公开(公告)号：US08313834B2

公开(公告)日：2012-11-20

申请号：US12677758

申请日：2008-09-10

申请人： Atsushi Sato ,  Toru Maeda

发明人： Atsushi Sato ,  Toru Maeda

IPC分类号： B32B5/16 ,  H01F41/02 ,  H01F41/16

CPC分类号： H01F3/14 ,  B22F2998/00 ,  H01F1/24 ,  H01F1/26 ,  H01F27/255 ,  H01F27/346 ,  H01F41/0246 ,  H01F2027/348 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/02

摘要： To provide a core for reactor capable of reducing the eddy current loss and improving the direct current superposition characteristics, a manufacturing method thereof, and a reactor. A core for reactor M is obtained by press molding metallic magnetic particles coated with an insulating coated film, and the metallic magnetic particles have the following compositions: (1) the mean particle size is 1 μm or more and 70 μm or less; (2) the variation coefficient Cv which is a ratio (σ/μ) of the standard deviation (σ) of the particle size and the mean particle size (μ) is 0.40 or less; and (3) the degree of circularity is 0.8 or more and 1.0 or less. On the outside of the insulating coated film, at least one of a heat-resistance imparting protective film and a flexible protective film is further provided as a outer coated film.

摘要翻译： 为了提供能够降低涡流损耗并提高直流叠加特性的反应器的核心，其制造方法和反应器。 反应器M的核心是通过对涂覆有绝缘涂膜的金属磁性颗粒进行冲压成型获得，并且金属磁性颗粒具有以下组成：（1）平均粒径为1μm以上且70μm以下; （2）作为粒径的标准偏差（＆sgr）与平均粒径（μ）的比值（＆sgr /μ）的变化系数Cv为0.40以下; （3）圆形度为0.8以上且1.0以下。 在绝缘涂膜的外侧，进一步提供耐热性赋予保护膜和柔性保护膜中的至少一种作为外涂​​膜。

公开(公告)号：US20120286191A1

公开(公告)日：2012-11-15

申请号：US13511061

申请日：2011-05-10

申请人： Toru Maeda ,  Asako Watanabe

发明人： Toru Maeda ,  Asako Watanabe

IPC分类号： H01F1/06 ,  H01F1/08

CPC分类号： H01F1/0552 ,  B22F1/0062 ,  B22F2998/10 ,  C22C33/0278 ,  C22C38/002 ,  C22C38/005 ,  C22C2202/02 ,  H01F1/0572 ,  H01F1/0573 ,  H01F1/0575 ,  H01F1/0576 ,  H01F1/0578 ,  H01F1/061 ,  H01F1/083 ,  H01F41/0293 ,  B22F3/02 ,  B22F2003/248

摘要： The present invention provides a powder for a magnetic member being excellent in moldability and difficult to oxidize, a powder compact produced from the powder, and a magnetic member suitable for a raw material of a magnetic member such as a rare earth magnet. A powder for a magnetic member includes magnetic particles 1 which constitute the powder for a magnetic member and each of which is composed of less than 40% by volume of a hydrogen compound 3 of a rare earth element, and the balance composed of an iron-containing material 2 which contains iron and an iron-boron alloy containing iron and boron. The hydrogen compound 3 of a rare earth element is dispersed in a phase of the iron-containing material 2. An antioxidant layer 4 having a low-oxygen permeability coefficient is provided on the surface of each of the magnetic particles 1. Since the phase of the iron-containing material 2 is uniformly present in each of the magnetic particles 1, the powder has excellent moldability and the density of a powder compact can be easily increased. By providing the antioxidant layer 4, oxidation of a newly formed surface formed on each of the magnetic particle 1 during molding is little oxidized, and a decrease in a magnetic phase ratio due to the presence of an oxide can be suppressed.

摘要翻译： 本发明提供了一种成型性好，难以氧化的磁性部件粉末，由该粉末制成的粉末成形体，以及适用于稀土类磁铁等磁性部件的原料的磁性部件。 磁性部件用粉末包括构成磁性部件用粉末的磁性粒子1，它们各自由少于40体积％的稀土元素的氢化合物3构成，其余由铁 - 含有铁的含铁材料2和含有铁和硼的铁 - 硼合金。 稀土元素的氢化合物3分散在含铁材料2的相中。在每个磁性粒子1的表面上设置有具有低氧渗透系数的抗氧化层4。 含铁材料2均匀地存在于每个磁性颗粒1中，粉末具有优异的成型性，并且粉末压块的密度可以容易地增加。 通过设置抗氧化剂层4，在模制期间形成在每个磁性颗粒1上的新形成的表面的氧化几乎不被氧化，并且可以抑制由于存在氧化物而引起的磁相比的降低。

公开(公告)号：US20110114708A1

公开(公告)日：2011-05-19

申请号：US13055747

申请日：2009-07-08

申请人： Toru Maeda ,  Tetsuro Tanikawa ,  Akinobu Teramoto ,  Masaaki Oda

发明人： Toru Maeda ,  Tetsuro Tanikawa ,  Akinobu Teramoto ,  Masaaki Oda

IPC分类号： B23K1/20 ,  C09D11/00 ,  B23K3/06 ,  B23K3/04 ,  B82Y30/00

CPC分类号： B22F1/0062 ,  B22F2999/00 ,  H01L21/4867 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/1152 ,  H01L2224/1329 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13399 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8184 ,  H01L2225/06513 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  B22F1/0018 ,  H01L2924/00014 ,  H01L2924/00

摘要： Metal nanoink (100) for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent (105) in the form of oxygen nanobubbles (125) or oxygen bubbles (121) either before or after metal nanoparticles (101) whose surfaces are coated with a dispersant (102) are mixed into the organic solvent (105). Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink (100) onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.

摘要翻译： 通过将氧气注入到有机溶剂中来制造用于将半导体管芯的电极和基板的电极接合和/或接合半导体管芯的电极和另一个半导体管芯的电极的金属纳米管（100） 在其表面涂布有分散剂（102）的金属纳米颗粒（101）之前或之后，将氧纳米气泡（125）或氧气（121）的形式混合到有机溶剂（105）中。 通过将金属纳米线（100）的微滴喷射到电极上，在半导体管芯的电极和基板的电极上形成凸起，将半导体管芯上下颠倒并重叠在衬底上，然后将金属 通过按压和加热电极之间的凸块，在凸起的纳米颗粒被烧结。 结果，在压力下烧结过程中产生的空隙被最小化。

公开(公告)号：US20100194516A1

公开(公告)日：2010-08-05

申请号：US12677758

申请日：2008-09-10

申请人： Atsushi Sato ,  Toru Maeda

发明人： Atsushi Sato ,  Toru Maeda

IPC分类号： H01F17/04 ,  H01F27/255

CPC分类号： H01F3/14 ,  B22F2998/00 ,  H01F1/24 ,  H01F1/26 ,  H01F27/255 ,  H01F27/346 ,  H01F41/0246 ,  H01F2027/348 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/02

摘要： To provide a core for reactor capable of reducing the eddy current loss and improving the direct current superposition characteristics, a manufacturing method thereof, and a reactor. A core for reactor M is obtained by press molding metallic magnetic particles coated with an insulating coated film, and the metallic magnetic particles have the following compositions: (1) the mean particle size is 1 μm or more and 70 μm or less; (2) the variation coefficient Cv which is a ratio (σ/μ) of the standard deviation (σ) of the particle size and the mean particle size (μ) is 0.40 or less; and (3) the degree of circularity is 0.8 or more and 1.0 or less. On the outside of the insulating coated film, at least one of a heat-resistance imparting protective film and a flexible protective film is further provided as a outer coated film.

摘要翻译： 为了提供能够降低涡流损耗并提高直流叠加特性的反应器的核心，其制造方法和反应器。 反应器M的核心是通过对涂覆有绝缘涂膜的金属磁性颗粒进行冲压成型获得，并且金属磁性颗粒具有以下组成：（1）平均粒径为1μm以上且70μm以下; （2）作为粒径的标准偏差（＆sgr）与平均粒径（μ）的比值（＆sgr /μ）的变化系数Cv为0.40以下; （3）圆形度为0.8以上且1.0以下。 在绝缘涂膜的外侧，进一步提供耐热性赋予保护膜和柔性保护膜中的至少一种作为外涂​​膜。

公开(公告)号：US20100093131A1

公开(公告)日：2010-04-15

申请号：US12526730

申请日：2008-02-26

申请人： Toru Maeda

发明人： Toru Maeda

IPC分类号： H01L21/822 ,  H01L21/60 ,  B23K3/06 ,  B23K1/06 ,  B23K20/10

CPC分类号： H01L24/11 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11318 ,  H01L2224/11332 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/75 ,  H01L2224/7525 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that carries out secondary bonding so that the electrodes become conductive by pressurizing the primary bonded bump in bonding direction and by heating the bump to pressurize and sinter the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.

摘要翻译： 使用金属纳米膏将半导体管芯（12）的电极和电路基板（19）的电极接合的接合装置（10）包括通过注入金属纳米粒子的微滴形成凸块的凸块形成机构（20） 粘贴在每个电极上，主键合机构（50），其通过将半导体管芯（12）的凸起压靠在电路板（19）的凸块上而在非导电状态下对电极进行初次接合，以及 二次接合机构（80），其进行二次接合，使得电极通过在接合方向上加压一次接合凸块而导电，并且通过加热凸块来加压和烧结凸块中的金属纳米颗粒。 由此，能够以简单且容易的方式有效地接合电极，同时降低接合负载。

公开(公告)号：US20100089980A1

公开(公告)日：2010-04-15

申请号：US12526725

申请日：2008-02-26

申请人： Toru Maeda

发明人： Toru Maeda

IPC分类号： B23K31/02 ,  B23K3/06 ,  B23K3/08 ,  B23K28/00

CPC分类号： H01L24/11 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11318 ,  H01L2224/11332 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/75 ,  H01L2224/7525 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81121 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that includes a pressurizing unit that pressurizes the primary bonded bump in bonding direction, and that carries out secondary bonding so that the electrodes become conductive by heating the bump up to a temperature higher than a binder removal temperature of the metal nano paste and a dispersant removal temperature of the metal nano paste, removing the binder and the dispersant, and pressurizing and sintering the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.

摘要翻译： 使用金属纳米膏将半导体管芯（12）的电极和电路基板（19）的电极接合的接合装置（10）包括通过注入金属纳米粒子的微滴形成凸块的凸块形成机构（20） 粘贴在每个电极上，主键合机构（50），其通过将半导体管芯（12）的凸起压靠在电路板（19）的凸块上而在非导电状态下对电极进行初次接合，以及 二次接合机构（80），其包括在接合方向上对一次接合凸块加压的加压单元，并且进行二次接合，使得通过将凸起加热至高于金属的粘合剂去除温度的温度来使电极变得导电 纳米糊剂和金属纳米糊剂的分散剂去除温度，去除粘合剂和分散剂，并且在凸块中加压和烧结金属纳米颗粒。 由此，能够以简单且容易的方式有效地接合电极，同时降低接合负载。

公开(公告)号：US07365450B2

公开(公告)日：2008-04-29

申请号：US11014256

申请日：2004-12-16

申请人： Toshihiro Nagae ,  Kazuya Otani ,  Toru Maeda

发明人： Toshihiro Nagae ,  Kazuya Otani ,  Toru Maeda

IPC分类号： B60R25/02 ,  H01H27/00 ,  H02H3/00 ,  H02H7/08

CPC分类号： H02P7/29 ,  B60R25/02153 ,  H02P7/04 ,  Y10T70/5956

摘要： An electric cutoff circuit for preventing overheating of a load. The current shutoff circuit includes an FET connected to a motor circuit. A relay fault detection circuit is connected to the motor circuit to detect potential at the motor circuit. A CPU sends a control signal to a relay. The CPU determines whether a fault has occurred in the relay based on the control signal sent to the relay and the detection of the relay fault detection circuit. When determining that a fault has occurred in the relay, the CPU opens the FET to configure an open circuit with the motor circuit.

摘要翻译： 一种用于防止负载过热的断电电路。 目前的截止电路包括连接到电动机电路的FET。 一个继电器故障检测电路连接到电机电路，以检测电机电路的电位。 CPU向控制器发送控制信号。 CPU基于发送给继电器的控制信号和继电器故障检测电路的检测来确定继电器中是否发生故障。 当确定继电器发生故障时，CPU打开FET以配置电机电路的开路。

公开(公告)号：US07161262B2

公开(公告)日：2007-01-09

申请号：US10404344

申请日：2003-04-01

申请人： Toshihiro Nagae ,  Masaki Yoshino ,  Hisashi Kato ,  Toru Maeda ,  Masaki Hayashi ,  Tomoyuki Funayama ,  Toshio Asahi ,  Tomoo Kakegawa ,  Toshinori Aoki

发明人： Toshihiro Nagae ,  Masaki Yoshino ,  Hisashi Kato ,  Toru Maeda ,  Masaki Hayashi ,  Tomoyuki Funayama ,  Toshio Asahi ,  Tomoo Kakegawa ,  Toshinori Aoki

IPC分类号： B60R25/04 ,  B60R25/10 ,  H01H27/00

CPC分类号： B60R25/02156 ,  B60R25/04 ,  B60R25/24

摘要： A start control apparatus has a steering lock mechanism, which includes a lock pin and a lock control unit. The lock pin is selectively engaged and disengaged from the steering shaft. The lock control unit controls the lock pin. The start control apparatus further includes a portable communication device, a verification control unit, which communicates with the portable communication device, a power source control unit, which control power supply, an engine control unit, which controls the engine, a lock state detecting switch, which detects an engaged state and a disengaged state of the lock pin. The lock control unit and the power source control unit monitor detection signals from the lock state detecting switch. The engine is permitted to be started on condition that the control units acknowledge that the lock bar is in the disengaged state.

摘要翻译： 起动控制装置具有转向锁定机构，其包括锁定销和锁定控制单元。 锁定销选择性地与转向轴接合和分离。 锁定控制单元控制锁定销。 启动控制装置还包括便携式通信装置，与便携式通信装置通信的验证控制单元，控制电源的电源控制单元，控制发动机的发动机控制单元，锁定状态检测开关 ，其检测锁定销的接合状态和分离状态。 锁定控制单元和电源控制单元监视来自锁定状态检测开关的检测信号。 在控制单元承认锁定杆处于分离状态的情况下允许发动机起动。

公开(公告)号：US20060152348A1

公开(公告)日：2006-07-13

申请号：US10542282

申请日：2004-11-04

申请人： Kiyokazu Ohtaki ,  Toru Maeda ,  Hisashi Kato ,  Akiyoshi Osumi ,  Takeshi Kumazaki ,  Ifushi Shimonomoto ,  Toshio Shimomura ,  Yoshinori Fukuoka ,  Koichi Masamura

发明人： Kiyokazu Ohtaki ,  Toru Maeda ,  Hisashi Kato ,  Akiyoshi Osumi ,  Takeshi Kumazaki ,  Ifushi Shimonomoto ,  Toshio Shimomura ,  Yoshinori Fukuoka ,  Koichi Masamura

IPC分类号： B60R25/10

CPC分类号： B60R25/24 ,  B60R25/04

摘要： A vehicle security device for improving the security level of a vehicle. The vehicle security device is connected to an engine and communicates with a portable device. A smart ECU performs a first coded communication to establish mutual authentication with the portable device. An ID code box is connected to the smart ECU, has a first code and a second code, and does not communicate with the portable device. The ID code box performs a second coded communication using the first code to establish a second mutual authentication with the smart ECU. An engine ECU performs a third coded communication using the second code to establish a third mutual authentication with the ID code box. The engine ECU enables the engine to be started when every one of the first, second, and third mutual authentications are established.

摘要翻译： 一种用于改善车辆安全级别的车辆安全装置。 车辆安全装置连接到发动机并与便携式装置通信。 智能ECU执行第一编码通信以建立与便携式设备的相互认证。 ID代码框连接到智能ECU，具有第一代码和第二代码，并且不与便携式设备通信。 ID代码框使用第一代码执行第二编码通信，以与智能ECU建立第二相互认证。 发动机ECU使用第二代码执行第三编码通信，以与ID代码框建立第三相互认证。 当建立第一，第二和第三相互认证中的每一个时，发动机ECU使发动机能够启动。

公开(公告)号：US20050274771A1

公开(公告)日：2005-12-15

申请号：US11150415

申请日：2005-06-10

申请人： Osamu Kakutani ,  Toru Maeda

发明人： Osamu Kakutani ,  Toru Maeda

IPC分类号： H01L21/60 ,  B23K5/00 ,  B23K20/00 ,  B23K37/00 ,  B23K37/02 ,  H01L21/52

CPC分类号： B23K20/004 ,  B23K20/005 ,  B23K37/0247 ,  H01L24/78 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2224/48 ,  H01L2224/45099

摘要： A bonding apparatus 10 including an X and Y motor parts 20 and 50, which have substantially the same construction, and a moving table 60, which can be moved in the XY plane by these motor parts. The X motor part 20 and Y motor part 50 are connected to the moving table 60 by joint mechanisms 42 and 52 that are rotatable. In the X and Y motor parts 20 and 50, the movable coils 30 of the movable elements 24 are shaft-supported by shaft-supporting mechanisms 36 so that these coils are rotatable about the Z axis, and the shaft-supporting mechanisms 36 are guided so as to be movable linearly in the X and Y axial directions respectively by a guide mechanism formed with guide rails 38 and linear guides 37.

摘要翻译： 包括具有基本相同结构的X和Y电动机部件20和50的接合装置10以及可以通过这些电动机部件在XY平面中移动的移动台60。 X电动机部20和Y电动机部50通过能够旋转的接合机构42,52与移动台60连接。 在X和Y电动机部件20和50中，可移动元件24的可动线圈30由轴支撑机构36轴支撑，使得这些线圈可绕Z轴旋转，并且轴支撑机构36被引导 以便能够通过形成有导轨38和直线导轨37的引导机构在X轴方向和Y轴方向上线性移动。