摘要:
In a helical scanning tape system including a magnetoresistive head; and a magnetic recording medium having a magnetic layer formed by oblique evaporation on a long nonmagnetic support, a signal being read with the magnetoresistive head by helical scanning, the track width of the magnetoresistive head is 0.5 to 0.8 μm, the distance between shields is 0.13 to 0.145 μm, and sensitivity is 1,862 μVp-p or more.
摘要:
In a digital PLL system, instead of measuring a binarized playback RF signal with a high frequency clock, pulse-length data is generated by using N phase clocks (for example, 16 phase clocks). The pulse-length data is then run-length counted with a virtual channel clock so as to extract data. In this digital PLL system, the number of changing points of an asynchronous signal during an interval between adjacent clocks of the N phase clocks is detected so as to determine phase errors from the detected number of changing points. Phase errors are also determined from the timing relationship between changing points of a signal synchronized with the N phase clocks and each clock of the N phase clocks.
摘要:
A thin film magnetic recording head comprises a substrate, a first magnetic core formed on the substrate, a second magnetic core having the front end face with a magnetic gap with respect to the front end face of the first magnetic core, and a coil for developing magnetic flux between the front end portions of the magnetic cores. A width of the second magnetic core at the front end portion thereof is chosen to be smaller than that of the first magnetic core. The second magnetic core is at a leading position relative to the second magnetic core in a traveling direction on a recording medium. In such configuration, it is possible to reduce side erase due to recording magnetic flux fringing and to achieve high density of magnetic recording while maintaining the conventional fabrication steps for the thin film magnetic recording head, thereby avoiding the problem in the fabrication.
摘要:
A DA converter includes a first DA conversion section for obtaining an analog output signal in accordance with a digital input signal value, and a second DA conversion section for obtaining an analog gain control output signal in accordance with a digital gain control input signal value. In the DA converter, the gain control of the analog output signal generated by the first DA conversion section is performed on the basis of the gain control output signal generated by the second DA conversion section.
摘要:
The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.
摘要:
An electrode includes a composite mixture layer formed by applying a composite mixture having one of a cathode active material or an anode active material on one of main surfaces of a plurality of current collectors formed in substantially rectangular shapes; and a non-applied part to which the composite mixture is not applied at both end parts in the longitudinal direction. One current collector is connected to the other adjacent current collector at one end side in the longitudinal direction through a connecting part to which the composite mixture is not applied and which is provided continuously to the non-applied parts. In the electrode constructed as described above, a plurality of current collectors can be laminated to obtain a multi-layer structure and an electric current can be collected from a lead welded to only one end part of the current collector. Thus, the electrode of a new form having an excellent productivity and a high capacity can be provided.
摘要:
A universal trim piece for a recessed light includes a mounting side disposed toward a ceiling and having an aperture sized to conform with a dimension of an open side of a housing for a recessed light. A decorative side is disposed opposite the mounting side and a universal engagement member, disposed on the mounting side, removably engages a trim ring on the recessed light and secure the universal trim piece to the housing and proximate to the ceiling.
摘要:
The present invention provides an acoustical firewall attenuating assembly. The assembly includes a first frame assembly having a first plate, a second plate and a first plurality of elongate members spaced from one another and extending between the first plate and the second plate. A structure is spaced from the first frame assembly and has an outer surface. A cement wall is positioned between the first frame and the structure and is attached to at least the first frame assembly by a first vibration dampener.
摘要:
An NchMOS transistor Q71 on the input side of a current mirror 70 is made function as a voltage operating-point setting portion so that a pixel signal line potential (voltage of a horizontal signal line 20) would be constantly stable nearly at the GND. Then, an amplification factor and linearity become good in an amplification transistor in the solid imaging device 3. A current copier 90 is made function as a current sampling portion so as to receive a signal current IIN of the solid imaging device 3 through the current mirror 70 to carry out sampling of a pixel signal in a resetting period in the shape of current component as the pixel signal is. Calculating differential between a current component in a detecting period and an offset current, which is the current component in a resetting period in sampling, allows an offset component included in the pixel signal to be removed and only pure signal Isig to be picked up at an output terminal Iout, so that the FPN restraining function can be fulfilled.
摘要:
A solid-state image pickup device is provided in which a pixel forming region 4 and a peripheral circuit forming region 20 are formed on the same semiconductor substrate, a first element isolation portion is formed by an element isolation layer 21 in which an insulating layer is buried into a semiconductor substrate 10 in the peripheral circuit forming region 20, a second element isolation portion is composed of an element isolation region 11 formed within the semiconductor substrate 10 and an element isolation layer 12 projected in the upper direction from the semiconductor substrate 10 in the pixel forming region 4 and an element isolation layer 21 of the first element isolation portion and the element isolation layer 12 of the second element isolation portion contain the same insulating layers 17, 18 and 19. This solid-state image pickup device has a structure capable of suppressing a noise relative to a pixel signal and which can be microminiaturized in the peripheral circuit forming region.