公开(公告)号：US20200161230A1

公开(公告)日：2020-05-21

申请号：US16194377

申请日：2018-11-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John Knickerbocker ,  Bing Dang ,  Raymond Horton ,  Joana Maria

IPC: H01L23/498 ,  H01L23/48 ,  H01L21/768 ,  H01L21/48 ,  H01L21/20 ,  H01L21/683

Abstract: Die stacks and methods of making die stacks with very thin dies are disclosed. The die surfaces remain flat within a 5 micron tolerance despite the thinness of the die and the process steps of making the die stack. A residual flux height is kept below 50% of the spacing distance between adjacent surfaces or structures, e.g. in the inter-die spacing.

公开(公告)号：US20200075906A1

公开(公告)日：2020-03-05

申请号：US16121307

申请日：2018-09-04

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  Bo Wen ,  Marlon Agno ,  John Knickerbocker

IPC: H01M2/02 ,  H01M2/08 ,  H01M10/0585

Abstract: Techniques regarding a thin film battery, which can comprise one or more sealing layers, and a method of manufacturing thereof are provided. For example, one or more embodiments described herein can regard an apparatus that can comprise a thin film battery cell encapsulated in a multi-layer stack comprising an adhesive layer located between a first substrate layer and a second substrate layer. The apparatus can also comprise a metal sealing layer at least partially surrounding the multi-layer stack.

公开(公告)号：US20190326190A1

公开(公告)日：2019-10-24

申请号：US16432377

申请日：2019-06-05

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Joana Sofia Branquinho Teresa Maria

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/683 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065

Abstract: A method of manufacturing integrated devices, and a stacked integrated device are disclosed. In an embodiment, the method comprises providing a substrate; mounting at least a first electronic component on the substrate; positioning a handle wafer above the first electronic component; attaching the first electronic component to the substrate via electrical connectors between the first electronic component and the substrate; and while attaching the first electronic component to the substrate, using the handle wafer to apply pressure, toward the substrate, to the first electronic component, to manage planarity of the first electronic component during the attaching. In an embodiment, a joining process is used to attach the first electronic component to the substrate via the electrical connectors. For example, thermal compression bonding may be used to attach the first electronic component to the substrate via the electrical connectors.

公开(公告)号：US10330701B2

公开(公告)日：2019-06-25

申请号：US14962331

申请日：2015-12-08

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Yu Luo ,  John Knickerbocker ,  Yang Liu ,  Steven L. Wright

IPC: G01R1/073 ,  G01R31/28 ,  B23K35/00 ,  H01L23/00 ,  B81C1/00

Abstract: A test probe head for probe testing multiple chips on a wafer in a single probing. A probe head substrate includes an array of probe tip attach pads on one surface. The array includes a subarray for each probe head chip test site. Probe tips attached to each probe tip attach pad have an across the head tip height variation less than one micrometer (1 μm). The subarray probe tips may be on a pitch at or less than fifty microns (50 μm). The test probe head may be capable of test probing all chips in a quadrant and even up to all chips on a single wafer in a single probing.

公开(公告)号：US09691747B1

公开(公告)日：2017-06-27

申请号：US14977068

申请日：2015-12-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  John Knickerbocker

IPC: H01L21/78 ,  H01L25/00 ,  H01L25/065 ,  H01L21/66 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L25/075 ,  H01L25/11 ,  H01L25/04 ,  H01L25/07

CPC classification number: H01L25/50 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/20 ,  H01L24/32 ,  H01L24/81 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/0756 ,  H01L25/117 ,  H01L25/167 ,  H01L25/18 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2223/6677 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/80121 ,  H01L2224/80143 ,  H01L2224/81005 ,  H01L2224/95001 ,  H01L2224/95144 ,  H01L2224/95146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014

Abstract: Disclosed is a process, structure, equipment and apparatus directed to a low cost, high volume approach for the assembly of ultra small die to three-dimensional (3D) or 2.5D semiconductor packages.

公开(公告)号：US20240334616A1

公开(公告)日：2024-10-03

申请号：US18194597

申请日：2023-03-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Keiji Matsumoto ,  Mukta Ghate Farooq ,  John Knickerbocker

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K7/20

CPC classification number: H05K3/4602 ,  H05K1/0212 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/0055 ,  H05K7/20509 ,  H05K2201/09145

Abstract: A method for manufacturing an electronic package includes etching one or more lateral surfaces of a PCB laminate to expose power and ground planes of the PCB laminate. A protective coating is applied to the exposed power and ground planes. At least one heat-generating component is affixed to a top surface of the PCB laminate. A heat spreader having a base section and flanged edges is formed and attached to the heat-generating components and the PCB laminate lateral surfaces, where the flanged edges of the heat spreader are thermally connected to the PCB laminate lateral surfaces. During operation of the heat-generating components, the flanged edges dissipate heat from the PCB laminate lateral surfaces.

公开(公告)号：US20240120705A1

公开(公告)日：2024-04-11

申请号：US17962434

申请日：2022-10-07

Applicant: International Business Machines Corporation

Inventor： Keiji Matsumoto ,  Mukta Ghate Farooq ,  John Knickerbocker

IPC: H01S5/024 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01S5/02469 ,  H01L23/367 ,  H01L23/373

Abstract: A heat spreader apparatus includes a first portion; a second portion; and a connecting portion between the first and second portions, with high-conductivity axes and a low-conductivity axis, the low-conductivity axis being directed between the first and second portions. In one or more embodiments, the first, second, and connecting portions are thermally anisotropic blocks, and the apparatus forms a rectangular prism.

公开(公告)号：US11908723B2

公开(公告)日：2024-02-20

申请号：US17541946

申请日：2021-12-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Akihiro Horibe ,  Qianwen Chen ,  Risa Miyazawa ,  Michael P. Belyansky ,  John Knickerbocker ,  Takashi Hisada

IPC: H01L21/68 ,  H01L21/683

CPC classification number: H01L21/681 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: Handler wafers and methods of handling a wafer include positioning a handler, which is attached to a wafer by a bonding layer that comprises a debonding layer, an optical enhancement layer, and an anti-reflection layer. The handler is debonded from the wafer using a laser that emits laser energy at a wavelength that is absorbed by the debonding layer and that is confined to the debonding layer by the optical enhancement layer, such that the material of the debonding layer ablates when exposed to the laser energy to release the wafer.

公开(公告)号：US11903734B2

公开(公告)日：2024-02-20

申请号：US16238143

申请日：2019-01-02

Applicant: International Business Machines Corporation

Inventor： Rajeev Narayanan ,  Katsuyuki Sakuma ,  John Knickerbocker ,  Bucknell C. Webb

IPC: A61B5/00 ,  G06F3/01 ,  H02S40/30

CPC classification number: A61B5/6826 ,  A61B5/6833 ,  G06F3/015 ,  H02S40/30

Abstract: Systems, computer-implemented methods and/or computer program products that facilitate wearable multiplatform sensing are provided. In one embodiment, a computer-implemented method comprises: measuring, by a system operatively coupled to a processor, wirelessly on a nail plate, physiological data of an entity; integrating and synchronizing, by the system, the physiological data with other physiological data from one or more devices to form integrated physiological data; and analyzing, by the system, the integrated physiological data to detect one or more disorders.

公开(公告)号：US11539088B2

公开(公告)日：2022-12-27

申请号：US16813071

申请日：2020-03-09

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Leanna Pancoast ,  Jae-Woong Nah ,  John Knickerbocker

IPC: H01M50/10 ,  H01M10/052 ,  H01M10/04 ,  H01M50/116 ,  H01M50/543

Abstract: Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.