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公开(公告)号：US10049901B2
公开(公告)日：2018-08-14
申请号：US15418413
申请日：2017-01-27
发明人： Ping-Yin Liu , Yen-Chang Chu , Xin-Hua Huang , Lan-Lin Chao , Yeur-Luen Tu , Ru-Liang Lee
IPC分类号： H01L21/67 , H01L21/683 , H01L25/00
摘要： A method includes placing a first wafer onto a surface of a first wafer chuck, the first wafer chuck including multiple first profile control zones separated by one or more shared flexible membranes. The method also includes setting a first profile of the surface of the first wafer chuck. Setting a first profile of the surface of the first wafer chuck includes adjusting a first volume of a first profile control zone of the multiple first profile control zones. Setting a first profile of the surface of the first wafer chuck also includes adjusting a second volume of a second profile control zone of the multiple first profile control zones, the first volume of the first profile control zone being adjusted independently from the second volume of the second profile control zone, and the second adjustable volume encircling the first adjustable volume.
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公开(公告)号：US09611141B2
公开(公告)日：2017-04-04
申请号：US14564346
申请日：2014-12-09
发明人： Ping-Yin Liu , Li-Cheng Chu , Hung-Hua Lin , Shang-Ying Tsai , Yuan-Chih Hsieh , Jung-Huei Peng , Lan-Lin Chao , Chia-Shiung Tsai , Chun-Wen Cheng
CPC分类号： B81C1/00269 , B32B7/12 , B32B15/043 , B32B15/20 , B32B2255/24 , B32B2307/746 , B32B2457/00 , B81B3/0005 , B81C2201/112 , Y10T428/12674 , Y10T428/12708 , Y10T428/12736 , Y10T428/12986
摘要： The present disclosure provides a device having a doped active region disposed in a substrate. The doped active region having an elongate shape and extends in a first direction. The device also includes a plurality of first metal gates disposed over the active region such that the first metal gates each extend in a second direction different from the first direction. The plurality of first metal gates includes an outer-most first metal gate having a greater dimension measured in the second direction than the rest of the first metal gates. The device further includes a plurality of second metal gates disposed over the substrate but not over the doped active region. The second metal gates contain different materials than the first metal gates. The second metal gates each extend in the second direction and form a plurality of respective N/P boundaries with the first metal gates.
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公开(公告)号：US20170069593A1
公开(公告)日：2017-03-09
申请号：US15356887
申请日：2016-11-21
发明人： Bruce C.S. Chou , Chen-Jong Wang , Ping-Yin Liu , Jung-Kuo Tu , Tsung-Te Chou , Xin-Hua Huang , Hsun-Chung Kuang , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L24/80 , H01L21/3081 , H01L21/764 , H01L23/498 , H01L23/5226 , H01L23/53204 , H01L23/53228 , H01L23/5329 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/09 , H01L24/83 , H01L24/93 , H01L25/0657 , H01L25/50 , H01L2224/03845 , H01L2224/05554 , H01L2224/05571 , H01L2224/05647 , H01L2224/0601 , H01L2224/08147 , H01L2224/0901 , H01L2224/80895 , H01L2224/80896 , H01L2225/06524 , H01L2924/00011 , H01L2924/01322 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/81805
摘要： A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.
摘要翻译： 封装部件包括表面电介质层，其包括平面顶表面，表面电介质层中的金属焊盘，并且包括具有平坦顶表面的第二平面顶表面水平面和在金属焊盘一侧的空气沟槽。 金属垫的侧壁暴露于空气沟槽。
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公开(公告)号：US20170047260A1
公开(公告)日：2017-02-16
申请号：US15333098
申请日：2016-10-24
发明人： Xin-Hua Huang , Ping-Yin Liu , Lan-Lin Chao
CPC分类号： H01L22/34 , H01L21/768 , H01L22/20 , H01L22/30 , H01L23/492 , H01L24/05 , H01L24/08 , H01L24/80 , H01L24/89 , H01L24/94 , H01L2224/0237 , H01L2224/05647 , H01L2224/08145 , H01L2224/80011 , H01L2224/80013 , H01L2224/80075 , H01L2224/80121 , H01L2224/802 , H01L2224/80203 , H01L2224/80894 , H01L2224/80895 , H01L2224/80896 , H01L2224/94 , H01L2224/80 , H01L2924/00012 , H01L2924/00014
摘要： Presented herein is a device comprising a common node disposed in a first wafer a test node disposed in a first wafer and having a plurality of test pads exposed at a first surface of the first wafer. The test node also has test node lines connected to the test pads and that are separated by a first spacing and extend to a second surface of the first wafer. A comb is disposed in a second wafer and has a plurality of comb lines having a second spacing different from the first spacing. Each of the comb lines has a first surface exposed at a first side of the second wafer. The comb lines provide an indication of an alignment of the first wafer and second wafer by a number or arrangement of connections made by the plurality of comb lines between the test node lines and the common node.
摘要翻译： 本文提出了一种装置，其包括设置在第一晶片中的公共节点，设置在第一晶片中的测试节点并且具有暴露在第一晶片的第一表面处的多个测试焊盘。 测试节点还具有连接到测试焊盘并且被第一间隔分开并延伸到第一晶片的第二表面的测试节点线。 梳子设置在第二晶片中，并且具有多个具有不同于第一间隔的第二间距的梳状线。 每个梳状线具有在第二晶片的第一侧露出的第一表面。 梳线通过由测试节点线和公共节点之间的多条梳线形成的多个或多个连接布置提供第一晶片和第二晶片的对准的指示。
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公开(公告)号：US20170004964A1
公开(公告)日：2017-01-05
申请号：US15269346
申请日：2016-09-19
发明人： Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Hsun-Chung Kuang , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
摘要： A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
摘要翻译： 一种方法包括在第一包装部件的表面上执行等离子体激活，从第一包装部件的金属焊盘的表面去除氧化物区域，以及执行预接合以将第一包装部件结合到第二包装部件。
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公开(公告)号：US09508586B2
公开(公告)日：2016-11-29
申请号：US14517569
申请日：2014-10-17
发明人： Xin-Hua Huang , Ping-Yin Liu , Hung-Hua Lin , Lan-Lin Chao , Chia-Shiung Tsai
IPC分类号： H01L21/68 , H01L21/683 , H01L23/00
CPC分类号： H01L24/799 , G05B2219/45031 , H01L21/67092 , H01L21/6838 , H01L24/98 , H01L2924/35
摘要： A method includes receiving a wafer stack having at least two wafers bonded together. At least one blade is inserted between a first wafer of the at least two wafers and a second wafer of the at least two wafers. The blade has a channel configured to inject air or fluid. The first wafer is debonded from the second wafer using the at least one blade. In another embodiment, a detacher having a convex bottom surface is attached to the wafer stack. The first wafer is debonded from the second wafer using the detacher.
摘要翻译： 一种方法包括接收具有结合在一起的至少两个晶片的晶片叠层。 至少一个刀片被插入到所述至少两个晶片的第一晶片和所述至少两个晶片的第二晶片之间。 叶片具有被配置为喷射空气或流体的通道。 使用至少一个刀片从第二晶片剥离第一晶片。 在另一个实施例中，具有凸底面的分离器附接到晶片堆叠。 使用分离器从第二晶片脱离第一晶片。
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公开(公告)号：US09502396B2
公开(公告)日：2016-11-22
申请号：US15042268
申请日：2016-02-12
发明人： Bruce C. S. Chou , Chen-Jong Wang , Ping-Yin Liu , Jung-Kuo Tu , Tsung-Te Chou , Xin-Hua Huang , Hsun-Chung Kuang , Lan-Lin Chao , Chia-Shiung Tsai , Xiaomeng Chen
IPC分类号： H01L25/00 , H01L23/498 , H01L23/522 , H01L23/00 , H01L21/308 , H01L21/764 , H01L23/532
CPC分类号： H01L24/80 , H01L21/3081 , H01L21/764 , H01L23/498 , H01L23/5226 , H01L23/53204 , H01L23/53228 , H01L23/5329 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/09 , H01L24/83 , H01L24/93 , H01L25/0657 , H01L25/50 , H01L2224/03845 , H01L2224/05554 , H01L2224/05571 , H01L2224/05647 , H01L2224/0601 , H01L2224/08147 , H01L2224/0901 , H01L2224/80895 , H01L2224/80896 , H01L2225/06524 , H01L2924/00011 , H01L2924/01322 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2224/81805
摘要： A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.
摘要翻译： 封装部件包括表面电介质层，其包括平面顶表面，表面电介质层中的金属焊盘，并且包括具有平坦顶表面的第二平面顶表面水平面和在金属焊盘一侧的空气沟槽。 金属垫的侧壁暴露于空气沟槽。
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公开(公告)号：US20160307944A1
公开(公告)日：2016-10-20
申请号：US15193812
申请日：2016-06-27
发明人： Szu-Ying Chen , Ping-Yin Liu , Calvin Yi-Ping Chao , Tzu-Jui Wang , Jen-Cheng Liu , Dun-Nian Yaung , Lan-Lin Chao
IPC分类号： H01L27/146
CPC分类号： H01L27/1469 , H01L25/16 , H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14634 , H01L27/14636 , H01L27/1464 , H01L27/14643 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond pad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding strength between the sensor and the ASIC.
摘要翻译： 公开了用于封装具有专用集成电路（ASIC）的背面照明（BSI）图像传感器或传感器装置的方法和装置。 根据实施例，传感器装置可以与ASIC面对面地结合在一起，而不使用载体晶片，其中传感器的相应接合焊盘与ASIC的接合焊盘对准并且结合在一起，以一对一 一个时尚。 传感器的一列像素可以共享由共享金属间线路连接的接合焊盘。 接合焊盘可以具有不同的尺寸并且被配置成不同的行以彼此不相交。 可以添加附加的虚拟焊盘以增加传感器和ASIC之间的结合强度。
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公开(公告)号：US20160229693A1
公开(公告)日：2016-08-11
申请号：US14564346
申请日：2014-12-09
发明人： Ping-Yin Liu , Li-Cheng Chu , Hung-Hua Lin , Shang-Ying Tsai , Yuan-Chih Hsieh , Jung-Huei Peng , Lan-Lin Chao , Chia-Shiung Tsai , Chun-Wen Cheng
CPC分类号： B81C1/00269 , B32B7/12 , B32B15/043 , B32B15/20 , B32B2255/24 , B32B2307/746 , B32B2457/00 , B81B3/0005 , B81C2201/112 , Y10T428/12674 , Y10T428/12708 , Y10T428/12736 , Y10T428/12986
摘要： A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.
摘要翻译： 公开了没有抗静电层和粘合方法的键。 一种示例性方法包括形成第一粘合层; 在所述第一接合层上形成中间层; 在中间层上形成抗静电层; 以及从所述第一接合层和中间层形成液体，使得所述抗静电层浮在所述第一接合层上。 第二接合层可以结合到第一接合层，同时抗静电层漂浮在第一接合层上，使得第一和第二接合层之间的接合没有抗静电层。
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公开(公告)号：US09377401B2
公开(公告)日：2016-06-28
申请号：US14491255
申请日：2014-09-19
发明人： Hung-Hua Lin , Li-Cheng Chu , Ming-Tung Wu , Yuan-Chih Hsieh , Lan-Lin Chao , Chia-Shiung Tsai
IPC分类号： G01N21/00 , G01N21/55 , G01N27/327 , G01N33/483 , G01N21/01 , G01N21/25
CPC分类号： G01N21/55 , G01N21/01 , G01N21/253 , G01N27/327 , G01N33/483 , G01N2021/0106 , G01N2201/0636
摘要： A biological sensing structure includes a mesa integrally connected a portion of a substrate, wherein the mesa has a top surface and a sidewall surface adjacent to the top surface. The biological sensing structure includes a first light reflecting layer over the top surface and the sidewall surface of the mesa. The biological sensing structure includes a filling material surrounding the mesa, wherein the mesa protrudes from the filling material. The biological sensing structure includes a stop layer over the filling material and a portion of the first light reflecting layer. The biological sensing structure includes a second light reflecting layer over a portion of the stop layer and a portion of the top surface of the mesa. The biological sensing structure includes an opening in the second light reflecting layer to partially expose the top surface of the mesa.
摘要翻译： 生物感测结构包括整体连接基底的一部分的台面，其中台面具有顶表面和与顶表面相邻的侧壁表面。 该生物感测结构包括在台面的上表面和侧壁表面上的第一光反射层。 生物感测结构包括围绕台面的填充材料，其中台面从填充材料突出。 生物感测结构包括在填充材料上的停止层和第一光反射层的一部分。 生物感测结构包括在停止层的一部分上的第二光反射层和台面的顶表面的一部分。 生物感测结构包括在第二光反射层中的开口以部分地暴露台面的顶表面。
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