公开(公告)号：US10740888B2

公开(公告)日：2020-08-11

申请号：US15275726

申请日：2016-09-26

Applicant: KLA-Tencor Corporation

Inventor： Naoshin Haque ,  Allen Park ,  Ajay Gupta

IPC: G06T7/00 ,  H01L21/66

Abstract: Methods and systems for providing weak pattern (or hotspot) detection and quantification are disclosed. A weak pattern detection and quantification system may include a wafer inspection tool configured to inspect a wafer and detect defects present on the wafer. The system may also include at least one processor in communication with the wafer inspection tool. The at least one processor may be configured to: perform pattern grouping on the detected defects based on design of the wafer; identify regions of interest based on the pattern grouping; identify weak patterns contained in the identified regions of interest, the weak patterns being patterns deviating from the design by an amount greater than a threshold; validate the identified weak patterns; and report the validated weak patterns or facilitate revision of the design of the wafer based on the validated weak patterns.

公开(公告)号：US10739276B2

公开(公告)日：2020-08-11

申请号：US15828938

申请日：2017-12-01

Applicant: KLA-Tencor Corporation

Inventor： Donald Pettibone ,  Daniel Ivanov Kavaldjiev ,  Chuanyong Huang ,  Qing Li ,  Frank Li ,  Zhiwei Xu

IPC: G01N21/95 ,  G01J1/02 ,  G01J1/04 ,  G01J1/42

Abstract: Stray and air scattered light can be reduced by configuring a size of the collection area of a sensor, which reduces a source of sensitivity-limiting noise in the system. By adjusting a size of the collection area, stray deep ultraviolet light and air-scattered deep ultraviolet light can be reduced. A servo can control a position of an illumination spot that is collected by the time delay and integration sensor.

公开(公告)号：US10733744B2

公开(公告)日：2020-08-04

申请号：US15927011

申请日：2018-03-20

Applicant: KLA-Tencor Corporation

Inventor： Thanh Huy Ha ,  Scott A. Young ,  Mohan Mahadevan

IPC: G06K9/00 ,  G06T7/30 ,  G06K9/62 ,  H01J37/26 ,  G06F30/00

Abstract: Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.

公开(公告)号：US10732130B2

公开(公告)日：2020-08-04

申请号：US16165742

申请日：2018-10-19

Applicant: KLA-Tencor Corporation

Inventor： Haiping Zhang ,  Gang Yu

IPC: G01N21/956 ,  H01L21/66 ,  G01N21/95 ,  G01N21/88 ,  G01N21/47

Abstract: An inspection system may include an illumination source to generate an illumination beam, illumination optics to direct the illumination beam to a sample. The system may further include a first collection channel to collect light from the sample within a first range of solid angles and at a first selected polarization. The system may further include a second collection channel to collect light from the sample within a second angular range, the second range of solid angles and at a second selected polarization. The system may further include a controller to receive two or more scattering signals. The scattering signals may include signals from the first and second collection channels having selected polarizations. The controller may further determine depths of defects in the sample based on comparing the two or more scattering signals to training data including data from a training sample having known defects at known depths.

公开(公告)号：US20200240765A1

公开(公告)日：2020-07-30

申请号：US16848056

申请日：2020-04-14

Applicant: KLA-Tencor Corporation

Inventor： Amnon Manassen ,  Andrew Hill

IPC: G01B9/02 ,  G01B11/27 ,  G03F7/20

Abstract: Methods and systems for focusing and measuring by mean of an interferometer device, having an optical coherence tomography (OCT) focusing system, by separately directing an overlapped measurement and reference wavefront towards a focus sensor and towards an imaging sensor; where a predefined focusing illumination spectrum of the overlapped wavefront is directed towards the focus sensor, and where a predefined measurement illumination spectrum of the overlapped wavefront is directed towards the imaging sensor. Methods and systems for maintaining focus of an interferometer device, having an OCT focusing system, during sample's stage moves.

公开(公告)号：US10714294B2

公开(公告)日：2020-07-14

申请号：US16419184

申请日：2019-05-22

Applicant: KLA-TENCOR CORPORATION

Inventor： Frances Hill ,  Gildardo R. Delgado ,  Rudy F. Garcia ,  Gary V. Lopez Lopez ,  Michael E. Romero ,  Katerina Ioakeimidi ,  Zefram Marks

IPC: H01J1/16 ,  H01J1/304 ,  H01J37/073

Abstract: An emitter with a diameter of 100 nm or less is used with a protective cap layer and a diffusion barrier between the emitter and the protective cap layer. The protective cap layer is disposed on the exterior surface of the emitter. The protective cap layer includes molybdenum or iridium. The emitter can generate an electron beam. The emitter can be pulsed.

公开(公告)号：US10712289B2

公开(公告)日：2020-07-14

申请号：US14809774

申请日：2015-07-27

Applicant: KLA-Tencor Corporation

Inventor： Oksen Toros Baris ,  Raghav Babulnath

IPC: G01N21/95 ,  G01B11/14 ,  G03F7/20 ,  G01N21/956

Abstract: Various embodiments for detecting defects on a wafer are provided. One method includes acquiring output generated by an inspection system for a wafer during an inspection process that is performed after at least first and second process steps have been performed on the wafer. The first and second process steps include forming first and second portions, respectively, of a design on the wafer. The first and second portions of the design are mutually exclusive in space on the wafer. The method also includes detecting defects on the wafer based on the output and determining positions of the defects with respect to the first and second portions of the design. In addition, the method includes associating different portions of the defects with the first or second process step based on the positions of the defects with respect to the first and second portions of the design.

公开(公告)号：US20200217651A1

公开(公告)日：2020-07-09

申请号：US16806076

申请日：2020-03-02

Applicant: KLA-Tencor Corporation

Inventor： Guoheng Zhao ,  Maarten van der Burgt ,  Sheng Liu ,  Andy Hill ,  Johan De Greeve ,  Karel van Gils

IPC: G01B11/25 ,  G01B11/24 ,  G01B11/06

Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

公开(公告)号：US10706522B2

公开(公告)日：2020-07-07

申请号：US15394545

申请日：2016-12-29

Applicant: KLA-Tencor Corporation

Inventor： Prasanti Uppaluri ,  Rajesh Manepalli ,  Ashok V. Kulkarni ,  Saibal Banerjee ,  John Kirkland

IPC: G06T7/00 ,  H01L21/66

Abstract: A method includes receiving one or more sets of wafer data, identifying one or more primitives from one or more shapes in one or more layers in the one or more sets of wafer data, classifying each of the one or more primitives as a particular primitive type, identifying one or more primitive characteristics for each of the one or more primitives, generating a primitive database of the one or more primitives, generating one or more rules based on the primitive database, receiving one or more sets of design data, applying the one or more rules to the one or more sets of design data to identify one or more critical areas, and generating one or more wafer inspection recipes including the one or more critical areas for an inspection sub-system.

公开(公告)号：US10692690B2

公开(公告)日：2020-06-23

申请号：US15639311

申请日：2017-06-30

Applicant: KLA-Tencor Corporation

Inventor： Vidyasagar Anantha ,  Arpit Yati ,  Saravanan Paramasivam ,  Martin Plihal ,  Jincheng Lin

IPC: H01J37/00 ,  H01J37/244 ,  H01J37/28 ,  H01J37/20

Abstract: Use of care areas in scanning electron microscopes or other review tools can provide improved sensitivity and throughput. A care area is received at a controller of a scanning electron microscope from, for example, an inspector tool. The inspector tool may be a broad band plasma tool. The care area is applied to a field of view of a scanning electron microscope image to identify at least one area of interest. Defects are detected only within the area of interest using the scanning electron microscope. The care areas can be design-based or some other type of care area. Use of care areas in SEM tools can provide improved sensitivity and throughput.