Abstract:
This invention relates generally to the field of microarray chips and uses thereof. In particular, the invention provides a microarray reaction device that can be used in assaying the interaction between various moieties, e.g., nucleic acids, immunoreactions involving proteins, interactions between a protein and a nucleic acid, a ligand-receptor interaction, and small molecule and protein or nucleic acid interactions, etc. Articles of manufacture and kits comprising the microarray reaction device and assaying methods using the microarray reaction device are also provided.
Abstract:
An electrochemical biosensor formed by screen printing and method of fabricating such biosensor is disclosed in the present invention. The biosensor can quickly absorb a sample to be measured therein, effectively control volume of the sample fed and “fill-and-position” the sample therein. The biosensor includes an electrode layer (electrode area) comprising two or three electrodes, which are a working electrode, a reference electrode and an auxiliary electrode (tri-electrode) on an insulating substrate. An active reaction layer containing reactant, reaction catalyst, mediator, wetting agent and surfactant is spread on the surface of the electrode layer. A sample inflow area is formed above the electrode area by adding an upper cover on top of a middle insulating layer with a U-shaped opening formed therein. Sample solution with a minute amount about 0.8 to 1 μl can be rapidly introduced into the electrode area and the active reaction layer via the inflow area by siphon or capillary, where the ingredient of the sample can be analysed by measuring reaction between the sample, reaction catalyst and mediator in the reaction layer using electrochemical potentiometric or amperometric method. An upwardly extended closed space formed within the upper cover above the electrode area adjacent to the front of conductive wires can be effectively used to control sample volume and “fill-and-position” the sample.
Abstract:
This invention relates generally to the field of moiety or molecule manipulation in a chip format. In particular, the invention provides a method for manipulating a moiety in a microfluidic application, which method comprises: a) coupling a moiety to be manipulated onto surface of a binding partner of said moiety to form a moiety-binding partner complex; and b) manipulating said moiety-binding partner complex with a physical force in a chip format, wherein said manipulation is effected through a combination of a structure that is external to said chip and a structure that is built-in in said chip, thereby said moiety is manipulated.
Abstract:
The present invention provides apparatus, kits and methods for assaying analytes using photoelectrochemical molecules as labels. Specifically, the present invention provides a method for assaying an analyte, comprising: a) contacting a sample suspected of containing an analyte with a reactant capable of binding and/or reacting with the analyte under suitable conditions to allow binding of analyte, if present in the sample, to the reactant; and b) assessing binding and/or reacting between the analyte and the reactant to determine presence and/or amount of analyte in the sample, wherein the reactant, analyte, or additional reactant or additional analyte or analyte analog is labeled with a photoelectrochemically active molecule. The assessing step also comprises converting the photoelectrochemically active molecule with light to an excited state in the presence of an electrode, and assessing an electric current generated by an electron transfer between the excited photoelectrochemically active molecule and the electrode.
Abstract:
This invention relates generally to the field of microarray reaction devices and uses thereof. In particular, the invention a microarray reaction device wherein a plurality of reaction spaces are formed between a first and second plurality of projections, the heights of said plurality of reaction spaces being substantially identical and controllable by a supporting structure, and the relative positions between the first and second plurality of projections being controllable by a positioning structure. Articles of manufacture comprising the microarray reaction device and methods for assaying an analyte using the microarray reaction device are also provided.
Abstract:
This invention relates generally to the field of. In particular, the invention provides processes and kits for isolating a target cell, cellular organelle or virus from a sample, using inter alia, non- or low-specific binding between a target cell, cellular organelle or virus with a magnetic microbead.
Abstract:
This invention relates generally to the field of electrochemistry. In particular, the invention provides a method for assaying an analyte, using, inter alia, a reactant capable of binding and/or reacting with an analyte to be analyzed on an oxide electrode and a reducing agent not capable of being oxidized directly by said electrode to generate reduced electrochemically active molecule that participates in oxidation-reduction reactions repeatedly to generate an amplified electrochemical signal to determine presence and/or amount of said analyte in said sample.
Abstract:
A method for forming a copper damascene feature including providing a semiconductor process wafer including at least one via opening formed to extend through a thickness of at least one dielectric insulating layer and an overlying trench line opening encompassing the at least one via opening to form a dual damascene opening; etching through an etch stop layer at the at least one via opening bottom portion to expose an underlying copper area; carrying out a sub-atmospheric DEGAS process with simultaneous heating of the process wafer in a hydrogen containing ambient; carrying out an in-situ sputter-clean process; and, forming a barrier layer in-situ to line the dual damascene opening.
Abstract:
A new method and structure is provided for the creation of a copper dual damascene interconnect. A dual damascene structure is created in the layer of dielectric, optionally a metal barrier layer is deposited over exposed surfaces of the dual damascene structure. A copper seed layer is deposited, the dual damascene structure is filled with copper. An anneal is applied to the created copper interconnect after which excess copper is removed from the dielectric. Of critical importance to the invention, a thin layer of oxide is then deposited as a cap layer over the copper dual damascene interconnect, an etch stop layer is then deposited over the thin layer of oxide for continued upper-level metallization.
Abstract:
A new method is provided for the creation of a copper seed interface capability. A first seed layer of copper alloy and a second seed layer of copper is provided over an opening in a layer of dielectric. The opening is filled with copper, the first and second seed layers are annealed.