Combined RF-DC magnetron sputtering method
    51.
    发明授权
    Combined RF-DC magnetron sputtering method 失效
    组合RF-DC磁控溅射法

    公开(公告)号:US06365009B1

    公开(公告)日:2002-04-02

    申请号:US09071446

    申请日:1998-05-01

    申请人: Keiji Ishibashi

    发明人: Keiji Ishibashi

    IPC分类号: C23C1435

    CPC分类号: C23C14/35

    摘要: A combined RF-DC magnetron sputtering method stops the production of tracking arcs and promotes the consistent manufacture of thin films during the manufacture of thin films by such RF-DC magnetron sputtering. Magnets 121, 122 are placed behind the target 111. RF and DC power are simultaneously supplied to the target to produce a plasma, and sputtering is used to manufacture a thin film on a substrate 106 facing the target. The supply of RF and DC power to the target is simultaneously and periodically stopped. The time that the power is supplied is shorter than the time needed to produce tracking arcs. The RF and DC power is both supplied and stopped simultaneously, and RF and DC power is intermittently supplied to the target.

    摘要翻译: 组合的RF-DC磁控溅射法通过这种RF-DC磁控溅射在薄膜制造过程中停止生产跟踪电弧并促进薄膜的一致制造。 将磁体121,122放置在目标111的后面。将RF和DC功率同时提供给靶以产生等离子体,并且使用溅射来在面向靶的衬底106上制造薄膜。 同时定期停止向目标提供射频和直流电源。 供电时间短于产生跟踪弧所需的时间。 RF和DC电源同时供电和停止,RF和DC电源间歇地提供给目标。

    Polishing agent, compound semiconductor manufacturing method, and semiconductor device manufacturing method
    58.
    发明授权
    Polishing agent, compound semiconductor manufacturing method, and semiconductor device manufacturing method 有权
    抛光剂,化合物半导体制造方法和半导体器件制造方法

    公开(公告)号:US08841215B2

    公开(公告)日:2014-09-23

    申请号:US13415859

    申请日:2012-03-09

    IPC分类号: H01L21/302 C09G1/04 H01L21/02

    CPC分类号: H01L21/02024 C09G1/04

    摘要: Afforded are a polishing agent, and a compound semiconductor manufacturing method and semiconductor device manufacturing method utilizing the agent, whereby the surface quality of compound semiconductor substrates can be favorably maintained, and high polishing rates can be sustained as well. The polishing agent is a polishing agent for GaαIn(1-α)AsβP(1-β) (0≦α≦1; 0≦β≦1) compound semiconductors, and includes an alkali metal carbonate, an alkali metal organic salt, a chlorine-based oxidizer, and an alkali metal phosphate, wherein the sum of the concentrations of the alkali metal carbonate and the alkali metal organic salt is between 0.01 mol/L and 0.02 mol/L, inclusive. The compound semiconductor manufacturing method comprises a step of preparing a GaαIn(1-α)AsβP(1-β) (0≦α≦1; 0≦β≦1) compound semiconductor, and a step of polishing the face of the compound semiconductor utilizing an aforedescribed polishing agent.

    摘要翻译: 所使用的是抛光剂,以及利用该试剂的化合物半导体制造方法和半导体器件制造方法,由此可以有利地保持化合物半导体衬底的表面质量,并且还可以维持高的抛光速率。 抛光剂是用于GaαIn(1-α)As&bgr; P(1-&bgr;)(0≦̸α≦̸ 1; 0≦̸ bgr; nlE; 1)化合物半导体的抛光剂,包括碱金属碳酸盐,碱 金属有机盐,氯系氧化剂和碱金属磷酸盐,其中碱金属碳酸盐和碱金属有机盐的浓度之和为0.01mol / L至0.02mol / L。 化合物半导体制造方法包括制备化合物半导体的GaαIn(1-α)As&bgr; P(1-&bgr;)(0≦̸α≦̸ 1; 0≦̸ bgr; nlE; 1)化合物半导体的步骤, 使用上述抛光剂的化合物半导体的表面。