公开(公告)号：US09824909B2

公开(公告)日：2017-11-21

申请号：US14427893

申请日：2013-12-04

申请人： SUSS MicroTec Lithography GmbH

发明人： Sven Hansen ,  Thomas Huelsmann ,  Katrin Schindler

IPC分类号： H01L21/68 ,  G03F9/00 ,  H01L21/683

CPC分类号： H01L21/682 ,  G03F9/703 ,  H01L21/6833

摘要： A chuck for aligning a first planar substrate in parallel to a second planar substrate includes a top plate having a top surface for arrangement of the first planar substrate. A bottom plate is at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between the first and second planar substrate includes measuring the thickness of the first planar substrate and measuring between a surface of the second planar substrate and the top surface of the top plate. The tilt adjusts between a top surface of the first planar substrate or the chuck and the surface of the second planar substrate by using at least three linear actuators of the chuck.

公开(公告)号：US09640418B2

公开(公告)日：2017-05-02

申请号：US15150856

申请日：2016-05-10

申请人： SUSS MicroTec Lithography GmbH

发明人： Hale Johnson ,  Gregory George

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/683 ,  H01L23/00

CPC分类号： H01L21/67742 ,  H01L21/67092 ,  H01L21/6719 ,  H01L21/67748 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68742 ,  H01L24/08 ,  H01L24/75 ,  H01L24/80 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/08145 ,  H01L2224/75101 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/75312 ,  H01L2224/7565 ,  H01L2224/757 ,  H01L2224/75701 ,  H01L2224/75702 ,  H01L2224/75703 ,  H01L2224/75743 ,  H01L2224/75754 ,  H01L2224/80203 ,  H01L2224/80907 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/80 ,  H01L2924/00014

摘要： An industrial-scale apparatus, system, and method for handling precisely aligned and centered semiconductor wafer pairs for wafer-to-wafer aligning and bonding applications includes an end effector having a frame member and a floating carrier connected to the frame member with a gap formed therebetween, wherein the floating carrier has a semi-circular interior perimeter. The centered semiconductor wafer pairs are positionable within a processing system using the end effector under robotic control. The centered semiconductor wafer pairs are bonded together without the presence of the end effector in the bonding device.

公开(公告)号：US09458002B2

公开(公告)日：2016-10-04

申请号：US14682565

申请日：2015-04-09

申请人： SUSS MicroTec Lithography GmbH

发明人： Oliver Treichel ,  Suayib Kartal ,  Kader Mekias ,  Aaron Foley ,  Greg George

IPC分类号： B67D7/02 ,  G03F7/16 ,  B05C11/10 ,  B67D7/32 ,  B67D7/76

CPC分类号： B67D7/0288 ,  B05C11/10 ,  B67D7/02 ,  B67D7/3227 ,  B67D7/763 ,  G03F7/16

摘要： A bottle cap adapter for supplying liquids, particularly viscous liquids, comprising: a body part; and a vent tube comprising a first opening and a second opening, the first opening being configured to be put inside a bottle in the vicinity of the bottom of the bottle, wherein the body part further comprises a first surface and a second surface, the first surface being perpendicular to the vent tube and the second surface being parallel to or tilted to the first surface, e.g., by an angle of 0° to 40°, wherein the body part further comprises a channel from the first surface to the second surface, wherein at least one part of the channel comprises a connector extending to the second surface, the connector being complementary to a connector of the bottle, wherein the body part is further configured to be coupled to a bottle supply system, and wherein the vent tube is at least partially located in the channel of the body part. Also a bottle supply system for supplying liquids, particularly viscous liquids, comprising: a top part configured to house a bottle cap adapter; a bottom part comprising a reservoir configured to receive an amount of liquid from a bottle inserted in the bottle cap adapter and comprising a pressure sensor configured to measure a fluid level in the bottle; and an output connected to the reservoir.

摘要翻译： 一种用于供应液体，特别是粘稠液体的瓶盖适配器，包括：主体部分; 以及排气管，其包括第一开口和第二开口，所述第一开口构造成放置在所述瓶的底部附近的瓶内，其中所述主体部还包括第一表面和第二表面，所述第一表面 表面垂直于通气管并且第二表面平行于或倾斜到第一表面，例如以0°至40°的角度，其中主体部分还包括从第一表面到第二表面的通道， 其中所述通道的至少一部分包括延伸到所述第二表面的连接器，所述连接器与所述瓶的连接器互补，其中所述主体部分还被配置为联接到瓶子供应系统，并且其中所述排气管是 至少部分地位于身体部分的通道中。 还有一种用于供应液体，特别是粘稠液体的瓶子供应系统，包括：顶部，其构造成容纳瓶盖适配器; 底部部分包括储存器，其被配置为从插入瓶盖适配器中的瓶子接收一定量的液体，并且包括构造成测量瓶子中的液位的压力传感器; 以及连接到储存器的输出。

公开(公告)号：US09159595B2

公开(公告)日：2015-10-13

申请号：US13022215

申请日：2011-02-07

申请人： Daniel T. Hurley ,  Gregory George

发明人： Daniel T. Hurley ,  Gregory George

IPC分类号： H01L21/683 ,  B23B31/30 ,  H01L21/67 ,  B23Q3/08

CPC分类号： H01L21/67092 ,  B23B31/307 ,  B23Q3/088 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T279/11

摘要： An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.

摘要翻译： 用于承载和保持具有低于100微米厚度的半导体晶片的改进的晶片载体装置包括可移动的晶片卡盘，其具有封闭的真空容器和被配置为支撑晶片的顶表面。 顶表面具有从顶表面延伸到真空储存器的一个或多个通孔，并且晶片通过真空从穿过通孔的真空容器被保持在顶表面上。

公开(公告)号：US20150251396A1

公开(公告)日：2015-09-10

申请号：US14714587

申请日：2015-05-18

申请人： GREGORY GEORGE ,  Stefan Lutter

发明人： GREGORY GEORGE ,  Stefan Lutter

IPC分类号： B32B37/00 ,  B32B37/18 ,  H01L21/683 ,  B32B37/12

CPC分类号： B32B37/0046 ,  B32B37/1284 ,  B32B37/18 ,  B32B2307/202 ,  B32B2457/14 ,  H01L21/0201 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/17

摘要： An apparatus for temporary bonding first and second wafers includes, a first coating chamber configured to apply a first adhesive layer upon a first surface of a first wafer; a second coating chamber configured to apply a second adhesive layer upon a first surface of a second wafer; a curing chamber configured to cure the first adhesive layer of the first wafer; a bonder module comprising an upper chuck assembly and a lower chuck assembly arranged below and opposite the upper chuck assembly. The upper chuck assembly is configured to hold the first wafer so that its first surface with the cured first adhesive layer faces down. The lower chuck assembly is configured to hold the second wafer so that the second adhesive layer faces up and is opposite to the cured first adhesive layer. The lower chuck assembly is configured to move upwards and thereby to bring the second adhesive layer in contact with the cured first adhesive layer. The curing chamber is further configured to cure the second adhesive layer after it is brought in contact with the cured first adhesive layer, thereby forming a temporary bond between the first and second wafers.

摘要翻译： 一种用于临时粘合第一和第二晶片的装置包括：第一涂层室，被配置为将第一粘合剂层施加到第一晶片的第一表面上; 第二涂覆室，被配置为将第二粘合剂层施加到第二晶片的第一表面上; 固化室，其构造成固化所述第一晶片的所述第一粘合剂层; 粘合剂模块包括布置在上卡盘组件下方和相对的上卡盘组件和下卡盘组件。 上卡盘组件构造成保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。 下卡盘组件构造成保持第二晶片，使得第二粘合剂层面向上并且与固化的第一粘合剂层相对。 下卡盘组件构造成向上移动，从而使第二粘合剂层与固化的第一粘合剂层接触。 固化室进一步构造成在与固化的第一粘合剂层接触之后固化第二粘合剂层，从而在第一和第二晶片之间形成临时粘合。

公开(公告)号：US08950459B2

公开(公告)日：2015-02-10

申请号：US13662307

申请日：2012-10-26

申请人： SUSS MicroTec Lithography GmbH

发明人： Gregory George ,  Christopher Rosenthal

IPC分类号： B32B38/10 ,  H01L21/67 ,  H01L21/683 ,  B32B43/00 ,  H01L21/00 ,  B32B38/18

CPC分类号： H01L21/6835 ,  B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/00 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/67282 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68728 ,  H01L2221/683 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2221/6839 ,  Y10T156/11 ,  Y10T156/1142 ,  Y10T156/1168 ,  Y10T156/1179 ,  Y10T156/1184 ,  Y10T156/19 ,  Y10T156/1911 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1978

摘要： Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

摘要翻译： 所描述的方法和装置为装置晶片和载体晶片之间的粘合剂接合提供受控的扰动。 受控的扰动可以是机械的，化学的，热的或辐射的，有助于两个晶片的分离，而不损坏器件晶片。 控制的扰动在粘合剂层（例如在剥离层和粘合剂之间）的界面处，或在晶片/粘合剂界面处在连接两个晶片的粘合剂内部引发裂纹。 然后可以使用用于引发裂纹的任何前述方法或其组合来传播裂纹。

公开(公告)号：US20130244400A1

公开(公告)日：2013-09-19

申请号：US13790684

申请日：2013-03-08

申请人： GREGORY GEORGE ,  Stefan Lutter

发明人： GREGORY GEORGE ,  Stefan Lutter

IPC分类号： H01L21/02

CPC分类号： B32B37/0046 ,  B32B37/1284 ,  B32B37/18 ,  B32B2307/202 ,  B32B2457/14 ,  H01L21/0201 ,  H01L21/2007 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/17

摘要： A method for temporary bonding first and second wafers includes, applying a first adhesive layer upon a first surface of a first wafer and then curing the first adhesive layer. Next, applying a second adhesive layer upon a first surface of a second wafer. Next, inserting the first wafer into a bonder module and holding the first wafer by an upper chuck assembly so that its first surface with the cured first adhesive layer faces down. Next, inserting the second wafer into the bonder module and placing the second wafer upon a lower chuck assembly so that the second adhesive layer faces up and is opposite to the first adhesive layer. Next, moving the lower chuck assembly upwards and bringing the second adhesive layer in contact with the cured first adhesive layer, and then curing the second adhesive layer.

摘要翻译： 临时粘合第一和第二晶片的方法包括：在第一晶片的第一表面上施加第一粘合剂层，然后固化第一粘合剂层。 接下来，将第二粘合剂层施加到第二晶片的第一表面上。 接下来，将第一晶片插入粘合剂模块中，并通过上卡盘组件保持第一晶片，使得其第一表面与固化的第一粘合剂层面朝下。 接下来，将第二晶片插入到接合器模块中，并将第二晶片放置在下卡盘组件上，使得第二粘合剂层面向上并与第一粘合剂层相对。 接下来，向下移动下卡盘组件并使第二粘合剂层与固化的第一粘合剂层接触，然后固化第二粘合剂层。

公开(公告)号：US08425715B2

公开(公告)日：2013-04-23

申请号：US13079446

申请日：2011-04-04

申请人： Gregory George

发明人： Gregory George

IPC分类号： B29C65/00 ,  B29C65/08 ,  B29C45/00 ,  B29C47/00 ,  B29C43/02 ,  B29C49/00 ,  B29C51/00 ,  B29C43/10 ,  B32B37/00 ,  B30B5/02 ,  B30B5/04 ,  B30B15/34 ,  H01L21/30 ,  H01L21/46 ,  H01L21/76 ,  B29D24/00 ,  B29D29/00 ,  B28B21/36 ,  A01J21/00 ,  A01J25/12 ,  A21C3/00 ,  A21C11/00 ,  A23G1/20 ,  A23G3/02 ,  A23P1/00 ,  B28B11/08 ,  B29C55/28

CPC分类号： H01L21/6719 ,  H01L21/67092

摘要： An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate. The applied first force causes the heater/isolator plates to move toward each other along the main axis and thereby causes the collapse of each chamber zone volume and the application of bonding pressure onto the wafer pairs.

摘要翻译： 一种工业规模的高通量晶片接合装置，包括沿着主轴延伸的晶片接合室，包括多个室区，多个加热器/隔离板，沿主轴延伸的导杆系统，一对平行轨道 杆沿着主轴线延伸，以及第一压力装置。 室区彼此分离并通过加热器/隔离板彼此热隔离。 加热器/隔离板垂直于主轴定向，由导杆系统可移动地支撑和引导，并被构造成沿着主轴线的方向移动。 每个室区的尺寸被设计成适应对准的晶片对，并且晶片对构造成由平行轨道杆支撑。 第一压力装置构造成施加垂直于第一端加热器/隔离板的第一力。 所施加的第一力使得加热器/隔离板沿着主轴线彼此移动，从而导致每个室区域体积的崩溃以及将结合压力施加到晶片对上。

公开(公告)号：US08366873B2

公开(公告)日：2013-02-05

申请号：US13085159

申请日：2011-04-12

申请人： Gregory George

发明人： Gregory George

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1174 ,  Y10T156/1944 ,  Y10T156/1956 ,  Y10T156/1978

摘要： A debonder apparatus includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder holding a first wafer of a bonded wafer pair in contact with the chuck. The flex plate assembly includes a flex plate and a second wafer holder holding a second wafer of the bonded wafer pair in contact with the flex plate. The flex plate is placed above the chuck. The contact roller is arranged adjacent to a first edge of the chuck and pushes and lifts up a first edge of the flex plate, while the resistance roller traverses horizontally over the flex plate and applies a downward force upon the flex plate and thereby the bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.

摘要翻译： 脱粘器装置包括卡盘组件，挠性板组件，接触辊和电阻辊。 卡盘组件包括卡盘和保持与卡盘接触的接合晶片对的第一晶片的第一晶片保持架。 柔性板组件包括柔性板和保持接合晶片对的第二晶片与柔性板接触的第二晶片保持架。 柔性板放置在卡盘的上方。 接触辊被布置成与卡盘的第一边缘相邻并且将柔性板的第一边缘推起并提升，同时阻力辊横向于柔性板上的水平方向并且向上施加向下的力到柔性板上，从而将接合的晶片 沿分离层分层，并且第一和第二晶片彼此分离。

公开(公告)号：US20110253314A1

公开(公告)日：2011-10-20

申请号：US13085159

申请日：2011-04-12

申请人： GREGORY GEORGE

发明人： GREGORY GEORGE

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B38/1858 ,  B32B2309/105 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/1126 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1174 ,  Y10T156/1944 ,  Y10T156/1956 ,  Y10T156/1978

摘要： A debonder apparatus for debonding a temporary bonded wafer pair includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair in contact with a top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair in contact with a first surface of the flex plate. The flex plate is configured to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate. The contact roller pushes and lifts up the first edge of the flex plate while the resistance roller simultaneously applies the downward force upon the flex plate and traverses horizontally away from the first edge of the flex plate and thereby the temporary bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other.

摘要翻译： 用于剥离临时键合晶片对的脱粘器装置包括卡盘组件，挠性板组件，接触辊和电阻辊。 卡盘组件包括卡盘和第一晶片保持器，第一晶片保持器构造成保持临时结合晶片对的第一晶片与卡盘的顶表面接触。 柔性板组件包括柔性板和第二晶片保持器，其被配置为保持临时结合晶片对的第二晶片与柔性板的第一表面接触。 柔性板被配置为放置在卡盘的顶表面上方。 接触辊邻近卡盘的第一边缘布置，并且包括用于推动和提升柔性板的第一边缘的装置。 电阻辊包括用于水平地横过柔性板的装置和用于向柔性板施加向下的力的装置。 接触辊推动并提起柔性板的第一边缘，同时电阻辊同时向柔性板施加向下的力并且横向水平地远离柔性板的第一边缘，从而临时粘结的晶片对沿着释放 层，并且第一和第二晶片彼此分离。