公开(公告)号：US20150028406A1

公开(公告)日：2015-01-29

申请号：US13948746

申请日：2013-07-23

Applicant: Micron Technology, Inc.

Inventor： Sanh D. Tang ,  Kamal M. Karda ,  Wolfgang Mueller ,  Sourabh Dhir ,  Robert Kerr ,  Sangmin Hwang ,  Haitao Liu

IPC: H01L29/423 ,  H01L29/06 ,  H01L27/108

CPC classification number: H01L27/10823 ,  H01L21/76232 ,  H01L23/528 ,  H01L27/10808 ,  H01L27/10876 ,  H01L29/0649 ,  H01L29/66621 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An array of recessed access gate lines includes active area regions having dielectric trench isolation material there-between. The trench isolation material comprises dielectric projections extending into opposing ends of individual active area regions under an elevationally outermost surface of material of the active area regions. The active area material is elevationally over the dielectric projections. Recessed access gate lines individually extend transversally across the active area regions and extend between the ends of immediately end-to-end adjacent active area regions within the dielectric trench isolation material. Other arrays are disclosed, as are methods.

Abstract translation: 一组凹进的存取栅极线包括其间具有介电沟槽隔离材料的有源区域区域。 沟槽隔离材料包括延伸到有源区域区域的材料的最外表面下方的各个有源区域的相对端的电介质突起。 有源区域材料在电介质突起上是垂直的。 嵌入式栅极线分别横跨有源区域区域延伸并且在电介质沟槽隔离材料内的紧邻端到端相邻有源区域区域的端部之间延伸。 公开了其他阵列，方法也是如此。

公开(公告)号：US20140315364A1

公开(公告)日：2014-10-23

申请号：US14319201

申请日：2014-06-30

Applicant: Micron Technology, Inc.

Inventor： Jaydip Guha ,  Shyam Surthi ,  Suraj J. Mathew ,  Kamal M. Karda ,  Hung-Ming Tsai

IPC: H01L29/66

CPC classification number: H01L21/823487 ,  H01L27/108 ,  H01L27/10876 ,  H01L27/1104 ,  H01L29/41741 ,  H01L29/66666 ,  H01L29/66825 ,  H01L29/66833

Abstract: Trenches are formed into semiconductive material. Masking material is formed laterally over at least elevationally inner sidewall portions of the trenches. Conductivity modifying impurity is implanted through bases of the trenches into semiconductive material there-below. Such impurity is diffused into the masking material received laterally over the elevationally inner sidewall portions of the trenches and into semiconductive material received between the trenches below a mid-channel portion. An elevationally inner source/drain is formed in the semiconductive material below the mid-channel portion. The inner source/drain portion includes said semiconductive material between the trenches which has the impurity therein. A conductive line is formed laterally over and electrically coupled to at least one of opposing sides of the inner source/drain. A gate is formed elevationally outward of and spaced from the conductive line and laterally adjacent the mid-channel portion. Other embodiments are disclosed.

Abstract translation: 沟槽形成半导体材料。 遮蔽材料横向形成在沟槽的至少垂直内侧壁部分上。 电导率改性杂质通过沟槽的基底注入到下面的半导体材料中。 这种杂质被扩散到横向覆盖在沟槽的顶部内侧壁部分上的掩蔽材料中，并且被扩散到半导体材料中，该半导体材料被容纳在中间通道部分下方的沟槽之间。 在中间通道部分下方的半导体材料中形成一个正面内部源极/漏极。 内部源极/漏极部分包括在其中具有杂质的沟槽之间的所述半导体材料。 导电线横向形成并电耦合到内源/漏的相对侧中的至少一个。 栅极形成在导电线的正上方并与导电线隔开并且横向邻近中间通道部分。 公开了其他实施例。

公开(公告)号：US20140247674A1

公开(公告)日：2014-09-04

申请号：US13782792

申请日：2013-03-01

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Kamal M. Karda ,  Rajesh N. Gupta ,  Srinivas Pulugurtha ,  Chandra V. Mouli ,  Wolfgang Mueller

IPC: H01L29/78 ,  G11C11/40

CPC classification number: H01L29/7827 ,  G11C11/40 ,  H01L27/0207 ,  H01L27/1052 ,  H01L27/10855 ,  H01L27/10873 ,  H01L27/10885 ,  H01L27/10891 ,  H01L29/66666

Abstract: Methods, apparatuses, and systems for providing a body connection to a vertical access device. The vertical access device may include a digit line extending along a substrate to a digit line contact pillar, a body connection line extending along the substrate to a body connection line contact pillar, a body region disposed on the body connection line, an electrode disposed on the body region, and a word line extending to form a gate to the body region. A method for operation includes applying a first voltage to the body connection line, and applying a second voltage to the word line to cause a conductive channel to form through the body region. A memory cell array may include a plurality of vertical access devices.

Abstract translation: 用于向垂直存取装置提供身体连接的方法，装置和系统。 垂直进入装置可以包括沿着基板延伸到数字线接触柱的数字线，沿着基板延伸到主体连接线接触柱的主体连接线，设置在主体连接线上的主体区域，设置在主体连接线上的电极 身体区域和延伸以形成到身体区域的门的字线。 一种操作方法包括：将第一电压施加到身体连接线，以及向该字线施加第二电压，以使导电通道通过身体区域形成。 存储单元阵列可以包括多个垂直存取装置。

公开(公告)号：US20140073100A1

公开(公告)日：2014-03-13

申请号：US14080417

申请日：2013-11-14

Applicant: Micron Technology, Inc.

Inventor： Jaydip Guha ,  Shyam Surthi ,  Suraj J. Mathew ,  Kamal M. Karda ,  Hung-Ming Tsai

IPC: H01L29/66

CPC classification number: H01L21/823487 ,  H01L27/108 ,  H01L27/10876 ,  H01L27/1104 ,  H01L29/41741 ,  H01L29/66666 ,  H01L29/66825 ,  H01L29/66833

Abstract: Trenches are formed into semiconductive material. Masking material is formed laterally over at least elevationally inner sidewall portions of the trenches. Conductivity modifying impurity is implanted through bases of the trenches into semiconductive material there-below. Such impurity is diffused into the masking material received laterally over the elevationally inner sidewall portions of the trenches and into semiconductive material received between the trenches below a mid-channel portion. An elevationally inner source/drain is formed in the semiconductive material below the mid-channel portion. The inner source/drain portion includes said semiconductive material between the trenches which has the impurity therein. A conductive line is formed laterally over and electrically coupled to at least one of opposing sides of the inner source/drain. A gate is formed elevationally outward of and spaced from the conductive line and laterally adjacent the mid-channel portion. Other embodiments are disclosed.

Abstract translation: 沟槽形成半导体材料。 遮蔽材料横向形成在沟槽的至少垂直内侧壁部分上。 电导率改性杂质通过沟槽的基底注入到下面的半导体材料中。 这种杂质被扩散到横向覆盖在沟槽的顶部内侧壁部分上的掩蔽材料中，并且被扩散到半导体材料中，该半导体材料被容纳在中间通道部分下方的沟槽之间。 在中间通道部分下方的半导体材料中形成一个正面内部源极/漏极。 内部源极/漏极部分包括在其中具有杂质的沟槽之间的所述半导体材料。 导电线横向形成并电耦合到内源/漏的相对侧中的至少一个。 栅极形成在导电线的正上方并与导电线隔开并且横向邻近中间通道部分。 公开了其他实施例。

公开(公告)号：US20250151275A1

公开(公告)日：2025-05-08

申请号：US19018707

申请日：2025-01-13

Applicant: Micron Technology, Inc.

Inventor： Haitao Liu ,  Kamal M. Karda ,  Albert Fayrushin ,  Yingda Dong

IPC: H10B43/27 ,  H10B41/27 ,  H10D30/68 ,  H10D30/69 ,  H10D64/01

Abstract: Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes a memory cell included in a memory cell string; the memory cell including charge storage structure and channel structure separated from the charge storage structure by a dielectric structure; a first control gate associated with the memory cell and located on a first side of the charge storage structure and a first side of the channel structure; and a second control gate associated with the memory cell and electrically separated from the first control gate, the second control gate located on a second side of the charge storage structure and a second side of the channel structure.

公开(公告)号：US12219750B2

公开(公告)日：2025-02-04

申请号：US18244069

申请日：2023-09-08

Applicant: Micron Technology, Inc.

Inventor： Eric S. Carman ,  Durai Vishak Nirmal Ramaswamy ,  Richard E Fackenthal ,  Kamal M. Karda ,  Karthik Sarpatwari ,  Haitao Liu ,  Duane R. Mills ,  Christian Caillat

IPC: G11C11/34 ,  G11C11/4074 ,  G11C11/408 ,  G11C11/4094 ,  G11C11/4096 ,  H01L29/24 ,  H10B12/00 ,  H10B41/10 ,  H10B41/27 ,  H10B41/35 ,  H10B41/40

Abstract: Some embodiments include apparatuses and methods of operating such apparatuses. One of such apparatuses includes a data line, a conductive region, and a memory cell including a first transistor and a second transistor. The first transistor includes a first channel region coupled to the data line and the conductive region, a charge storage structure, and a first gate. The second transistor includes a second channel region coupled to the data line and the charge storage structure, and a second gate. The first gate is electrically separated from the second gate and opposite from the second gate in a direction from the first channel region to the second channel region.

公开(公告)号：US12218236B2

公开(公告)日：2025-02-04

申请号：US18050424

申请日：2022-10-27

Applicant: Micron Technology, Inc.

Inventor： Scott E. Sills ,  Ramanathan Gandhi ,  Durai Vishak Nirmal Ramaswamy ,  Yi Fang Lee ,  Kamal M. Karda

IPC: H01L29/78 ,  H01L29/10 ,  H01L29/66 ,  H10B63/00

Abstract: A transistor comprises a first conductive contact, a heterogeneous channel comprising at least one oxide semiconductor material over the first conductive contact, a second conductive contact over the heterogeneous channel, and a gate electrode laterally neighboring the heterogeneous channel. A device, a method of forming a device, a memory device, and an electronic system are also described.

公开(公告)号：US20240413154A1

公开(公告)日：2024-12-12

申请号：US18807741

申请日：2024-08-16

Applicant: Micron Technology, Inc.

Inventor： Kamal M. Karda ,  Yi Fang Lee ,  Haitao Liu ,  Durai Vishak Nirmal Ramaswamy ,  Ramanathan Gandhi ,  Karthik Sarpatwari ,  Scott E. Sills ,  Sameer Chhajed

IPC: H01L27/092 ,  H01L27/12 ,  H01L29/24 ,  H01L29/267 ,  H01L29/423 ,  H01L29/66 ,  H01L29/786

Abstract: Some embodiments include an integrated assembly having a first semiconductor material between two regions of a second semiconductor material. The second semiconductor material is a different composition than the first semiconductor material. Hydrogen is diffused within the first and second semiconductor materials. The conductivity of the second semiconductor material increases in response to the hydrogen diffused therein to thereby create a structure having the second semiconductor material as source/drain regions, and having the first semiconductor material as a channel region between the source/drain regions. A transistor gate is adjacent the channel region and is configured to induce an electric field within the channel region. Some embodiments include methods of forming integrated assemblies.

公开(公告)号：US12119269B2

公开(公告)日：2024-10-15

申请号：US17824744

申请日：2022-05-25

Applicant: Micron Technology, Inc.

Inventor： Deepak Chandra Pandey ,  Haitao Liu ,  Kamal M. Karda

IPC: H01L21/8234 ,  H01L21/8238 ,  H01L23/528 ,  H01L29/08 ,  H01L29/10 ,  H01L29/78 ,  H01L29/786 ,  H01L29/792 ,  H10B12/00 ,  H10B51/30 ,  H10B53/30 ,  H10B63/00 ,  H10B99/00 ,  H01L21/311 ,  H01L21/768

CPC classification number: H01L21/823487 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/823437 ,  H01L21/823475 ,  H01L21/823885 ,  H01L23/528 ,  H01L29/0847 ,  H01L29/1037 ,  H01L29/7827 ,  H01L29/785 ,  H01L29/78642 ,  H01L29/7926 ,  H10B12/395 ,  H10B51/30 ,  H10B53/30 ,  H10B63/34 ,  H10B99/00 ,  H01L21/31111 ,  H01L21/76802 ,  H01L21/76877

Abstract: An array of vertical transistors comprises spaced pillars individually comprising a channel region of individual vertical transistors. A horizontally-elongated conductor line directly electrically couples together individual of the channel regions of the pillars of a plurality of the vertical transistors. An upper source/drain region is above the individual channel regions of the pillars, a lower source/drain region is below the individual channel regions of the pillars, and a conductive gate line is operatively aside the individual channel regions of the pillars and that interconnects multiple of the vertical transistors. Methods are disclosed.

公开(公告)号：US20240233797A1

公开(公告)日：2024-07-11

申请号：US18615490

申请日：2024-03-25

Applicant: Micron Technology, Inc.

Inventor： Karthik Sarpatwari ,  Kamal M. Karda ,  Durai Vishak Nirmal Ramaswamy

IPC: G11C11/402 ,  G11C11/409 ,  H01L29/22 ,  H01L29/78 ,  H10B99/00

CPC classification number: G11C11/4023 ,  G11C11/409 ,  H01L29/22 ,  H01L29/7827 ,  H10B99/00

Abstract: Some embodiments include apparatuses and methods operating the apparatuses. One of the apparatuses includes a first data line located over a substrate, a second data line located over the first data line, a third data line located over the second data line and electrically separated from the first and second data lines, and a memory cell coupled to the first, second, and third data lines. The memory cell includes a first material between the first and second data lines and electrically coupled to the first and second data lines; a second material located over the first data line and the first material, the second material electrically separated from the first material and electrically coupled to the third data line; and a memory element electrically coupled to the second material and electrically separated from the first material and first and second data lines.