公开(公告)号：US20130087539A1

公开(公告)日：2013-04-11

申请号：US13641497

申请日：2011-04-13

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： B23K1/20 ,  B23K3/06

CPC分类号： B23K1/20 ,  B23K1/0056 ,  B23K3/06 ,  B23K3/0607 ,  H01L21/6835 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/7515 ,  H01L2924/00 ,  H01L2924/00013 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/014 ,  H01L2924/12042

摘要： The invention relates to a method for forming solder deposits (34) on elevated contact metallizations (24) of terminal faces (23) of a substrate (19) formed in particular as a semiconductor component, in which wetting surfaces (26) of the contact metallizations are brought into physical contact with a solder material layer (15) arranged on a solder material carrier (13), at least for the duration of the physical contact a heating of the substrate and a tempering of the solder material layer takes place, and subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

摘要翻译： 本发明涉及一种用于在特别形成为半导体部件的衬底（19）的端子面（23）的升高的接触金属化层（24）上形成焊料沉积物（34）的方法，其中触点的湿润表面（26） 金属化物质与布置在焊料载体（13）上的焊料层（15）物理接触，至少在物理接触的持续时间期间，发生基板的加热和焊料材料层的回火，以及 随后发生用焊接材料润湿的接触金属化物与焊料材料层之间的物理接触的分离。

公开(公告)号：US20110089963A1

公开(公告)日：2011-04-21

申请号：US12933764

申请日：2009-03-27

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： G01R31/20

CPC分类号： G01R1/07342 ,  G01R1/06727 ,  G01R1/06733

摘要： The invention relates to a test contact arrangement (15) for testing semiconductor components, comprising at least one test contact (10) which is arranged in a test contact frame (13) and is designed in the type of a cantilever arm and which has a fastening base (12) and a contact arm (30) which is provided with a contact tip (11) and which is connected to the fastening base, wherein the fastening base is inserted with a fastening projection (16) thereof into a frame opening (14) of the test contact frame in such a manner that a lower edge (17) of the fastening projection is essentially aligned flush with a lower side (18) of the test contact frame.

摘要翻译： 本发明涉及一种用于测试半导体部件的测试接触装置（15），包括至少一个测试接点（10），该接触件设置在测试接触框架（13）中，并被设计成悬臂的类型，并具有 紧固基座（12）和接触臂（30），其设置有接触尖端（11）并且连接到所述紧固基座，其中所述紧固基座插入其紧固突起（16）到框架开口（ 14），使得紧固突起的下边缘（17）基本上与测试接触框架的下侧（18）齐平地对齐。

公开(公告)号：US20100181295A1

公开(公告)日：2010-07-22

申请号：US12668508

申请日：2008-06-10

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： B23K26/06 ,  B23K1/018 ,  B23K26/00 ,  B23K3/08

CPC分类号： B23K1/018 ,  B23K3/029 ,  B23K26/1476

摘要： The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

摘要翻译： 本发明涉及一种用于将焊料材料沉积物（12）从衬底（10）分离的方法和装置，其中具有接收开口（22）的接收套筒（19）定位成与焊料材料沉积物重叠 以基本上密封的方式使接收开口的开口边缘（21）与基板抵接的方式布置在基板上，焊料材料沉积物经受热能和套管腔（23），套管腔 由接收套筒限定并且横向于接收套筒的纵向轴线（30）设置的受到接收套筒的输出装置（29）的空气流（28）的限制。

公开(公告)号：US06983539B2

公开(公告)日：2006-01-10

申请号：US10161472

申请日：2002-06-03

申请人： Mohammad Akhavain ,  Ghassem Azdasht

发明人： Mohammad Akhavain ,  Ghassem Azdasht

IPC分类号： B21D53/76 ,  B23K26/00

CPC分类号： H01L24/80 ,  B23K26/22 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/56 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  Y10T29/49083 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401 ,  H01L2924/00

摘要： In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream—and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead—with the bumps formed on a die or other printhead component, and nozzles formed through the base.

摘要翻译： 在本发明的一种形式中，激光束直接通过TAB带或基底的材料传播，以加热并形成在基底上形成的电引线和对准的接触凸块之间的结合。 在另一种形式中，在TAB带或基底上形成铬种子金属层，并在铬上形成引线; 铬吸收激光束以加热引线。 在两种形式中，光纤优选地将铜引线和金凸起与超过300g的力一起压制，而不用气流的帮助，然后还将梁传导到结合位置，形成剪切强度超过200g的粘结。 金触点也优选镀在引线上; 并且该方法制造喷墨打印头，其中凸起形成在模具或其它打印头部件上，以及通过基部形成的喷嘴。

公开(公告)号：US06713714B1

公开(公告)日：2004-03-30

申请号：US09889677

申请日：2001-07-17

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： B23K2620

CPC分类号： B23K1/0056 ,  B23K26/22 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/75 ,  H01L2224/75743 ,  H01L2224/78301 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H05K13/0409

摘要： A method and a device for thermally connecting the terminal areas (26, 27) of a contact substrate (11) to the terminal areas (28, 29) of a carrier substrate (12), where the substrates (11, 12) are, in order to produce the connection, arranged in a connecting position such that the terminal areas (26, 28; 27, 29) are situated opposite one another in the plane of the connection, where the contact substrate (11) is heated to the connecting temperature from its rear side that is situated opposite the terminal areas (26, 27) in order to reach the required connecting temperature in the plane of the connection, and where the contact substrate (11) is heated by subjecting the substrate to laser energy.

摘要翻译： 一种用于将接触基板（11）的端子区域（26,27）热连接到载体基板（12）的端子区域（28,29）的方法和装置，其中基板（11,12） 为了产生连接，布置在连接位置，使得端子区域（26,28; 27,29）在连接的平面中彼此相对定位，其中接触基板（11）被加热到连接 其位于与端子区域（26,27）相对的后侧的温度，以便达到连接平面中所需的连接温度，并且通过对衬底进行激光能量来加热接触衬底（11）。

公开(公告)号：US6072148A

公开(公告)日：2000-06-06

申请号：US987881

申请日：1997-12-08

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： B23K26/00 ,  B23K26/06 ,  B23K26/067 ,  B23K26/08 ,  B23K26/20 ,  B23K26/42 ,  B23K101/40 ,  H01L21/60 ,  H01R43/02

CPC分类号： H01L24/80 ,  B23K26/067 ,  B23K26/702 ,  H01R43/0221 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14

摘要： A device for producing by means of laser energy a plurality of connectionsetween contact elements of respective contact element pairs has a holding arrangement for holding a plurality of optical fibers having respective optical fiber ends. A positioner is provided for positioning the holding arangement and the contact element pairs at a predetermined position relative to one another, at which a respective optical fiber end is associated with a pair of contact elements, the connection surfaces of the contact elements of said pair of contact elements being pressed onto one another by a pressure applied by said optical fiber. Said connecting device additionally comprises a device for compensating different distances between the optical fiber ends and the surfaces of the associated contact element pairs facing said optical fiber ends, in such a way that the connection surfaces of the contact elements are pressed onto one another.

摘要翻译： 用于通过激光能量生产各个接触元件对的接触元件之间的多个连接的装置具有保持多个具有相应光纤端部的光纤的保持装置。 定位器被设置用于将保持装置和接触元件对定位在相对于彼此的预定位置处，在该位置处相应的光纤端与一对接触元件相关联，所述一对接触元件的连接表面 接触元件被所述光纤施加的压力压在彼此上。 所述连接装置还包括用于补偿光纤端部与面对所述光纤端部的相关联的接触元件对的表面之间的不同距离的装置，使得接触元件的连接表面被压在彼此上。

公开(公告)号：US09649711B2

公开(公告)日：2017-05-16

申请号：US13982837

申请日：2012-01-30

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： B23K1/005 ,  B23K26/02 ,  B23K35/362 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： B23K1/0056 ,  B23K26/02 ,  B23K35/362 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75263 ,  H01L2224/81065 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/8191 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A method for electrically contacting terminal faces of two substrates, such as a chip and a carrier substrate, includes two successive phases. In a first phase, the chip is positioned with its terminal faces against terminal faces of the substrate and laser energy is applied to the chip at the rear. In a second phase, a flux medium is applied and laser energy is applied to the rear of the chip to cause reflow. The device for performing the second phase of the method comprises a carrier table and a housing, which form a housing interior with a top side of the carrier table which receives the component arrangement, and a laser light source, which is oriented so that the laser radiation impinges on the rear side of the first substrate.

公开(公告)号：US09327360B2

公开(公告)日：2016-05-03

申请号：US12523788

申请日：2008-01-24

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： B23K9/16 ,  B23K31/00 ,  B23K1/005 ,  B23K1/00 ,  B23K3/06 ,  H05K3/34

CPC分类号： B23K1/0056 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L2224/1302 ,  H01L2224/16105 ,  H01L2224/16227 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107 ,  Y02P70/613 ,  H01L2924/00012

摘要： The invention relates to a method and a device for contacting a solder ball formation, in which a plurality of contact mouthpieces arranged in a formation is used to pick up a solder ball formation with a composition reflecting the relative arrangement of the contact mouthpieces from a solder ball reservoir comprising a multitude of randomly distributed solder balls, the solder ball formation is placed on contact points by means of the contact mouthpieces for subsequently contacting, and subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points.

摘要翻译： 本发明涉及一种用于接触焊球形成的方法和装置，其中布置在地层中的多个接触嘴用于拾取焊球形成，其中组合反映了接触嘴从焊料的相对布置 球储存器包括多个随机分布的焊球，焊球形成通过接触嘴放置在接触点上，用于随后接触，随后焊球通过接触嘴撞击以与热连接 联络点。

公开(公告)号：US20140027418A1

公开(公告)日：2014-01-30

申请号：US13982837

申请日：2012-01-30

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： B23K1/005 ,  B23K26/02 ,  B23K35/362

CPC分类号： B23K1/0056 ,  B23K26/02 ,  B23K35/362 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75263 ,  H01L2224/81065 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/8191 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： The present invention relates to a method for electrically contacting terminal faces of two substrates (6, 7), in particular of a chip (6) and of a carrier substrate (7). Furthermore, the invention relates to a device for performing a second phase of the method according to the invention. The method according to the invention takes place in two successive phases, wherein, in a first phase, the chip (6) is positioned with its terminal faces against terminal faces of the substrate (7) and laser energy (5) is applied to the chip (6) at the rear and, in a subsequent second phase, in a housing (3), a flux medium is applied and at the same time a reflow is performed by means of laser energy (5) being applied to the chip (6) at the rear, and a process of rinsing the housing interior is subsequently performed. The device according to the invention for performing a second phase of the method comprises a carrier table (1) and a housing (3), which together with a top side of the carrier table (1) forms a housing interior, in which the component arrangement is positioned, and also a laser light source (5), which is oriented in such a way that the laser radiation impinges on the first substrate (6) on the rear side.

摘要翻译： 本发明涉及一种用于电接触两个基片（6,7）特别是芯片（6）和载体衬底（7）的端面的方法。 此外，本发明涉及一种用于执行根据本发明的方法的第二阶段的装置。 根据本发明的方法在两个连续的阶段中进行，其中在第一阶段中，芯片（6）定位成使其端子面抵靠衬底（7）的端面，激光能量（5）被施加到 在后面的芯片（6），并且在随后的第二阶段中，在壳体（3）中，施加通量介质，并且同时通过施加到芯片上的激光能量（5）来执行回流 6），并且随后执行冲洗外壳内部的过程。 根据本发明的用于执行该方法的第二阶段的装置包括承载台（1）和壳体（3），其与承载台（1）的顶侧一起形成壳体内部，其中部件 并且还具有激光光源（5），其以使得激光辐射照射在后侧上的第一基板（6）的方式定向。

公开(公告)号：US20110235681A1

公开(公告)日：2011-09-29

申请号：US13123566

申请日：2009-10-05

申请人： Ghassem Azdasht

发明人： Ghassem Azdasht

IPC分类号： G01K1/00

CPC分类号： G01R1/06733 ,  G01R1/06705 ,  G01R1/073 ,  H01L21/76897 ,  H01L24/75

摘要： The present invention relates to a device for positioning and contacting test contacts (20) on a contact carrier for producing a test contact arrangement, comprising at least one contact head having at least one transmission channel (24) for transmitting thermal energy and being equipped with a test contact holding device, said contact head on the contact end thereof and in the region of a channel mouth being equipped with a test contact receptacle, wherein said test contact receptacle comprises a positioning device with at least two positioning faces for the positioned abutment against a test contact and the positioning of the test contact with an absorption region for absorbing the thermal energy in the channel mouth.

摘要翻译： 本发明涉及一种用于在接触载体上定位和接触测试触头（20）的装置，用于产生测试接触装置，该装置包括至少一个接触头，该接触头具有用于传递热能的至少一个传输通道（24） 测试接触保持装置，所述接触头在其接触端上并且在通道口的区域中配备有测试接触插座，其中所述测试接触插座包括具有至少两个定位面的定位装置，用于定位的抵靠 测试触点和测试触点与用于吸收通道口中的热能的吸收区域的定位。