Abstract:
A three-dimensional holographic image display device and a method using the same are provided. Light corresponding to left and right eye holograms is emitted according to a time division method and divided into a first path and a second path. Active shutters operate substantially in synchronization with the emitted left and right eye holograms to provide images to a user's left and right eyes.
Abstract:
A changeable liquid lens array and a method of manufacturing the same. The changeable liquid lens array includes a substrate, a plurality of partition walls arrayed on the substrate and having a fluid travel path, cells defined by the plurality of partition walls, a first fluid comprised in the cells, a second fluid arranged on the first fluid, a first electrode arranged on at least one side surface of each of the partition walls, and a second electrode disposed to be separate from the partition walls. A shape of shape of an interface between the first fluid and the second fluid changes based on a voltage that is applied to the first electrode and the second electrode.
Abstract:
The front light unit includes a light source and a light guide plate that guides light emitted from the light source. The light guide plate includes a rear surface through which the guided light is emitted and a front surface facing the rear surface, and a plurality of prism shape structures which are provided in one unit with the light guide plate and emits light totally reflected from the front surface of the light guide plate. The light guide plate and the prism shape structures are formed of a transparent elastic material.
Abstract:
Light guide plates having a filled-in type light emitting structure, display apparatuses using a light guide plate and methods of fabricating the same are provided, the light guide plates include a transparent light guide member, and a reflection member filled in the light guide member. The reflection member reflects light incident on the light guide member. The reflection member has a plurality of light exit holes through which light, reflected inside the light guide member, exits.
Abstract:
Example embodiments relate to a backlight unit and a display apparatus employing the same. The backlight unit may include a light source; a polarization conversion unit configured to convert polarization of light incident from the light source; and a light guide plate configured to emit light incident through the polarization conversion unit. The light guide plate may include a plurality of light emitting portions configured to emit light through specular reflection. The light polarized by the polarization conversion unit may maintain its polarization state when it is subsequently emitted from the light guide plate.
Abstract:
A display apparatus according to example embodiments may include a light source; an all-in-one type light guide plate; a reflective plate; and a display panel. The all-in-one type light guide plate may include a light guide member and light emitting members, wherein the light guide member reflects light incident from the light source toward the light emitting members, and the light emitting members protrude from one side of the light guide member and emit light incident from the light guide member. The light guide member and the light emitting members may be integrally formed or individually combined to form an all-in-one type light guide plate. The display apparatus may form an image using light from a backlight unit and external light.
Abstract:
A flip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer having a first electrode and a first under bump metal (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM formed on the second electrode and electrically connected to the second electrode. The first wafer has a depression formed on one or more areas adjacent to the first UBM, which depression partly receives a solder ball that connects the first and the second UBMs upon flip-chip bonding of the first and second wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.
Abstract:
An ink-jet printhead, and a method of manufacturing the same, includes a substrate, an ink chamber, a manifold, and an ink channel formed between the ink chamber and the manifold to provide flow communication between the ink chamber and the manifold, a substantially flat nozzle plate formed on the upper surface of the substrate, the nozzle plate including a plurality of passivation layers, a heat dissipation layer disposed on the plurality of passivation layers, the heat dissipation layer formed of a thermally conductive material and including a first thermally conductive layer formed on the plurality of passivation layers and a second thermally conductive layer formed on the first thermally conductive layer, and a nozzle extending through the nozzle plate in flow communication with the ink chamber, and a heater and a conductor, the heater heating ink filled in the ink chamber and the conductor applying current to the heater.
Abstract:
A monolithic ink-jet printhead includes a substrate having an ink chamber, a manifold, and an ink channel in flow communication, a nozzle plate including a plurality of passivation layers stacked on the substrate and a heat dissipating layer stacked on the passivation layers, a nozzle for ejecting ink penetrating the nozzle plate, a heater provided between adjacent passivation layers above the ink chamber, and a conductor between adjacent passivation layers, the conductor being electrically connected to the heater, wherein the heat dissipating layer is made of a thermally conductive metal for dissipating heat from the heater, the lower part of the nozzle is formed by penetrating the plurality of passivation layers, and the upper part of the nozzle is formed by penetrating the heat dissipating layer in a tapered shape in which a cross-sectional area thereof decreases gradually toward an exit thereof.
Abstract:
Disclosed is a method for forming a plurality of metal structures having different heights on a semiconductor substrate. The disclosed method for manufacturing a metal structure having different heights includes: forming a plurality of seed layers, to have heights corresponding to the metal structure to be formed, on a semiconductor substrate so that those layers can be electrically separated, performing a plating process using a plating mold, and applying different currents to the respective seed layers so that the plating thickness can be adjusted for each of the seed layers. Accordingly, a plurality of metal structures having different heights can be obtained by a plating mold forming process and a plating process that are performed just once, respectively.