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    Forceps and collection assembly with accompanying mechanisms and related methods of use
    52.
    发明申请
    Forceps and collection assembly with accompanying mechanisms and related methods of use 有权
    镊子和收集组装与附带的机制和相关的使用方法

    公开(公告)号：US20100022913A1

    公开(公告)日：2010-01-28

    申请号：US12461262

    申请日：2009-08-05

    申请人： Adam L. Cohen ,  John B. Golden ,  Liem T. Vu

    发明人： Adam L. Cohen ,  John B. Golden ,  Liem T. Vu

    IPC分类号： A61B10/00

    CPC分类号： A61B10/06 ,  A61B10/0096 ,  A61B17/3462 ,  A61B2010/0225 ,  A61B2017/320064

    摘要： The invention includes a forceps and collection assembly for acquiring and storing a plurality of tissue samples in a single pass, and accompanying mechanisms for use with the forceps and collection assembly. The accompanying mechanisms include an endoscope working channel cap assembly configured to minimize compression of a pouch of the forceps and collection assembly as it traverses a seal of the cap assembly, and a flush adapter configured to be coupled to the pouch so as to assist in removing tissue samples in the pouch by flowing fluid through the pouch.

    摘要翻译： 本发明包括用于在单次通过中获取和存储多个组织样本的镊子和收集组件，以及与镊子和收集组件一起使用的伴随机构。 伴随的机构包括：内窥镜工作通道盖组件，其构造成当镊子和收集组件穿过盖组件的密封件时使压缩袋的压缩最小化;以及冲洗适配器，其被配置为联接到该小袋以协助去除 通过使流体流过袋子来在袋中组织样品。

    Fabrication process for co-fabricating multilayer probe array and a space transformer
    53.
    发明授权
    Fabrication process for co-fabricating multilayer probe array and a space transformer 失效
    共同制造多层探针阵列和空间变压器的制造工艺

    公开(公告)号：US07640651B2

    公开(公告)日：2010-01-05

    申请号：US11028945

    申请日：2005-01-03

    申请人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Christopher A. Bang ,  Pavel B. Lembrikov

    发明人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Christopher A. Bang ,  Pavel B. Lembrikov

    IPC分类号： H01F3/04 ,  H01F7/06

    CPC分类号： G01R3/00 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/07378 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49078 ,  Y10T29/49204 ,  Y10T29/49222

    摘要： Embodiments of the invention provide fabrication processes for the co-fabrication of microprobe arrays along with one or more space transformers wherein the fabrication processes include the forming and adhering of a plurality of layers to previously formed layers and wherein at least a portion of the plurality of layers are formed from at least one structural material and at least one sacrificial material that is at least in part released from the plurality of layers after formation and wherein the space transformer includes a plurality of interconnect elements that connect one side to the array of probes that has a first spacing to another side that has a second spacing where the second spacing is greater than the first spacing. In some embodiments, the fabrication process includes a plurality of electrodeposition operations.

    摘要翻译： 本发明的实施例提供了用于与一个或多个空间变压器共同制造微探针阵列的制造工艺，其中制造工艺包括将多个层形成和粘附到先前形成的层，并且其中多个 层由至少一种结构材料和至少一种牺牲材料形成，所述至少一种牺牲材料在形成之后至少部分地从所述多个层释放，并且其中所述空间变换器包括将一侧连接到所述探针阵列的多个互连元件， 具有第二间隔，第二间隔具有第二间隔，其中第二间隔大于第一间隔。 在一些实施例中，制造工艺包括多个电沉积操作。

    Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data
    54.
    发明授权
    Method for electrochemically fabricating three-dimensional structures including pseudo-rasterization of data 失效
    用于电化学地制造包括数据伪光栅化的三维结构的方法

    公开(公告)号：US07623935B2

    公开(公告)日：2009-11-24

    申请号：US11029173

    申请日：2005-01-03

    申请人： Adam L. Cohen ,  Jeffrey A. Thompson

    发明人： Adam L. Cohen ,  Jeffrey A. Thompson

    IPC分类号： G06F17/50 ,  G06F19/00

    CPC分类号： C25D5/022 ,  B33Y10/00 ,  B33Y50/02 ,  C25D1/10 ,  C25D5/10

    摘要： Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

    摘要翻译： 本发明的一些实施例涉及用于电化学制造多层三维结构的技术，其中至少一个或多个层的选择性图案化通过掩模发生，该掩模使用表示具有三维结构的横截面的数据形成，该三维结构具有 被修改为将其定义为仅限定正面积区域的多边形形式。 根据是否使用掩模，例如选择性地沉积结构材料或牺牲材料，正面积的区域是结构材料要被定位的区域或者结构材料不被定位的区域。 修改的数据可以采取相邻或稍微重叠的相对窄的矩形结构的形式，其中结构的宽度与期望的地层分辨率相关。 相邻矩形的中心之间的间距可以是均匀的或可以是变量。 数据修改还可以包括形成原始结构，缩放副本，镜像副本，旋转副本，补充副本等的重复副本。

    Two-part microprobes for contacting electronic components and methods for making such probes
    56.
    发明授权
    Two-part microprobes for contacting electronic components and methods for making such probes 有权
    用于接触电子部件的两部分微探针和用于制造这种探针的方法

    公开(公告)号：US07567089B2

    公开(公告)日：2009-07-28

    申请号：US11636147

    申请日：2006-12-07

    申请人： Richard T. Chen ,  Vacit Arat ,  Chris Folk ,  Adam L. Cohen

    发明人： Richard T. Chen ,  Vacit Arat ,  Chris Folk ,  Adam L. Cohen

    IPC分类号： G01R31/02

    CPC分类号： G01R1/0483 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

    摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.

    摘要翻译： 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及两部分探针元件，可插座探针及其安装件的各种设计。 一些实施例涉及制造这种探针和支架的方法。 在一些实施例中，例如，探针在安装结构中具有滑动，在安装结构中扭转，包括柔顺元件的安装结构等。

    Medical Devices and EFAB Methods and Apparatus for Producing Them
    57.
    发明申请
    Medical Devices and EFAB Methods and Apparatus for Producing Them 审中-公开
    医疗器械和EFAB生产方法和设备

    公开(公告)号：US20090176042A1

    公开(公告)日：2009-07-09

    申请号：US12404843

    申请日：2009-03-16

    申请人： Adam L. Cohen

    发明人： Adam L. Cohen

    IPC分类号： A61F2/06 ,  B05D3/00

    CPC分类号： A61F2/91 ,  A61F2002/065 ,  A61F2210/0076 ,  A61F2230/0058 ,  A61F2230/006 ,  Y10T428/13

    摘要： Various embodiments of the invention present miniature medical devices that may be formed totally or in part using electrochemical fabrication techniques. Sample medical devices include micro-tweezers or forceps, internally expandable stents, bifurcated or side branch stents, drug eluting stents, micro-valves and pumps, rotary ablation devices, electrical ablation devices (e.g. RF devices), micro-staplers, ultrasound catheters, and fluid filters. In some embodiments devices may be made out of a metal material while in other embodiments they may be made from a material (e.g. a polymer) that is molded from an electrochemically fabricated mold. Structural materials may include gold, platinum, silver, stainless steel, titanium or pyrolytic carbon-coated materials such as nickel, copper, and the like.

    摘要翻译： 本发明的各种实施例提供可以使用电化学制造技术全部或部分地形成的微型医疗装置。 样品医疗设备包括微型镊子或镊子，内部可扩张支架，分叉或侧支支架，药物洗脱支架，微型阀和泵，旋转消融装置，电消融装置（例如RF装置），微型吻合器，超声导管， 和流体过滤器。 在一些实施例中，装置可以由金属材料制成，而在其它实施例中，它们可以由从电化学制造的模具模制的材料（例如聚合物）制成。 结构材料可以包括金，铂，银，不锈钢，钛或热解碳涂层材料如镍，铜等。

    Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers
    59.
    发明申请
    Multi-Layer Three-Dimensional Structures Having Features Smaller Than a Minimum Feature Size Associated With the Formation of Individual Layers 审中-公开
    具有小于单个层的形成的最小特征尺寸的特征的多层三维结构

    公开(公告)号：US20090068460A1

    公开(公告)日：2009-03-12

    申请号：US12203094

    申请日：2008-09-02

    申请人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

    发明人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

    IPC分类号： B32B5/00

    CPC分类号： C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

    摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

    摘要翻译： 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。