的状态信息; 存储从所述多个成像装置获得的多个二维图像数据的图像存储单元，所述多个成像装置的视场彼此部分重叠; 指定单元，将多个二维图像数据段合成三维投影平面的形状，然后根据状态信息指定用于重叠用于转换的视野的部分的合成方法 从给定视点的位置沿着给定的视线方向观看的投影图像数据中的三维图像; 以及图像变换单元，通过使用所述合成方法，将所述多个二维图像数据片段变换成从给定视点的位置沿着给定的视线方向观看的投影图像数据。

公开(公告)号：US07726864B2

公开(公告)日：2010-06-01

申请号：US11103437

申请日：2005-04-12

Applicant: Yasushi Hara ,  Chikara Nishio ,  Makoto Abe ,  Masashi Hirabayashi ,  Hiroshi Yamada ,  Toshikazu Takahashi ,  Akira Tanaka

Inventor： Yasushi Hara ,  Chikara Nishio ,  Makoto Abe ,  Masashi Hirabayashi ,  Hiroshi Yamada ,  Toshikazu Takahashi ,  Akira Tanaka

IPC: F21V7/04

CPC classification number: G02B6/002 ,  G02B6/0016 ,  G02B6/0031 ,  G02B6/0036 ,  G02B6/0038 ,  G02B6/0043 ,  G02B6/0053 ,  Y10S385/901

Abstract: A reflector has a curved part covering the light source and a pair of end parts extending at the two sides of the curved part. The inside surface of each end part has a plurality of substantially parallel projections or depressions. The light-guiding plate has an incident surface and an emission surface substantially perpendicular to the incident surface, the incident surface having a plurality of projections or depressions extending substantially parallel to the emission surface. Also, the reflection surface of the light-guiding plate has projections.

Abstract translation: 反射器具有覆盖光源的弯曲部分和在弯曲部分的两侧延伸的一对端部。 每个端部的内表面具有多个基本上平行的突起或凹陷。 导光板具有入射表面和基本上垂直于入射表面的发射表面，入射表面具有基本上平行于发射表面延伸的多个突起或凹陷。 此外，导光板的反射面具有突起。