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公开(公告)号:US20150274987A1
公开(公告)日:2015-10-01
申请号:US14433814
申请日:2014-05-12
申请人: LG CHEM, LTD.
发明人: Jong Min Shin , Jung Hyun Seo , Young Chang Byun , Jae Hoon Choe
CPC分类号: H01B1/02 , B22F1/0048 , B22F1/0062 , B22F1/025 , B22F9/24 , B22F2301/10 , B22F2301/255 , B22F2998/10 , B22F2999/00 , C09D5/24 , H01B1/026 , H01B1/22 , B22F1/0088
摘要: The present invention relates to a copper containing particle with a surface layer for preventing oxidation and a method for manufacturing the same, and provides a copper containing particle including: a core containing a copper component; a shell formed on the surface of the core, containing a silver component, and having at least one pore; and a filler part configured to fill the pore of the shell and contain an antioxidant component.
摘要翻译: 本发明涉及具有防止氧化的表面层的含铜颗粒及其制造方法,并且提供了一种含铜颗粒,其包含:含有铜成分的芯; 形成在芯的表面上的壳,其含有银成分,并且具有至少一个孔; 以及填充部分,其构造成填充壳的孔并含有抗氧化成分。
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公开(公告)号:US09142518B2
公开(公告)日:2015-09-22
申请号:US14481122
申请日:2014-09-09
申请人: Napra Co., Ltd.
发明人: Shigenobu Sekine
CPC分类号: H01L24/05 , B22F1/0003 , B22F1/0062 , B22F1/025 , B22F7/064 , B22F2999/00 , B23K35/025 , B23K35/262 , B23K35/302 , H01B1/02 , H01B1/16 , H01B1/22 , H01L23/481 , H01L23/49827 , H01L23/49866 , H01L23/53233 , H01L24/29 , H01L24/32 , H01L2224/04026 , H01L2224/04073 , H01L2224/05647 , H01L2224/13147 , H01L2224/13294 , H01L2224/13311 , H01L2224/13313 , H01L2224/13347 , H01L2224/13411 , H01L2224/13447 , H01L2224/1349 , H01L2224/29294 , H01L2224/29311 , H01L2224/29313 , H01L2224/29347 , H01L2224/29411 , H01L2224/29447 , H01L2224/2949 , H01L2224/32507 , H01L2224/81447 , H01L2224/83447 , H01L2225/06544 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/13091 , H01L2924/3656 , H01L2924/00014 , H01L2924/00 , B22F2301/10 , B22F2301/255 , B22F2301/30 , B22F2301/205
摘要: A junction at which at least two conductors are connected together includes a compound region containing Cu, Sn and at least one element selected from the group consisting of Si, B, Ti, Al, Ag, Bi, In, Sb, Ga and Zn. The compound region forms a nanocomposite metal diffusion region with the conductor.
摘要翻译: 至少两个导体连接在一起的结,包括含有Cu,Sn和选自Si,B,Ti,Al,Ag,Bi,In,Sb,Ga和Zn中的至少一种元素的化合物区域。 复合区与导体形成纳米复合金属扩散区。
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公开(公告)号:US09095898B2
公开(公告)日:2015-08-04
申请号:US13228411
申请日:2011-09-08
申请人: Alfred A. Zinn
发明人: Alfred A. Zinn
CPC分类号: B22F1/0018 , B22F1/0062 , B22F9/24 , B22F2999/00 , B82Y30/00 , H05K1/097 , H05K3/125 , H05K2201/0218 , H05K2201/0257 , H05K2203/0514 , H05K2203/107 , B22F2301/10 , B22F2304/054
摘要: Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200° C. or lower.
摘要翻译: 描述了合成金属纳米颗粒,特别是铜纳米颗粒的方法。 该方法可以包括在含有伯胺第一表面活性剂,仲胺第二表面活性剂和二胺螯合剂第三表面活性剂的反应混合物中使金属盐的不溶性络合物与还原剂反应。 更具体地,形成铜纳米颗粒的方法可以包括形成含有铜盐,伯胺第一表面活性剂,仲胺第二表面活性剂和二胺螯合剂第三表面活性剂的第一溶液; 允许从第一溶液形成铜盐的不溶性络合物; 将含有还原剂的第二溶液与不溶性络合物组合; 并从不溶性络合物形成铜纳米颗粒。 这种铜纳米颗粒的尺寸可以为约10nm或更小,更特别地约3nm至约6nm,熔融温度为约200℃或更低。
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公开(公告)号:US09050654B2
公开(公告)日:2015-06-09
申请号:US12708291
申请日:2010-02-18
申请人: Ken Asada
发明人: Ken Asada
CPC分类号: B22F1/025 , B22F1/0048 , B22F1/0081 , B22F2998/00 , B22F2301/10 , B22F2301/15
摘要: Disclosed is a method of manufacturing a composite ball for electronic parts by preparing a core ball with spherical shape, forming a solder-plated layer encompassing the core ball to obtain a composite ball, and then conducting a smoothing work on the surface of the solder-plated layer, therein the smoothing work is preferably conducted by bringing a medium into contact with the surface of the solder-plated layer.
摘要翻译: 本发明公开了一种通过制备球形球芯制造电子部件用复合球的方法,形成包围核心球的焊料镀层以获得复合球,然后在焊料层的表面进行平滑化处理, 镀层优选通过使介质与焊料镀层的表面接触来进行平滑化。
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公开(公告)号:US20150097300A1
公开(公告)日:2015-04-09
申请号:US14481122
申请日:2014-09-09
申请人: Napra Co., Ltd.
发明人: Shigenobu Sekine
IPC分类号: H01L23/00
CPC分类号: H01L24/05 , B22F1/0003 , B22F1/0062 , B22F1/025 , B22F7/064 , B22F2999/00 , B23K35/025 , B23K35/262 , B23K35/302 , H01B1/02 , H01B1/16 , H01B1/22 , H01L23/481 , H01L23/49827 , H01L23/49866 , H01L23/53233 , H01L24/29 , H01L24/32 , H01L2224/04026 , H01L2224/04073 , H01L2224/05647 , H01L2224/13147 , H01L2224/13294 , H01L2224/13311 , H01L2224/13313 , H01L2224/13347 , H01L2224/13411 , H01L2224/13447 , H01L2224/1349 , H01L2224/29294 , H01L2224/29311 , H01L2224/29313 , H01L2224/29347 , H01L2224/29411 , H01L2224/29447 , H01L2224/2949 , H01L2224/32507 , H01L2224/81447 , H01L2224/83447 , H01L2225/06544 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/13091 , H01L2924/3656 , H01L2924/00014 , H01L2924/00 , B22F2301/10 , B22F2301/255 , B22F2301/30 , B22F2301/205
摘要: A junction at which at least two conductors are connected together includes a compound region containing Cu, Sn and at least one element selected from the group consisting of Si, B, Ti, Al, Ag, Bi, In, Sb, Ga and Zn. The compound region forms a nanocomposite metal diffusion region with the conductor.
摘要翻译: 至少两个导体连接在一起的结,包括含有Cu,Sn和选自Si,B,Ti,Al,Ag,Bi,In,Sb,Ga和Zn中的至少一种元素的化合物区域。 复合区与导体形成纳米复合金属扩散区。
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公开(公告)号:US20150037196A1
公开(公告)日:2015-02-05
申请号:US14520479
申请日:2014-10-22
申请人: DIAMET CORPORATION
发明人: Yoshinari Ishii , Tsuneo Maruyama , Yoshiki Tamura
CPC分类号: B22F3/26 , B22F1/007 , B22F3/12 , B22F5/00 , B22F2003/248 , B22F2301/10 , B22F2302/40 , B22F2302/45 , C22C1/0425 , C22C9/02 , C22C9/06 , C22C32/0084 , C22C32/0089 , F16C33/121
摘要: A Cu-based sintered sliding member that can be used under high-load conditions. The sliding member is age-hardened, including 5 to 30 mass % Ni, 5 to 20 mass % Sn, 0.1 to 1.2 mass % P, and the rest including Cu and unavoidable impurities. In the sliding member, an alloy phase containing higher concentrations of Ni, P and Sn than their average concentrations in the whole part of the sliding member, is allowed to be present in a grain boundary of a metallic texture, thereby achieving excellent wear resistance. Hence, without needing expensive hard particles, there can be obtained, at low cost, a Cu-based sintered sliding member usable under high-load conditions. Even more excellent wear resistance is achieved by containing 0.3 to 10 mass % of at least one solid lubricant selected from among graphite, graphite fluoride, molybdenum disulfide, tungsten disulfide, boron nitride, calcium fluoride, talc and magnesium silicate mineral powders.
摘要翻译: 可在高负荷条件下使用的Cu基烧结滑动件。 滑动构件经时效硬化,其中包括5至30质量%的Ni,5至20质量%的Sn,0.1至1.2质量%的P,其余包括Cu和不可避免的杂质。 在滑动构件中,允许在金属组织的晶界中存在Ni,P和Sn的含量高于其在滑动构件的整个部分中的平均浓度的合金相,从而获得优异的耐磨性。 因此,在不需要昂贵的硬质颗粒的情况下,可以以低成本获得可在高负载条件下使用的Cu系烧结滑动构件。 通过含有0.3〜10质量%的选自石墨,氟化石墨,二硫化钼,二硫化钨,氮化硼,氟化钙,滑石粉和硅酸镁矿物粉末中的至少一种固体润滑剂,可以获得更优异的耐磨性。
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公开(公告)号:US08795585B2
公开(公告)日:2014-08-05
申请号:US11614957
申请日:2006-12-21
CPC分类号: B22F9/04 , B22F1/007 , B22F2009/043 , B22F2998/00 , B22F2999/00 , C22C1/0425 , C22C1/1084 , C22C9/00 , C22C9/01 , C22C32/0068 , B22F3/17 , B22F3/18 , B22F3/15 , B22F2201/02 , B22F2202/03 , B22F2009/041 , B22F3/14 , B22F2303/01 , B22F2301/10 , B22F2303/05 , B22F2302/20 , B22F2301/052 , B22F2301/20 , B22F2301/205
摘要: There is provided cryogenic milled nanophase copper alloys and methods of making the alloys. The alloys are fine grained having grains in the size range from about 2 to about 100 nanometers, and greater. The nanophase alloys possess desirable physical properties stemming from the fine grain size, such as potentially high strength. Some embodiments of the cryogenic milled copper alloys may also be tailored for ductility, toughness, fracture resistance, corrosion resistance, fatigue resistance and other physical properties by balancing the alloy composition. In addition, embodiments of the alloys generally do not require extensive or expensive post-cryogenic milling processing.
摘要翻译: 提供了低温研磨的纳米相铜合金和制造合金的方法。 合金是细晶粒,其晶粒尺寸范围为约2至约100纳米,更大。 纳米相合金具有由细晶粒尺寸产生的理想物理性质,例如潜在的高强度。 低温碾磨的铜合金的一些实施方案也可以通过平衡合金组成来调整延展性,韧性,耐断裂性,耐腐蚀性,耐疲劳性和其它物理性能。 此外,合金的实施例通常不需要广泛或昂贵的后低温铣削加工。
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公开(公告)号:US08691347B2
公开(公告)日:2014-04-08
申请号:US12743370
申请日:2008-11-11
申请人: Sergey Dmitrievich Varfolomeev , Vladimir Mikhailovich Goldberg , Alexander Nikitovich Shchegolikhin , Anatoly Alexandrovich Kuznetsov
发明人: Sergey Dmitrievich Varfolomeev , Vladimir Mikhailovich Goldberg , Alexander Nikitovich Shchegolikhin , Anatoly Alexandrovich Kuznetsov
IPC分类号: C08F2/46
CPC分类号: A61K9/5094 , B22F1/0062 , B22F2998/00 , B22F2999/00 , C22C19/002 , C22C19/03 , B22F1/0018 , B22F2202/11 , B22F2303/01 , B22F2301/15 , B22F2303/05 , B22F2301/10
摘要: The invention concerns the methods for producing polymeric coatings on particle surfaces and can be used in pharmacology, medicine, veterinary and cosmetology to create the systems of vector delivery of drugs and biologically active agents as well as in other fields applying the particles with thin-layer polymer coatings. The method enables to obtain biocompatible, particularly polyamide and polyimide coatings on inorganic particles including magnetic inorganic nanoparticles. The method for producing polymeric coatings on particles surface comprises (a) forming a reaction system containing the particles mixed with monomers, and (b) the subsequent carrying out of polymerization reaction to form the polymeric coating on the particles; wherein the said polymerization reaction is accomplished by irradiating the reaction system with electromagnetic radiation, particularly, with microwaves capable of being absorbed partially or totally by the said particles.
摘要翻译: 本发明涉及在颗粒表面上生产聚合物涂层的方法,并且可用于药理学,药物学,兽医学和美容学中以产生药物和生物活性剂的载体递送系统,以及在其它领域中应用具有薄层 聚合物涂料。 该方法能够获得包括磁性无机纳米颗粒在内的无机颗粒上的生物相容性,特别是聚酰胺和聚酰亚胺涂层。 在颗粒表面上生产聚合物涂层的方法包括(a)形成含有与单体混合的颗粒的反应体系,和(b)随后进行聚合反应以在颗粒上形成聚合物涂层; 其中所述聚合反应通过用电磁辐射照射反应体系,特别是能够被所述颗粒部分或全部吸收的微波来实现。
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公开(公告)号:US20130230737A1
公开(公告)日:2013-09-05
申请号:US13764820
申请日:2013-02-12
申请人: David R. Whitcomb
发明人: David R. Whitcomb
IPC分类号: B22F9/16
CPC分类号: B22F9/16 , B22F1/0025 , B22F9/24 , B22F2301/10 , B82Y30/00 , C30B7/14 , C30B29/62 , Y10S977/762 , Y10T428/12431
摘要: Methods are disclosed for preparing copper nanowires that do not rely on highly reactive reagents, highly corrosive solutions, high temperatures, or long reaction times. Nanowires produced from such methods are free of large attached nanoparticles that have accompanied previously disclosed copper nanowires. Such nanowires are useful for electronics applications.
摘要翻译: 公开了用于制备不依赖于高反应性试剂,高腐蚀性溶液,高温或长反应时间的铜纳米线的方法。 由这种方法生产的纳米线不含伴随先前披露的铜纳米线的大附着纳米颗粒。 这种纳米线对于电子应用是有用的。
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公开(公告)号:US20130078448A1
公开(公告)日:2013-03-28
申请号:US13637642
申请日:2011-04-07
IPC分类号: H01M8/10
CPC分类号: H01M8/10 , B22F7/004 , B22F7/02 , B22F2998/00 , B32B18/00 , C04B38/02 , C04B41/009 , C04B41/51 , C04B41/88 , C04B2111/00525 , C04B2111/00612 , C04B2111/00853 , C04B2237/348 , C04B2237/586 , H01M8/1253 , H01M2008/1293 , Y02E60/525 , Y02P70/56 , Y10T428/24999 , C04B35/48 , C04B41/4545 , C04B41/458 , B22F2303/40 , B22F2301/35 , B22F2301/15 , B22F2301/10 , B22F2302/25 , C04B35/00
摘要: A method is described for producing layered structures comprising a porous metal layer and a ceramic containing layer comprising wherein a porous green ceramic layer is provided, and thereafter loose metal particles are applied to the green ceramic layer before sintering. In one embodiment, the green ceramic layer, after application of the loose metal particles, is dried to drive off the solvent and cause interpenetration of the metal particles. In another embodiment loose particles can be removed from the composite such as by shaking, and the green ceramic/loose metal particles composite compressed to cause further interpenetration of the metal particles prior to sintering.
摘要翻译: 描述了一种用于生产包括多孔金属层和含陶瓷层的层状结构的方法,其包括其中提供多孔生坯陶瓷层,然后在烧结之前将松散的金属颗粒施加到生坯陶瓷层。 在一个实施方案中,生坯陶瓷层在施加松散金属颗粒之后被干燥以驱除溶剂并引起金属颗粒的相互渗透。 在另一个实施方案中,可以例如通过摇动从复合物中除去松散的颗粒,并且将生陶瓷/松散金属颗粒复合物压缩以在烧结之前进一步互相渗透金属颗粒。
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