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    HIGH PRESSURE CONNECTION SYSTEMS AND METHODS FOR THEIR MANUFACTURE
    52.
    发明申请
    HIGH PRESSURE CONNECTION SYSTEMS AND METHODS FOR THEIR MANUFACTURE 审中-公开
    高压连接系统及其制造方法

    公开(公告)号：US20090188269A1

    公开(公告)日：2009-07-30

    申请号：US12358798

    申请日：2009-01-23

    申请人： Shabbir Attarwala ,  Prakash S. Patel

    发明人： Shabbir Attarwala ,  Prakash S. Patel

    IPC分类号： F25D23/00 ,  B23P19/04

    CPC分类号： F16L13/103 ,  C08F220/10 ,  C08F222/10 ,  C08G18/5024 ,  C09J4/00 ,  C09J5/02 ,  C09J175/16 ,  C09J2400/163 ,  C09J2400/166 ,  C09J2433/00 ,  C09J2433/003 ,  C09J2475/003 ,  Y10T29/53

    摘要： A high pressure connection and method for making a high pressure connection. The method includes applying a primer composition to one distal joint portion, applying an anaerobically curable composition to the other distal joint portion; sliding one distal joint portion into the other distal joint portion and curing the anaerobic composition to maintain the second distal joint portion within the first distal joint portion thereby forming the high pressure connection. The method does not use plastic deformation of the first or second distal joint portions after the step of sliding. The method is advantageously useful for making high pressure connections in gas compression or refrigeration systems.

    摘要翻译： 高压连接和高压连接方法。 该方法包括将底漆组合物施用于一个远端接合部分，将另外的远端接合部分施加可厌氧固化的组合物; 将一个远端接头部分滑入另一个远端接头部分并固化厌氧组合物，以将第二远端接头部分保持在第一远端接头部分内，从而形成高压连接。 该方法在滑动步骤之后不使用第一或第二远端接头部分的塑性变形。 该方法有利于在气体压缩或制冷系统中进行高压连接。

    Rapid curing anaerobic compositions
    55.
    发明授权
    Rapid curing anaerobic compositions 失效
    快速固化厌氧组合物

    公开(公告)号：US07250466B2

    公开(公告)日：2007-07-31

    申请号：US10432199

    申请日：2001-09-21

    申请人： Shabbir Attarwala ,  Dzu D. Luong ,  Alan E. Litke ,  Victor K. Kadziela

    发明人： Shabbir Attarwala ,  Dzu D. Luong ,  Alan E. Litke ,  Victor K. Kadziela

    IPC分类号： C08F20/10

    CPC分类号： C08F222/1006 ,  C08F220/30 ,  C08G18/0814 ,  C08G18/282 ,  C08G71/02

    摘要： A curable composition having enhanced cure speed which includes a curable component, a cure system and an additive for enhancing cure speed. The additive includes an alkali metal halide salt and the reaction product of: (a) a polyfunctional isocyanate and a member selected from the group consisting of an hydroxy and an amine; or (b) a phosgene or phosgene derivative, and a compound having 3 to 7 polyethylene glycol ether units terminated at one end with an ether group and at the other end with a reactive functional group selected from the group consisting of an amine, an amide, a thiol and an alcohol; or (c) a monohydroxy compound, a diisocyanate and a polyamine. Alternatively, in place of or in combination with the cure speed enhancing additive, an aromatic substituted (meth)acryl functionalized component may be incorporated into the curable component to achieve enhanced cure speed.

    摘要翻译： 具有增强的固化速度的可固化组合物，其包括可固化组分，固化体系和用于增强固化速度的添加剂。 添加剂包括碱金属卤化物盐和下列反应产物：（a）多官能异氰酸酯和选自羟基和胺的成员; 或（b）光气或光气衍生物，以及一端具有醚基的3-7个聚乙二醇醚单元的化合物，另一端具有选自胺，酰胺的反应性官能团 ，硫醇和酒精; 或（c）单羟基化合物，二异氰酸酯和多胺。 或者，代替或与固化速度增强添加剂组合，可以将芳族取代的（甲基）丙烯酰基官能化组分并入可固化组分中以实现增强的固化速度。

    Cyanoacrylate adhesives with improved cured thermal properties
    59.
    发明授权
    Cyanoacrylate adhesives with improved cured thermal properties 失效
    具有改进的固化热性能的氰基丙烯酸酯粘合剂

    公开(公告)号：US5328944A

    公开(公告)日：1994-07-12

    申请号：US913139

    申请日：1992-07-14

    申请人： Shabbir Attarwala ,  Philip T. Klemarczyk

    发明人： Shabbir Attarwala ,  Philip T. Klemarczyk

    IPC分类号： C09J4/00 ,  C09J4/04 ,  C08K5/45 ,  C08K5/41 ,  C08K5/42

    CPC分类号： C09J4/00

    摘要： A cyanoacrylate monomer adhesive formulation which has improved thermal properties resulting from the inclusion in the formulation of an effective amount for enhancing the thermal resistance of the cured polymer of a sulfur containing compound of the formula: ##STR1## where R.sup.1 and R.sup.2 are, respectively, monovalent and divalent hydrocarbon groups which may be optionally substituted with halogen, NO.sub.2, oxo, CN, alkoxy, hydroxy, acyloxy or SO.sub.2 or interrupted by one or more ether oxygen atoms.

    摘要翻译： 一种氰基丙烯酸酯单体粘合剂制剂，其具有改善的热性能，其由制剂中包含有效量而提高含硫化合物的固化聚合物的热阻，其结构式如下：R1OSO2OR1 R1OSOOR1 R1ES2OR1 R1SOR1 R1SOOR1 或其中R 1和R 2分别是可被卤素，NO 2，氧代，CN，烷氧基，羟基，酰氧基或SO 2任选取代或被一个或多个醚氧原子间隔的一价和二价烃基。

    Cyanoacrylate adhesives with improved cured thermal properties utilizing substituted aromatic additive
    60.
    发明授权
    Cyanoacrylate adhesives with improved cured thermal properties utilizing substituted aromatic additive 失效
    具有改进的固化热性能的氰基丙烯酸酯粘合剂，使用取代的芳族添加剂

    公开(公告)号：US5288794A

    公开(公告)日：1994-02-22

    申请号：US966133

    申请日：1992-10-23

    申请人： Shabbir Attarwala

    发明人： Shabbir Attarwala

    IPC分类号： C09J4/04 ,  C08K5/00 ,  C09J4/00 ,  C09J11/06 ,  C09J133/14

    CPC分类号： C08K5/005 ,  C09J4/00

    摘要： A cyanoacrylate monomer adhesive formulation which has improved thermal properties resulting from the inclusion in the formulation of an effective amount for enhancing the thermal resistance of the cured polymer of a mono, poly or hetero aromatic compound characterized by at least three substitutions on an aromatic ring thereof, two or more of said substitutions being electron withdrawing groups selected from the group consisting of NO.sub.2, CN, CF.sub.3, NR.sup.1.sub.3.sup.+, SR.sup.1.sub.2.sup.+, C(.dbd.O)R.sup.1, C(.dbd.O)OR.sup.1, NO, CCl.sub.3, SO.sub.2, S(.dbd.O), SO.sub.3, SO.sub.2 R.sup.1, SO.sub.2 OR.sup.1 and F, one or more of said substitutions being leaving groups selected from the group consisting of F, Br, Cl, I, NO.sub.2, CN, SOR.sup.1, SO.sub.2 R.sup.1 and SO.sub.2 OR.sup.1, and R.sup.1 is an optionally substituted hydrocarbon group. Example such compounds have the formula: ##STR1## where L is the leaving group and the W groups are the electron withdrawing groups.

    摘要翻译： 一种氰基丙烯酸酯单体粘合剂制剂，其具有由制剂中​​包含的有效量引起的改善的热性能，所述有效量用于增强单芳香族化合物的固化聚合物的固化聚合物的耐热性，其特征在于其芳环上具有至少三个取代基 所述取代中的两个或多个是选自由NO 2，CN，CF 3，NR 13 +，SR 12 +，C（= O）R 1，C（= O）OR 1，NO，CCl 3，SO 2，S（= O），SO 3，SO 2 R 1，SO 2 OR 1和F，所述取代中的一个或多个为离去选自F，Br，Cl，I，NO 2，CN，SOR 1，SO 2 R 1和SO 2 OR 1的基团，并且R 1为任选取代的 烃基。 这些化合物的例子有：（*化学结构*），其中L是离去基团，W基团是吸电子基团。