公开(公告)号：US20200321318A1

公开(公告)日：2020-10-08

申请号：US16909522

申请日：2020-06-23

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Ye ,  Hong Wan Ng

IPC: H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L23/00 ,  G06F13/16 ,  H01L23/31

Abstract: Semiconductor devices with controllers under stacks of semiconductor packages and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate, a controller attached to the package substrate, and at least two semiconductor packages disposed over the controller. Each semiconductor package includes a plurality of semiconductor dies. The semiconductor device further includes an encapsulant material encapsulating the controller and the at least two semiconductor packages.

公开(公告)号：US20200279832A1

公开(公告)日：2020-09-03

申请号：US16876520

申请日：2020-05-18

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Ye ,  Hong Wan Ng

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L25/00 ,  H01L21/78

Abstract: Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.

公开(公告)号：US10727206B2

公开(公告)日：2020-07-28

申请号：US16043049

申请日：2018-07-23

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Ye ,  Hong Wan Ng

IPC: H01L25/065 ,  H01L25/18 ,  H01L25/00 ,  H01L23/00 ,  G06F13/16 ,  H01L23/31 ,  H01L21/66 ,  H01L25/03

Abstract: Semiconductor devices with controllers under stacks of semiconductor packages and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate, a controller attached to the package substrate, and at least two semiconductor packages disposed over the controller. Each semiconductor package includes a plurality of semiconductor dies. The semiconductor device further includes an encapsulant material encapsulating the controller and the at least two semiconductor packages.

公开(公告)号：US20200020667A1

公开(公告)日：2020-01-16

申请号：US16578592

申请日：2019-09-23

Applicant: Micron Technology, Inc.

Inventor： Hong Wan Ng ,  Akshay N. Singh

IPC: H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/50

Abstract: A semiconductor device assembly includes a substrate having a plurality of external connections, a first shingled stack of semiconductor dies disposed directly over a first location on the substrate and electrically coupled to a first subset of the plurality of external connections, and a second shingled stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. The semiconductor device assembly further includes an encapsulant at least partially encapsulating the substrate, the first shingled stack and the second shingled stack.

公开(公告)号：US20190139934A1

公开(公告)日：2019-05-09

申请号：US15806808

申请日：2017-11-08

Applicant: Micron Technology, Inc.

Inventor： Hong Wan Ng ,  Akshay N. Singh

IPC: H01L25/065 ,  H01L23/50 ,  H01L23/00 ,  H01L25/00

Abstract: A semiconductor device assembly includes a substrate having a plurality of external connections, a first shingled stack of semiconductor dies disposed directly over a first location on the substrate and electrically coupled to a first subset of the plurality of external connections, and a second shingled stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. The semiconductor device assembly further includes an encapsulant at least partially encapsulating the substrate, the first shingled stack and the second shingled stack.

公开(公告)号：US20180350776A1

公开(公告)日：2018-12-06

申请号：US16043049

申请日：2018-07-23

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Ye ,  Hong Wan Ng

IPC: H01L25/065 ,  H01L25/00 ,  H01L25/18

Abstract: Semiconductor devices with controllers under stacks of semiconductor packages and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate, a controller attached to the package substrate, and at least two semiconductor packages disposed over the controller. Each semiconductor package includes a plurality of semiconductor dies. The semiconductor device further includes an encapsulant material encapsulating the controller and the at least two semiconductor packages.

公开(公告)号：US10128217B2

公开(公告)日：2018-11-13

申请号：US15431649

申请日：2017-02-13

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Ye ,  Hong Wan Ng

IPC: H01L25/065 ,  H01L25/00 ,  G06F13/16 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18 ,  H01L21/66 ,  H01L25/03

Abstract: Semiconductor devices with controllers under stacks of semiconductor packages and associated systems and methods are disclosed herein. In one embodiment, a semiconductor device includes a package substrate, a controller attached to the package substrate, and at least two semiconductor packages disposed over the controller. Each semiconductor package includes a plurality of semiconductor dies. The semiconductor device further includes an encapsulant material encapsulating the controller and the at least two semiconductor packages.

公开(公告)号：US20160329303A1

公开(公告)日：2016-11-10

申请号：US14705274

申请日：2015-05-06

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Hong Wan Ng

IPC: H01L25/065 ,  H01L27/115 ,  H01L21/48 ,  H01L25/00 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L25/50 ,  H01L2224/48137 ,  H01L2224/48147 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2924/15311

Abstract: Semiconductor device packages include a stack of semiconductor memory devices positioned over an interposer substrate, a controller element, and a redistribution substrate positioned laterally adjacent to the controller element. At least a portion of the controller element is positioned directly between the stack and the interposer substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate. Methods of manufacturing a semiconductor device package include positioning a redistribution substrate laterally adjacent to a controller element and attaching the redistribution substrate and the controller element to an interposer substrate. A stack of semiconductor memory devices is positioned over the controller element and the redistribution substrate. The controller element is operatively connected to the semiconductor memory devices of the stack through the redistribution substrate and the interposer substrate.

Abstract translation: 半导体器件封装包括位于插入器衬底上的半导体存储器件的堆叠，控制器元件和与控制器元件横向相邻定位的再分配衬底。 控制器元件的至少一部分直接位于堆叠和中介层基板之间。 控制器元件通过再分配基板和插入器基板可操作地连接到堆叠的半导体存储器件。 制造半导体器件封装的方法包括将再分配衬底横向邻近控制器元件定位并将再分配衬底和控制器元件附接到插入器衬底。 一组半导体存储器件位于控制器元件和再分配衬底上。 控制器元件通过再分配基板和插入器基板可操作地连接到堆叠的半导体存储器件。

公开(公告)号：US09129862B2

公开(公告)日：2015-09-08

申请号：US14331722

申请日：2014-07-15

Applicant: Micron Technology, Inc.

Inventor： Teck Kheng Lee ,  David Yih Ming Chai ,  Hong Wan Ng

IPC: H01L21/00 ,  H01L23/02 ,  H01L23/12 ,  H01L21/768 ,  H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00

CPC classification number: H01L23/12 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05571 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15787 ,  Y10T29/49826 ,  H01L2924/00 ,  H01L2224/05552

Abstract: Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.

Abstract translation: 本文公开了微电子器件，相关联的组件和相关联的方法。 例如，本发明的某些方面涉及一种微电子装置，该微电子器件包括具有侧面和孔侧的微特征工件。 该装置还可包括具有表面的工件接触件。 工件接触面的至少一部分表面可以通过孔径和通过在孔和表面之间延伸的通道而接近。 本发明的其它方面涉及一种微电子支撑装置，其包括支撑构件，所述支撑构件具有承载能够连接到微特征工件的工件接触件的支撑触点的侧面。 该装置还可以包括由支撑构件承载的凹进的支撑接触装置。 凹入的支撑接触装置可以连接到微特征工件的第二工件接触件。

公开(公告)号：US20140141572A1

公开(公告)日：2014-05-22

申请号：US14165855

申请日：2014-01-28

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Chin Hui Chong ,  Hong Wan Ng

IPC: H05K3/30 ,  H05K3/34 ,  H05K3/10

CPC classification number: H05K3/303 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/06156 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H05K3/10 ,  H05K3/34 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Various embodiments of semiconductor assemblies with multi-level substrates and associated methods of manufacturing are described below. In one embodiment, a substrate for carrying a semiconductor die includes a first routing level, a second routing level, and a conductive via between the first and second routing levels. The conductive via has a first end proximate the first routing level and a second end proximate the second routing level. The first routing level includes a terminal and a first trace between the terminal and the first end of the conductive via. The second routing level includes a second trace between the second end of the conductive via and a ball site. The terminal of the first routing level and the ball site of the second routing level are both accessible for electrical connections from the same side of the substrate.

Abstract translation: 下面描述具有多层基板的半导体组件和相关制造方法的各种实施例。 在一个实施例中，用于承载半导体管芯的衬底包括第一路由级别，第二路由级别以及第一和第二路由级别之间的导电通路。 导电通孔具有接近第一路由级的第一端和靠近第二路由级的第二端。 第一路由级别包括端子和导体通孔的端子与第一端之间的第一迹线。 第二路由级别包括导电通孔的第二端和球场之间的第二迹线。 第一路由级别的终端和第二路由级别的球点都可以从基板的同一侧进行电连接。