公开(公告)号：US20070183736A1

公开(公告)日：2007-08-09

申请号：US11639511

申请日：2006-12-14

申请人： Vadim Pozdnyakov ,  Maxim Frolov ,  Alexey Khorokhorov ,  Alexander Shirankov ,  Ju-Young Yoon ,  Gi-Cherl Kim

发明人： Vadim Pozdnyakov ,  Maxim Frolov ,  Alexey Khorokhorov ,  Alexander Shirankov ,  Ju-Young Yoon ,  Gi-Cherl Kim

IPC分类号： G02B6/10

CPC分类号： G02B19/0071 ,  G02B19/0014 ,  G02B19/0061 ,  H01L33/58 ,  H01L33/60

摘要： A lens for reforming radiation from a light-emitting diode having a first convex surface for admitting radiation path from the light-emitting diode that is close to the axis of the diode and a cylindrical surface for admitting radiation that makes a wider angle with the axis of the diode, a conical surface disposed to receive and totally internally reflect radiation admitted by said convex surface and re-radiate it at an angle substantially normal to the axis of the diode and a curved surface for receiving and re-radiating at an angle substantially normal to the axis of the diode radiation admitted by the cylindrical surface.

摘要翻译： 一种用于重整发光二极管的透镜，该发光二极管具有第一凸表面，用于从靠近二极管轴线的发光二极管接收辐射路径，以及用于允许与轴线成更大角度的辐射的圆柱形表面 二极管的锥形表面，设置成接收并全面地内反射由所述凸表面承受的辐射的锥形表面，并以基本上垂直于二极管的轴线的角度再次辐射它，以及弯曲表面，用于基本上接收和再辐射 垂直于由圆柱形表面承认的二极管辐射轴线。

公开(公告)号：US08814415B2

公开(公告)日：2014-08-26

申请号：US12766747

申请日：2010-04-23

申请人： Hyoung-Joo Kim ,  Ju-Young Yoon ,  Jae-Joong Kwon ,  Chi-O Cho ,  Jin-Hee Park ,  Joo-Young Kim ,  Sung-Kyu Shim

发明人： Hyoung-Joo Kim ,  Ju-Young Yoon ,  Jae-Joong Kwon ,  Chi-O Cho ,  Jin-Hee Park ,  Joo-Young Kim ,  Sung-Kyu Shim

IPC分类号： F21V7/04

CPC分类号： G02B6/002 ,  G02B6/0021 ,  G02B6/0083 ,  G02B6/0091

摘要： A light-emitting module includes a light guide plate and a light source unit in accordance with an embodiment. The light guide plate include an upper surface, a lower surface facing the upper surface, a plurality of side surfaces connecting the upper surface and the lower surface, and a cross-sectional surface connected to at least one of the side surfaces. The light source unit includes a substrate disposed in correspondence with the cross-sectional surface and a point light source mounted on the substrate to emit light to the cross-sectional surface. Thus, light-emitting efficiency may be enhanced and the arrangement of point light sources may be optimized, so that a required amount of emitted light may be obtained using a small number of the point light sources. In addition, uniformity of luminance and heat-radiating efficiency may also be enhanced.

摘要翻译： 发光模块包括根据实施例的导光板和光源单元。 导光板包括上表面，与上表面相对的下表面，连接上表面和下表面的多个侧表面以及连接到至少一个侧表面的横截面。 光源单元包括与横截面相对应地设置的基板和安装在基板上的点光源，以向横截面表面发光。 因此，可以提高发光效率并且可以优化点光源的布置，使得可以使用少量的点光源获得所需的发射光量。 此外，还可以提高亮度和散热效率的均匀性。

公开(公告)号：US20120195020A1

公开(公告)日：2012-08-02

申请号：US13198148

申请日：2011-08-04

申请人： Han-Moe Cha ,  Ju-Young Yoon ,  Jin Seo

发明人： Han-Moe Cha ,  Ju-Young Yoon ,  Jin Seo

IPC分类号： F21V9/00 ,  F21V9/16 ,  H01L33/08

CPC分类号： H01L25/0753 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/009 ,  G02F1/133621 ,  G02F2001/133624 ,  H01L33/486 ,  H01L33/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light source module includes a receiving container, a first light source, a second light source, a first resin, and a second resin. The receiving container includes an upper surface, a first bottom surface, and a second bottom surface. The first bottom surface has a first depth from the upper surface. The second bottom surface has a second depth from the upper surface. The first light source is disposed on the first bottom surface. The first light source generates first color light. The second light source is disposed on the second bottom surface. The second light source generates second color light. The first resin is formed on the first light source. The first resin includes a phosphor emitting third color light. The second resin is formed on the first resin and the second light source.

摘要翻译： 光源模块包括接收容器，第一光源，第二光源，第一树脂和第二树脂。 接收容器包括上表面，第一底表面和第二底表面。 第一底表面具有从上表面的第一深度。 第二底表面具有从上表面的第二深度。 第一光源设置在第一底面上。 第一光源产生第一色光。 第二光源设置在第二底面上。 第二光源产生第二色光。 第一树脂形成在第一光源上。 第一树脂包括发射第三色光的荧光体。 第二树脂形成在第一树脂和第二光源上。

公开(公告)号：US07903067B2

公开(公告)日：2011-03-08

申请号：US11954772

申请日：2007-12-12

申请人： Ju-Young Yoon ,  Chun-Ho Song ,  Seong-Yong Hwang

发明人： Ju-Young Yoon ,  Chun-Ho Song ,  Seong-Yong Hwang

IPC分类号： G09G3/36

CPC分类号： H01L24/81 ,  G02F1/13452 ,  H01L24/06 ,  H01L24/17 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/3511 ,  H01L2924/00

摘要： A driver chip includes a base body, input terminals, first output terminals and dummy terminals. The base body includes a face having first to fourth edge portions. The first and second edge portions are disposed in substantially parallel along a longitudinal side of the face, and the third and fourth edge portions are disposed in substantially parallel along a horizontal side of the face. The input terminals are formed on the first edge portion such that the input terminals are arranged along the longitudinal side. The first output terminals are formed on the second edge portion such that the first output terminals are arranged along the longitudinal side. The dummy terminals are formed such that the dummy terminals are disposed between the input terminals and the first output terminals. A warpage and defects of electrical connection between the driver chip and a display panel of the display apparatus are prevented.

摘要翻译： 驱动器芯片包括基体，输入端子，第一输出端子和虚拟端子。 基体包括具有第一至第四边缘部分的面。 第一边缘部分和第二边缘部分沿着所述面部的纵向侧基本上平行地布置，并且所述第三和第四边缘部分沿着所述面部的水平侧大致平行地设置。 输入端子形成在第一边缘部分上，使得输入端子沿着纵向侧布置。 第一输出端子形成在第二边缘部分上，使得第一输出端子沿着纵向侧布置。 虚拟端子形成为使得虚设端子设置在输入端子和第一输出端子之间。 防止驱动器芯片与显示装置的显示面板之间的翘曲和电连接的缺陷。

公开(公告)号：US07486284B2

公开(公告)日：2009-02-03

申请号：US11011746

申请日：2004-12-15

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

IPC分类号： G09G5/00

CPC分类号： H01L24/10 ,  G02F1/13452 ,  G02F2001/13456 ,  H01L24/06 ,  H01L24/13 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/00014

摘要： A driver chip includes a base body, an input terminal section and a first output terminal section. The base body includes a face having a long side and a short side. The input terminal section is formed at a first edge portion of the face along the long side. The first output terminal section is formed at a second edge portion that is opposite to the first edge portion. The input terminal section and the first output terminal section are disposed within about 9d/10 from a center of the long side toward the short side, wherein ‘d’ represents a distance between the center of the long side and the short side.

摘要翻译： 驱动器芯片包括基体，输入端子部分和第一输出端子部分。 基体包括具有长边和短边的面。 输入端子部分沿着长边形成在面部的第一边缘部分处。 第一输出端子部分形成在与第一边缘部分相对的第二边缘部分处。 输入端子部分和第一输出端子部分从长边的中心朝向短边设置在约9d / 10内，其中“d”表示长边的中心和短边之间的距离。

公开(公告)号：US07450393B2

公开(公告)日：2008-11-11

申请号：US10881156

申请日：2004-06-30

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

IPC分类号： H05K7/00

CPC分类号： H01L24/17 ,  G02F1/13452 ,  H01L23/4824 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/3011 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being arranged in a plurality of rows along the longitudinal direction of the base body. A plurality of conductive wirings is formed over the top face of the base body that electrically connects the driver circuit to the plurality of conductive bumps.

摘要翻译： 驱动器芯片包括其中形成有驱动电路的基体。 多个导电凸块设置在基体的顶面之上，多个导电凸块沿着基体的纵向排列成多列。 在基体的顶面上形成有多个导电布线，其将驱动电路电连接到多个导电凸块。

公开(公告)号：US20080174535A1

公开(公告)日：2008-07-24

申请号：US11954772

申请日：2007-12-12

申请人： Ju-Young Yoon ,  Chun-Ho Song ,  Seong-Yong Hwang

发明人： Ju-Young Yoon ,  Chun-Ho Song ,  Seong-Yong Hwang

IPC分类号： G09G3/36

CPC分类号： H01L24/81 ,  G02F1/13452 ,  H01L24/06 ,  H01L24/17 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/3511 ,  H01L2924/00

摘要： A driver chip includes a base body, input terminals, first output terminals and dummy terminals. The base body includes a face having first to fourth edge portions. The first and second edge portions are disposed in substantially parallel along a longitudinal side of the face, and the third and fourth edge portions are disposed in substantially parallel along a horizontal side of the face. The input terminals are formed on the first edge portion such that the input terminals are arranged along the longitudinal side. The first output terminals are formed on the second edge portion such that the first output terminals are arranged along the longitudinal side. The dummy terminals are formed such that the dummy terminals are disposed between the input terminals and the first output terminals. A warpage and defects of electrical connection between the driver chip and a display panel of the display apparatus are prevented.

摘要翻译： 驱动器芯片包括基体，输入端子，第一输出端子和虚拟端子。 基体包括具有第一至第四边缘部分的面。 第一边缘部分和第二边缘部分沿着所述面部的纵向侧基本上平行地布置，并且所述第三和第四边缘部分沿着所述面部的水平侧大致平行地设置。 输入端子形成在第一边缘部分上，使得输入端子沿着纵向侧布置。 第一输出端子形成在第二边缘部分上，使得第一输出端子沿着纵向侧布置。 虚拟端子形成为使得虚设端子设置在输入端子和第一输出端子之间。 防止驱动器芯片与显示装置的显示面板之间的翘曲和电连接的缺陷。

公开(公告)号：US20060146214A1

公开(公告)日：2006-07-06

申请号：US10534983

申请日：2003-12-05

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Ju-Young Yoon ,  Sung-Chul Kang

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Ju-Young Yoon ,  Sung-Chul Kang

IPC分类号： G02F1/136

CPC分类号： G02F1/13454 ,  G02F1/13452 ,  G02F1/13458 ,  G02F2202/022 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L27/1203 ,  H01L27/124 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13012 ,  H01L2224/13019 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1358 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/014 ,  H01L2224/05599

摘要： A conductive bump including a plurality of protrusion members (251) and a conductive layer (252) formed on the protrusion members is disposed on a TFT substrate (200). Each of the protrusion members is disposed on an electrode pad (270y, b, 280c, b) in a pad region (292, 293) of the TFT substrate, and the conductive layer is electrically connected to the electrode pad. A non-conductive resin (600) is disposed on the conductive bump, and a driving IC (500) is thermally compressed on the conductive bump. Therefore, the electrical contact characteristic between the driving IC and the electrode pad is improved.

摘要翻译： 在TFT基板（200）上设置包括形成在突出部件上的多个突起部件（251）和导电层（252）的导电性凸块。 每个突起构件设置在TFT基板的焊盘区域（292,293）中的电极焊盘（270y，b，280c，b）上，并且导电层电连接到电极焊盘。 在导电凸块上设置非导电树脂（600），驱动IC（500）在导电凸块上被热压缩。 因此，提高了驱动IC和电极焊盘之间的电接触特性。

公开(公告)号：US20050195130A1

公开(公告)日：2005-09-08

申请号：US11011746

申请日：2004-12-15

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Sung-Lak Choi ,  Chun-Ho Song ,  Ju-Young Yoon

IPC分类号： G02F1/1345 ,  G02F1/133 ,  G09F9/00 ,  G09G3/20 ,  G09G3/36 ,  H01L21/60 ,  H01L23/538 ,  H03K17/16 ,  H03K19/003

CPC分类号： H01L24/10 ,  G02F1/13452 ,  G02F2001/13456 ,  H01L24/06 ,  H01L24/13 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/13 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2924/00014

摘要： A driver chip includes a base body, an input terminal section and a first output terminal section. The base body includes a face having a long side and a short side. The input terminal section is formed at a first edge portion of the face along the long side. The first output terminal section is formed at a second edge portion that is opposite to the first edge portion. The input terminal section and the first output terminal section are disposed within about 9d/10 from a center of the long side toward the short side, wherein ‘d’ represents a distance between the center of the long side and the short side. The input and first output terminals formed on other region than an edge portion of a base body, on which stress is concentrated, enhance a reliability of electric connection between the driver chip and a display panel.

摘要翻译： 驱动器芯片包括基体，输入端子部分和第一输出端子部分。 基体包括具有长边和短边的面。 输入端子部分沿着长边形成在面部的第一边缘部分处。 第一输出端子部分形成在与第一边缘部分相对的第二边缘部分处。 输入端子部分和第一输出端子部分从长边的中心朝向短边设置在约9d / 10内，其中“d”表示长边的中心和短边之间的距离。 形成在比应力集中的基体的边缘部分的其它区域上的输入和第一输出端子增强了驱动器芯片和显示面板之间的电连接的可靠性。

公开(公告)号：US20050173785A1

公开(公告)日：2005-08-11

申请号：US10970360

申请日：2004-10-21

申请人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Ju-Young Yoon ,  Sung-Lak Choi ,  Chun-Ho Song

发明人： Seong-Yong Hwang ,  Weon-Sik Oh ,  Ju-Young Yoon ,  Sung-Lak Choi ,  Chun-Ho Song

IPC分类号： H01L23/48 ,  H01L21/60 ,  H01L23/02 ,  H05K3/32

CPC分类号： H01L24/83 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/838 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01028

摘要： In an anisotropic conductive film including conductive particles, and a bump, and a packaging structure of a semiconductor chip having the anisotropic conductive film and the bump, the anisotropic conductive film includes a resin layer and the conductive particles. The anisotropic conductive film electrically connects an electrode of a substrate and the bump of a semiconductor chip. A volume ratio of the conductive particles to the resin layer is about 0.1 to about 0.12. A number of the conductive particles per m3 is about 4 millions to about 7 millions. A standard deviation of heights of the bumps is no more than about 0.25. An interval between each of the bumps and an electrode of the substrate is no more than about 1.3 μm. Therefore, the size of each of the conductive particles is optimized so that a failure probability of the open circuit is decreased.

摘要翻译： 在包括导电颗粒和凸块的各向异性导电膜和具有各向异性导电膜和凸块的半导体芯片的封装结构中，各向异性导电膜包括树脂层和导电颗粒。 各向异性导电膜将衬底的电极和半导体芯片的凸起电连接。 导电颗粒与树脂层的体积比为约0.1至约0.12。 每m 3+的导电颗粒数目约为4百万至约7百万。 凸块的高度的标准偏差不大于约0.25。 每个凸起和基底的电极之间的间隔不大于约1.3μm。 因此，优化每个导电粒子的尺寸，使得开路的故障概率降低。