Method of removing contaminants from a coating surface comprising an oxide or fluoride of a group IIIB metal
    53.
    发明授权
    Method of removing contaminants from a coating surface comprising an oxide or fluoride of a group IIIB metal 有权
    从包含IIIB族金属的氧化物或氟化物的涂层表面除去污染物的方法

    公开(公告)号:US08016948B2

    公开(公告)日:2011-09-13

    申请号:US12284540

    申请日:2008-09-22

    IPC分类号: B08B3/04

    摘要: Disclosed herein is a cleaning method useful in removing contaminants from a surface of a coating which comprises an oxide or fluoride of a Group III B metal. Typically the coating overlies an aluminum substrate which is present as part of a semiconductor processing apparatus. The coating typically comprises an oxide or a fluoride of Y, Sc, La, Ce, Eu, Dy, or the like, or yttrium-aluminum-garnet (YAG). The coating may further comprise about 20 volume % or less of Al2O3.

    摘要翻译: 本文公开了一种可用于从包含IIIBB族金属的氧化物或氟化物的涂层表面除去污染物的清洁方法。 通常,涂层覆盖作为半导体处理装置的一部分存在的铝基板。 涂层通常包含Y,Sc,La,Ce,Eu,Dy等的氧化物或氟化物,或钇 - 铝 - 石榴石(YAG)。 涂层可以进一步包含约20体积%或更少的Al 2 O 3。

    HIGH TEMPERATURE ELECTROSTATIC CHUCK BONDING ADHESIVE
    54.
    发明申请
    HIGH TEMPERATURE ELECTROSTATIC CHUCK BONDING ADHESIVE 有权
    高温静电胶粘剂粘合剂

    公开(公告)号:US20100156054A1

    公开(公告)日:2010-06-24

    申请号:US12640496

    申请日:2009-12-17

    摘要: Methods and apparatus for bonding an electrostatic chuck to a component of a substrate support are provided herein. In some embodiments, an adhesive for bonding components of a substrate support may include a matrix of silicon-based polymeric material having a filler dispersed therein. The silicon based polymeric material may be a polydimethylsiloxane (PDMS) structure having a molecular weight with a low molecular weight (LMW) content Σ D3-D10 of less than about 500 ppm. In some embodiments, the filler may comprise between about 50 to about 70 percent by volume of the adhesive layer. In some embodiments, the filler may comprise particles of aluminum oxide (Al2O3), aluminum nitride (AlN), yttrium oxide (Y2O3), or combinations thereof. In some embodiments, the filler may comprise particles having a diameter of about 10 nanometers to about 10 microns.

    摘要翻译: 本文提供了用于将静电卡盘结合到基板支撑件的部件的方法和装置。 在一些实施例中,用于粘合基底支撑件的部件的粘合剂可以包括其中分散有填料的硅基聚合物材料的基体。 硅基聚合物材料可以是具有低分子量(LMW)含量&Sgr的分子量的聚二甲基硅氧烷(PDMS)结构。 D3-D10小于约500ppm。 在一些实施方案中,填料可以占粘合剂层的约50至约70体积%。 在一些实施例中,填料可以包括氧化铝(Al 2 O 3),氮化铝(AlN),氧化钇(Y 2 O 3)或其组合的颗粒。 在一些实施方案中,填料可以包含直径为约10纳米至约10微米的颗粒。

    FILLED POLYMER COMPOSITION FOR ETCH CHAMBER COMPONENT
    55.
    发明申请
    FILLED POLYMER COMPOSITION FOR ETCH CHAMBER COMPONENT 审中-公开
    用于蚀刻室组件的填充聚合物组合物

    公开(公告)号:US20100140222A1

    公开(公告)日:2010-06-10

    申请号:US12632712

    申请日:2009-12-07

    CPC分类号: C09K3/10 Y10T428/2857

    摘要: A filled polymer composition having improved plasma resistance is disclosed. The composition includes a particle filler dispersed in a polymer matrix. The particle filler can be Nb2O5, YF3, AlN, SiC or Si3N4 and rare earth oxides. In an embodiment, the composition is utilized as a bonding adhesive for electrostatic chuck, bonding adhesive for shower head, bonding adhesive for liner, sealing material, O-ring, or plastic component.

    摘要翻译: 公开了具有改善的等离子体电阻的填充聚合物组合物。 该组合物包括分散在聚合物基质中的颗粒填料。 颗粒填料可以是Nb2O5,YF3,AlN,SiC或Si3N4和稀土氧化物。 在一个实施方案中,组合物用作静电卡盘的粘合剂,用于喷头的粘合剂,衬垫的粘合剂,密封材料,O形环或塑料组分。

    Sealing of flat-panel device
    57.
    发明授权
    Sealing of flat-panel device 失效
    密封平板设备

    公开(公告)号:US07473152B1

    公开(公告)日:2009-01-06

    申请号:US10768806

    申请日:2004-01-30

    IPC分类号: H01J9/00

    摘要: A flat-panel display is hermetically sealed by a process in which a first plate structure (30) is positioned generally opposite a second plate structure (32) such that sealing material (34) provided over the second plate structure lies between the plate structures. In a gravitational sealing technique, the first plate structure is positioned vertically below the second plate structure. The sealing material is heated so that it moves vertically downward under gravitational influence to meet the first plate structure and seal the plate structures together. In a global-heating gap-jumping technique, the plate structures and sealing material are globally heated to cause the sealing material to jump a gap between the sealing material and the first plate structure. When the first plate structure is positioned vertically above the second plate structure, the sealing material moves vertically upward to meet the first plate structure and close the gap.

    摘要翻译: 平板显示器通过其中第一板结构(30)大致相对于第二板结构(32)定位的过程而气密地密封,使得设置在第二板结构上方的密封材料(34)位于板结构之间。 在重力密封技术中,第一板结构位于第二板结构的垂直下方。 密封材料被加热,使得其在重力作用下垂直向下移动以满足第一板结构并将板结构密封在一起。 在全局加热间隙跳跃技术中,板结构和密封材料被全局加热,使得密封材料在密封材料和第一板结构之间跳跃间隙。 当第一板结构垂直地位于第二板结构上方时,密封材料垂直向上移动以满足第一板结构并闭合间隙。