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305 条记录 (耗时 0.03 秒)

    Apparatus for recording and/or reproducing information using a card-like recording medium
    53.
    发明授权
    Apparatus for recording and/or reproducing information using a card-like recording medium 失效
    用于使用卡状记录介质记录和/或再现信息的装置

    公开(公告)号：US4751394A

    公开(公告)日：1988-06-14

    申请号：US903374

    申请日：1986-09-03

    申请人： Kazuhiko Matsuoka ,  Kenichi Suzuki ,  Akio Aoki ,  Kazuo Minoura

    发明人： Kazuhiko Matsuoka ,  Kenichi Suzuki ,  Akio Aoki ,  Kazuo Minoura

    IPC分类号： G06K13/06 ,  G06K13/067 ,  G11B7/0033 ,  G11B19/00 ,  H04N1/00 ,  G01N21/86

    CPC分类号： G06K13/067 ,  G11B7/0033 ,  H04N1/00002

    摘要： An information recording/reproducing apparatus uses a card-like recording medium having an area for information recording and a blank area, the area for information recording having a reflectivity different from that of the blank area. The apparatus includes a head unit for performing at least one of recording and reproduction, an autotracking servo, a stepping motor and the like cooperating to cause the card to reciprocate relative to the head unit, and an abnormal state detect circuit for detecting whether the card is inserted in the apparatus in a normal state. The abnormal state detect circuit includes a photosensing unit consisting of a light-emitting element for emitting light rays onto the card and a light-receiving element for receiving the light rays from the card. The photosensing unit is deviated with respect to a central portion of the card along a direction perpendicular to a reciprocal movement of the card so that the area for information recording is irradiated with the light rays from the light-emitting element upon insertion of the card in the normal state.

    摘要翻译： 信息记录/再现装置使用具有用于信息记录的区域和空白区域的卡状记录介质，用于信息记录的区域具有与空白区域不同的反射率。 该装置包括用于执行记录和再现中的至少一个的头单元，协调使卡相对于头单元往复运动的自动跟踪伺服，步进电机等，以及异常状态检测电路，用于检测卡 以正常状态插入设备中。 异常状态检测电路包括由用于将光线发射到卡上的发光元件和用于接收来自卡的光线的光接收元件组成的感光单元。 光敏单元相对于卡的中心部分沿着垂直于卡的往复运动的方向偏离，使得当卡插入时，用于信息记录的区域被来自发光元件的光线照射 正常状态。

    Method of preparing composite aluminum material
    54.
    发明授权
    Method of preparing composite aluminum material 失效
    复合铝材料的制备方法

    公开(公告)号：US4643241A

    公开(公告)日：1987-02-17

    申请号：US757876

    申请日：1985-07-23

    申请人： Koji Yonekura ,  Kenichi Suzuki ,  Yoshiyasu Takahashi ,  Hiroaki Iwahori

    发明人： Koji Yonekura ,  Kenichi Suzuki ,  Yoshiyasu Takahashi ,  Hiroaki Iwahori

    IPC分类号： C23C22/34 ,  B22D19/00 ,  C25D11/04 ,  C25D11/08 ,  F01N13/08 ,  F01N13/16

    CPC分类号： B22D19/00

    摘要： A method of preparing a composite aluminum material to be formed integrally by bonding aluminum or aluminum alloy to an aluminum or aluminum alloy member which is formed in advance in a specified shape by the method of internal chill, etc. The method comprises the steps of forming a chemical conversion coating of pentafluoroaluminate (K.sub.2 AlF.sub.5) by bringing a solution containing potassium ions and fluorine ions in contact with the surface of the aluminum member.

    摘要翻译： 一种制备复合铝材料的方法，其通过将铝或铝合金结合到通过内部冷却等方式预先形成为特定形状的铝或铝合金构件而一体地形成。该方法包括以下步骤： 通过使含有钾离子和氟离子的溶液与铝构件的表面接触来进行五氟铝酸盐（K2AlF5）的化学转化涂层。

    Method of manufacturing semiconductor integrated circuit devices having dielectric isolation regions
    55.
    发明授权
    Method of manufacturing semiconductor integrated circuit devices having dielectric isolation regions 失效
    具有绝缘隔离区域的半导体集成电路器件的制造方法

    公开(公告)号：US4546538A

    公开(公告)日：1985-10-15

    申请号：US647827

    申请日：1984-09-05

    申请人： Kenichi Suzuki

    发明人： Kenichi Suzuki

    IPC分类号： H01L21/76 ,  H01L21/033 ,  H01L21/308 ,  H01L21/762 ,  H01L21/763 ,  H01L21/31

    CPC分类号： H01L21/76224 ,  H01L21/033 ,  H01L21/308 ,  H01L21/763 ,  Y10S148/05 ,  Y10S148/051 ,  Y10S148/085 ,  Y10S148/117 ,  Y10S438/911

    摘要： A method of making semiconductor integrated circuit devices with narrow and deep isolation regions of polycrystalline silicon and wide and thick isolation regions of thermally grown silicon oxide. A multi-layer of a first silicon nitride layer, a polycrystalline silicon layer, a second silicon nitride layer and a silicon oxide layer are formed on a semiconductor body. A photoresist layer is applied on the surface of the silicon oxide layer. An opening is formed in the photoresist layer and the multi-layer. The silicon oxide layer under the photoresist layer is side-etched through the opening. The exposed polycrystalline layer is converted into another silicon oxide layer. Another opening surrounding the silicon oxide layer is formed to expose surfaces of the semiconductor body. Deep grooves are formed in the semiconductor body.

    摘要翻译： 制造半导体集成电路器件的方法，其具有多晶硅的窄和深隔离区域以及热生长氧化硅的宽而厚的隔离区域。 在半导体本体上形成多层第一氮化硅层，多晶硅层，第二氮化硅层和氧化硅层。 在氧化硅层的表面上施加光致抗蚀剂层。 在光致抗蚀剂层和多层中形成开口。 在光致抗蚀剂层下面的氧化硅层通过开口被侧蚀刻。 暴露的多晶层被转换成另一个氧化硅层。 形成围绕氧化硅层的另一个开口以暴露半导体本体的表面。 深沟槽形成在半导体本体中。

    Eccentric hollow conjugated continuous fiber, continuous-fiber nonwoven fabric made therefrom and uses thereof
    58.
    发明授权
    Eccentric hollow conjugated continuous fiber, continuous-fiber nonwoven fabric made therefrom and uses thereof 有权

    公开(公告)号：US10415157B2

    公开(公告)日：2019-09-17

    申请号：US12742492

    申请日：2008-11-12

    申请人： Akio Matsubara ,  Kenichi Suzuki ,  Shigeyuki Motomura

    发明人： Akio Matsubara ,  Kenichi Suzuki ,  Shigeyuki Motomura

    IPC分类号： D01F8/06 ,  D01D5/24 ,  D01F8/04 ,  D04H3/14 ,  D04H3/018 ,  D04H3/147

    摘要： There is provided a continuous-fiber nonwoven fabric excellent in terms of bulkiness, flexibility, and shape stability. The continuous-fiber nonwoven fabric comprises eccentric hollow conjugated continuous fiber containing a part (A), a part containing a higher melting-point thermoplastic resin (A), and a part (B), a part containing a lower melting-point thermoplastic resin (B), the parts (A) and (B) having been bonded to each other in a side by side arrangement, wherein the difference in melting point between the higher melting-point thermoplastic resin (A) and the lower melting-point thermoplastic resin (B) is 5° C. or greater, the eccentric hollow conjugated continuous fiber has a part (A):part (B) proportion in the range of 5 to 30 weight %:95 to 70 weight %, the eccentric hollow conjugated continuous fiber has a cross-section in which the thickness (a) of the part (A) is smaller than the thickness (b) of the part (B), and the eccentric hollow conjugated continuous fiber has been crimped.

    Substrate processing apparatus, substrate transfer method and substrate transfer device
    60.
    发明授权
    Substrate processing apparatus, substrate transfer method and substrate transfer device 有权
    基板处理装置，基板转印方法和基板转印装置

    公开(公告)号：US09530676B2

    公开(公告)日：2016-12-27

    申请号：US13483118

    申请日：2012-05-30

    申请人： Toshio Yokoyama ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Kenichi Suzuki ,  Hiroshi Sotozaki

    发明人： Toshio Yokoyama ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Kenichi Suzuki ,  Hiroshi Sotozaki

    IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B25J11/00

    CPC分类号： H01L21/67718 ,  B25J11/0095 ,  H01L21/6704 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67219 ,  H01L21/67706 ,  H01L21/67742 ,  H01L21/68707

    摘要： A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner.

    摘要翻译： 基板处理装置可以防止由于基板的被处理表面暴露于光而导致的铜互连的光腐蚀，并且可以执行基板表面的处理，例如清洁基板表面，同时防止光蚀刻， 例如，由于曝光而导致的铜互连。 基板处理装置包括容纳其中已进行遮光处理的处理单元的多个处理区域; 以及至少一个传送区域，其中容纳有传送机器人并设置在所述多个处理区域中的两个相邻处理区域之间。 在传送区域和两个相邻的处理区域中的每一个之间设置遮光壁，并且为传送区域的前开口设置遮光维护门。 处理单元以遮光方式耦合到遮光壁。