Stabilized metal nanoparticles and methods for production thereof
    53.
    发明授权
    Stabilized metal nanoparticles and methods for production thereof 有权
    稳定金属纳米粒子及其制备方法

    公开(公告)号:US09095898B2

    公开(公告)日:2015-08-04

    申请号:US13228411

    申请日:2011-09-08

    申请人: Alfred A. Zinn

    发明人: Alfred A. Zinn

    摘要: Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200° C. or lower.

    摘要翻译: 描述了合成金属纳米颗粒,特别是铜纳米颗粒的方法。 该方法可以包括在含有伯胺第一表面活性剂,仲胺第二表面活性剂和二胺螯合剂第三表面活性剂的反应混合物中使金属盐的不溶性络合物与还原剂反应。 更具体地,形成铜纳米颗粒的方法可以包括形成含有铜盐,伯胺第一表面活性剂,仲胺第二表面活性剂和二胺螯合剂第三表面活性剂的第一溶液; 允许从第一溶液形成铜盐的不溶性络合物; 将含有还原剂的第二溶液与不溶性络合物组合; 并从不溶性络合物形成铜纳米颗粒。 这种铜纳米颗粒的尺寸可以为约10nm或更小,更特别地约3nm至约6nm,熔融温度为约200℃或更低。

    Method of manufacturing composite ball for electronic parts
    54.
    发明授权
    Method of manufacturing composite ball for electronic parts 有权
    制造电子零件复合球的方法

    公开(公告)号:US09050654B2

    公开(公告)日:2015-06-09

    申请号:US12708291

    申请日:2010-02-18

    申请人: Ken Asada

    发明人: Ken Asada

    IPC分类号: B22F1/02 B22F1/00

    摘要: Disclosed is a method of manufacturing a composite ball for electronic parts by preparing a core ball with spherical shape, forming a solder-plated layer encompassing the core ball to obtain a composite ball, and then conducting a smoothing work on the surface of the solder-plated layer, therein the smoothing work is preferably conducted by bringing a medium into contact with the surface of the solder-plated layer.

    摘要翻译: 本发明公开了一种通过制备球形球芯制造电子部件用复合球的方法,形成包围核心球的焊料镀层以获得复合球,然后在焊料层的表面进行平滑化处理, 镀层优选通过使介质与焊料镀层的表面接触来进行平滑化。

    Cu-BASED SINTERED SLIDING MEMBER
    56.
    发明申请
    Cu-BASED SINTERED SLIDING MEMBER 审中-公开
    基于Cu的烧结滑动构件

    公开(公告)号:US20150037196A1

    公开(公告)日:2015-02-05

    申请号:US14520479

    申请日:2014-10-22

    摘要: A Cu-based sintered sliding member that can be used under high-load conditions. The sliding member is age-hardened, including 5 to 30 mass % Ni, 5 to 20 mass % Sn, 0.1 to 1.2 mass % P, and the rest including Cu and unavoidable impurities. In the sliding member, an alloy phase containing higher concentrations of Ni, P and Sn than their average concentrations in the whole part of the sliding member, is allowed to be present in a grain boundary of a metallic texture, thereby achieving excellent wear resistance. Hence, without needing expensive hard particles, there can be obtained, at low cost, a Cu-based sintered sliding member usable under high-load conditions. Even more excellent wear resistance is achieved by containing 0.3 to 10 mass % of at least one solid lubricant selected from among graphite, graphite fluoride, molybdenum disulfide, tungsten disulfide, boron nitride, calcium fluoride, talc and magnesium silicate mineral powders.

    摘要翻译: 可在高负荷条件下使用的Cu基烧结滑动件。 滑动构件经时效硬化,其中包括5至30质量%的Ni,5至20质量%的Sn,0.1至1.2质量%的P,其余包括Cu和不可避免的杂质。 在滑动构件中,允许在金属组织的晶界中存在Ni,P和Sn的含量高于其在滑动构件的整个部分中的平均浓度的合金相,从而获得优异的耐磨性。 因此,在不需要昂贵的硬质颗粒的情况下,可以以低成本获得可在高负载条件下使用的Cu系烧结滑动构件。 通过含有0.3〜10质量%的选自石墨,氟化石墨,二硫化钼,二硫化钨,氮化硼,氟化钙,滑石粉和硅酸镁矿物粉末中的至少一种固体润滑剂,可以获得更优异的耐磨性。

    Method for producing polymer coating on particle surfaces
    58.
    发明授权
    Method for producing polymer coating on particle surfaces 有权
    在颗粒表面上生产聚合物涂层的方法

    公开(公告)号:US08691347B2

    公开(公告)日:2014-04-08

    申请号:US12743370

    申请日:2008-11-11

    IPC分类号: C08F2/46

    摘要: The invention concerns the methods for producing polymeric coatings on particle surfaces and can be used in pharmacology, medicine, veterinary and cosmetology to create the systems of vector delivery of drugs and biologically active agents as well as in other fields applying the particles with thin-layer polymer coatings. The method enables to obtain biocompatible, particularly polyamide and polyimide coatings on inorganic particles including magnetic inorganic nanoparticles. The method for producing polymeric coatings on particles surface comprises (a) forming a reaction system containing the particles mixed with monomers, and (b) the subsequent carrying out of polymerization reaction to form the polymeric coating on the particles; wherein the said polymerization reaction is accomplished by irradiating the reaction system with electromagnetic radiation, particularly, with microwaves capable of being absorbed partially or totally by the said particles.

    摘要翻译: 本发明涉及在颗粒表面上生产聚合物涂层的方法,并且可用于药理学,药物学,兽医学和美容学中以产生药物和生物活性剂的载体递送系统,以及在其它领域中应用具有薄层 聚合物涂料。 该方法能够获得包括磁性无机纳米颗粒在内的无机颗粒上的生物相容性,特别是聚酰胺和聚酰亚胺涂层。 在颗粒表面上生产聚合物涂层的方法包括(a)形成含有与单体混合的颗粒的反应体系,和(b)随后进行聚合反应以在颗粒上形成聚合物涂层; 其中所述聚合反应通过用电磁辐射照射反应体系,特别是能够被所述颗粒部分或全部吸收的微波来实现。

    COPPER NANOWIRE PREPARATION METHODS AND COMPOSITIONS
    59.
    发明申请
    COPPER NANOWIRE PREPARATION METHODS AND COMPOSITIONS 失效
    铜纳米线制备方法和组合物

    公开(公告)号:US20130230737A1

    公开(公告)日:2013-09-05

    申请号:US13764820

    申请日:2013-02-12

    申请人: David R. Whitcomb

    发明人: David R. Whitcomb

    IPC分类号: B22F9/16

    摘要: Methods are disclosed for preparing copper nanowires that do not rely on highly reactive reagents, highly corrosive solutions, high temperatures, or long reaction times. Nanowires produced from such methods are free of large attached nanoparticles that have accompanied previously disclosed copper nanowires. Such nanowires are useful for electronics applications.

    摘要翻译: 公开了用于制备不依赖于高反应性试剂,高腐蚀性溶液,高温或长反应时间的铜纳米线的方法。 由这种方法生产的纳米线不含伴随先前披露的铜纳米线的大附着纳米颗粒。 这种纳米线对于电子应用是有用的。