摘要:
A photoelectric conversion device includes a first cell including a photoelectric conversion layer, a second cell over the first cell including a photoelectric conversion layer formed of a material having a wider band gap than that of the first cell, first and second electrodes under a surface of the first cell which is opposite to the second cell, and a third electrode over a surface of the second cell which is opposite to the first cell. The first and second cells each include a p-n or p-i-n junction, the first and second cells are in contact with each other and a p-n junction is formed in a contact portion therebetween, the first cell is electrically connected to the first and second electrodes to form a back contact structure, and the second cell is electrically connected to the third electrode.
摘要:
It is an object to provide a nonvolatile semiconductor storage device that prevents increase in a contact resistance value due to etching of a semiconductor layer when etching an interlayer insulating film and that has superiority in a writing characteristic and an electric charge-holding characteristic, and a manufacturing method thereof. A conductive layer is provided between a source or drain region and a source or drain wiring. The conductive layer is made of the same conductive layer that forms a control gate electrode. An insulating film is provided so as to cover the conductive layer, and the insulating film has a contact hole for exposing part of the conductive layer. The source or drain wiring is formed so that the contact hole is filled.
摘要:
A semiconductor device which is formed in a self-aligned manner without causing a problem of misalignment in forming a control gate electrode and in which a leak between the control gate electrode and a floating gate electrode is not generated, and a manufacturing method of the semiconductor device are provided. A semiconductor device includes a semiconductor film, a first gate insulating film over the semiconductor film, a floating gate electrode over the first gate insulating film, a second gate insulating film which covers the floating gate electrode, and a control gate electrode over the second gate insulating film. The control gate electrode is formed so as to cover the floating gate electrode with the second gate insulating film interposed therebetween, the control gate electrode is provided with a sidewall, and the sidewall is formed on a stepped portion of the control gate electrode, generated due to the floating gate electrode.
摘要:
On object of the invention is to provide a non-volatile memory device, in which data can be added to the memory device after a manufacturing process and forgery and the like by rewriting can be prevented, and a semiconductor device including the memory device. Another object of the invention is to provide a highly-reliable, inexpensive, and nonvolatile memory device and a semiconductor device including the memory device. A memory element includes a first conductive layer, a second conductive layer, a first insulating layer with a thickness of 0.1 nm or more and 4 nm or less being in contact with the first conductive layer, and an organic compound layer interposed between the first conductive layer, the first insulating layer, and the second conductive layer.
摘要:
Conventionally, the layer of the insulator between a cathode and an anode is formed by a droplet discharge method, vapor deposition, or the like separately from an interlayer insulating film formed over a thin film transistor, which creates problems of increase in cost and the number of manufacturing steps. A memory device of the present invention includes a first conductive film; an insulating film formed over the first conductive film; and a second conductive film formed over the insulating film, and an opening and a contact hole which are formed in the insulating film. Further, the insulating film exists between the first conductive film and the second conductive film formed in the opening, and the first conductive film and the second conductive film are electrically connected in the contact hole.
摘要:
It is an object to provide a nonvolatile semiconductor storage device that prevents increase in a contact resistance value due to etching of a semiconductor layer when etching an interlayer insulating film and that has superiority in a writing characteristic and an electric charge-holding characteristic, and a manufacturing method thereof. A conductive layer is provided between a source or drain region and a source or drain wiring. The conductive layer is made of the same conductive layer that forms a control gate electrode. An insulating film is provided so as to cover the conductive layer, and the insulating film has a contact hole for exposing part of the conductive layer. The source or drain wiring is formed so that the contact hole is filled.
摘要:
Conventionally, the layer of the insulator between a cathode and an anode is formed by a droplet discharge method, vapor deposition, or the like separately from an interlayer insulating film formed over a thin film transistor, which creates problems of increase in cost and the number of manufacturing steps. A memory device of the present invention includes a first conductive film; an insulating film formed over the first conductive film; and a second conductive film formed over the insulating film, and an opening and a contact hole which are formed in the insulating film. Further, the insulating film exists between the first conductive film and the second conductive film formed in the opening, and the first conductive film and the second conductive film are electrically connected in the contact hole.
摘要:
As for a memory element implemented in a semiconductor device typified by an RFID, it is an object of the present invention to reduce manufacturing steps and to provide a memory element and a memory circuit having the element with reduced cost. It is a feature of the present invention that a memory element sandwiched between electrodes has an organic compound, and an electrode connected to a semiconductor element controlling the memory element functions as an electrode of the memory element. In addition, an extremely thin semiconductor film formed on an insulated surface is used for the memory element; therefore cost can be reduced.
摘要:
As for a memory element implemented in a semiconductor device typified by an RFID, it is an object of the present invention to reduce manufacturing steps and to provide a memory element and a memory circuit having the element with reduced cost. It is a feature of the present invention that a memory element sandwiched between electrodes has an organic compound, and an electrode connected to a semiconductor element controlling the memory element functions as an electrode of the memory element. In addition, an extremely thin semiconductor film formed on an insulated surface is used for the memory element; therefore cost can be reduced.
摘要:
It is an object of the present invention to provide a technique in which a high-performance and high reliable memory device and a semiconductor device provided with the memory device are manufactured at low cost with high yield. The semiconductor device includes an organic compound layer including an insulator over a first conductive layer and a second conductive layer over the organic compound layer including an insulator. Further, the semiconductor device is manufactured by forming a first conductive layer, discharging a composition of an insulator and an organic compound over the first conductive layer to form an organic compound layer including an insulator, and forming a second conductive layer over the organic compound layer including an insulator.