摘要:
A method of cleaning a semiconductor substrate conductive layer surface that can remove a residual organic material and a natural oxide satisfactorily and does not adversely affect a k value without damaging the side-wall insulation film of a via hole. A semiconductor device, including insulation films formed on the surface of a conductive layer of a semiconductor substrate and a via hole formed in an insulation film to partly expose the conductive layer, is carried into a reaction vessel, plasma including hydrogen is generated in the reaction vessel to clean the surface of the conductive layer at the bottom of the via hole, a residual organic material is decomposed and removed by ashing, and a copper oxide film on the surface of the conductive layer is reduced to Cu.
摘要:
The present invention relates to a method of lowering dielectric constant of an insulating film including Si, O and CH formed by a chemical vapor deposition process. A process gas containing hydrogen atoms is supplied into a reaction vessel. A microwave is introduced into the reaction vessel to supply a uniform electromagnetic wave, thereby a plasma containing a hydrogen radical is generated in the reaction vessel. The structure of the insulating film is modified by the hydrogen radical contained in the plasma irradiated to the insulating film, lowering the dielectric constant of the film. The microwave is supplied into the reaction vessel through a radial-slot antenna.
摘要:
A plurality of lighting units using light emitting diodes as light sources is accommodated in a lamp housing in such a state as to be supported on a common metallic support member provided tiltably. When a part or all of the lighting units are turned on, the light emitting diodes generate heat with a light emission. These light emitting diodes are supported on the common metallic support member. Also in the case in which any of the lighting units is turned on, therefore, the heat generated by the light emitting diodes is moved to the metallic support member having a large heat capacity through boards and light source support blocks by a heat conducting function. Consequently, a rise in the temperatures of the light emitting diodes can be suppressed.
摘要:
A plasma processing method of carrying out curing processing on a low dielectric constant film produced on a to-be-processed substrate by applying plasma thereto in a processing chamber of a plasma processing apparatus, includes the steps of: a) introducing, in the plasma processing chamber, a first gas having a function of stabilizing plasma and a second gas generating active hydrogen, and, after that; b) generating plasma, and carrying out curing processing on the low dielectric constant film.
摘要:
A magnetic head supporting mechanism for a double side type flexible disc drive apparatus is rotatably driven and contains a first and second magnetic head for read-out or write-in on each magnetic recording surface of the disc. The magnetic head is slidably contacted with the surface during the operation and includes a carriage having a first and second magnetic head which is positioned on a predetermined data track of the disc with the carriage having first and second arms and one of the arms being rotated with the first and second magnetic head assemblies being mounted on the first and second arm respectively. One of the magnetic head assemblies contains a resilient holder affixed to the arm and simultaneously fixed to the magnetic head while a gimbal spring which is disposed on the holder and has a surface fitted to the head also contains a projection which is formed on the other surface. A point member is fixed on the holder at one end and is fitted in such a manner that it contacts the projection of the gimbal spring on the other end.
摘要:
Provided is a plasma etching method increasing the selectivity of a silicon nitride film in relation to the silicon oxide film or silicon functioning as a base. In a plasma etching method setting a pressure in a processing container as a predetermined level by exhausting a processing gas while supplying the processing gas into the processing container, generating plasma by supplying external energy to the processing container, and setting a bias applied to a holding stage holding a substrate in the processing container as predetermined value to selectively etch the silicon nitride film with respect to a silicon and/or silicon oxide film, the processing gas includes a plasma excitation gas, a CHxFy gas, and at least one oxidizing gas selected from the group consisting of O2, CO2, CO, and a flow rate of the oxidizing gas with respect to the CHxFy gas is set to be 4/9 or greater.
摘要翻译:提供了提高氮化硅膜相对于用作基底的氧化硅膜或硅的选择性的等离子体蚀刻方法。 在等离子体蚀刻方法中,通过在将处理气体供应到处理容器中的同时排出处理气体而将处理容器中的压力设定为预定水平,通过向处理容器供给外部能量来产生等离子体,并且设定施加到保持 将处理容器中的基板保持为预定值,以相对于硅和/或氧化硅膜选择性地蚀刻氮化硅膜,处理气体包括等离子体激发气体,CH x F y气体和至少一种选择的氧化气体 来自由O 2,CO 2,CO组成的组和氧化气体相对于CH x F y气体的流量设定为4/9以上。
摘要:
A two-core optical fiber magnetic field sensor is configured from at least a light incidence/emission unit; a lens; a magnetic garnet; and a reflector, wherein the lens and the magnetic garnet are disposed between the light incidence/emission end of the light incidence/emission unit and the reflector; a light beam is emitted from one optical fiber; the light beam is reflected by the reflector after being transmitted through the lens and the magnetic garnet; the light beam is transmitted again through the magnetic garnet and the lens after the reflection; and incident on the other optical fiber, the light beam is emitted again from the other optical fiber, and reflected by the reflector after being transmitted through the lens and the magnetic garnet; and the light beam is transmitted again through the magnetic garnet and the lens after the reflection and incident again on the one optical fiber.
摘要:
An apparatus for plasma treatment contains a process vessel provided with a mounting table for mounting a substrate, a first gas supplying unit configured to supply a first gas into the process vessel, a first plasma generating unit configured to convert at least a part of the first gas to a first plasma, a second gas supplying unit configured to supply a second gas into the process vessel, and a second plasma generating unit configured to convert at least a part of the second gas to a second plasma. A height of ea an inlet of the second gas from the mounting table is lower than a height of an inlet of the first gas from the mounting table.
摘要:
The etching method of the present invention comprises first and second etching steps (S1, S3) having different types of films to be etched and different types of process gases. During a transition from the first etching step (S1) to the second etching step (S3), a first switching process step (S2) is performed in which the process container is filled with a cleaning gas and the cleaning gas is turned into a plasma to remove the reaction product deposited in the process container in the first etching step. During a transition from the second etching step (S3) to the first etching step (S1), a second switching process step (S4) is performed in which the process container is filled with a cleaning gas and the cleaning gas is turned into a plasma to remove the reaction product deposited in the process container in the second etching step.
摘要:
An electric measuring apparatus is constructed in such a way as to include a signal processing circuit equipped with at least a polarized light separating unit, Faraday rotators, a light source, a photoelectric conversion element, and optical fibers for a sensor. The optical fibers for the sensor are placed around the periphery of an electrical conductor through which electric current to be measured flows. Furthermore, the rotation angle of each Faraday rotator at the time when the magnetism of each Faraday rotator is saturated is set to 22.5°+α° at a temperature of 23° C., thereby changing the rotation angle of each Faraday rotator by α° from 22.5°.