公开(公告)号：US20120292767A1

公开(公告)日：2012-11-22

申请号：US13561826

申请日：2012-07-30

申请人： Hsien-Ming Lee ,  Minghsing Tsai ,  Syun-Ming Jang

发明人： Hsien-Ming Lee ,  Minghsing Tsai ,  Syun-Ming Jang

IPC分类号： H01L21/768 ,  H01L23/535

CPC分类号： H01L21/76856 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76873

摘要： A method for fabricating an integrated circuit structure and the resulting integrated circuit structure are provided. The method includes forming a low-k dielectric layer; form an opening in the low-k dielectric layer; forming a barrier layer covering a bottom and sidewalls of the low-k dielectric layer; performing a treatment to the barrier layer in an environment comprising a treatment gas; and filling the opening with a conductive material, wherein the conductive material is on the barrier layer.

摘要翻译： 提供一种用于制造集成电路结构的方法和所得到的集成电路结构。 该方法包括形成低k电介质层; 在低k电介质层中形成开口; 形成覆盖所述低k电介质层的底部和侧壁的阻挡层; 在包括处理气体的环境中对阻挡层进行处理; 并用导电材料填充开口，其中导电材料在阻挡层上。

公开(公告)号：US08272884B2

公开(公告)日：2012-09-25

申请号：US13102949

申请日：2011-05-06

申请人： Yu-Fang Lin ,  Hsien-Ming Lee ,  Hao-Chung Lien

发明人： Yu-Fang Lin ,  Hsien-Ming Lee ,  Hao-Chung Lien

IPC分类号： H01R13/44

CPC分类号： H04M1/0227 ,  H01R13/60 ,  H04M1/0274

摘要： A signal transmission device is provided. The signal transmission device comprises a linked unit, a data connector, a sliding block, a link and a lock block. The linked unit includes a first shaft, a second shaft, a third shaft, a first elastomer and a second elastomer. The data connector rotates and expands according to the first shaft and the first elastomer. During the retraction of the data connector, the data connector pushes the sliding block. Then the sliding block moves against the lock block so that the lock block rotates according to the second shaft. The lock block rotates to lock and secure the data connector by the lock piece, while a cam of the link moves to a secure location along an incline plane of a track of the sliding block.

摘要翻译： 提供了一种信号传输装置。 信号传输装置包括链接单元，数据连接器，滑动块，链接和锁定块。 连接单元包括第一轴，第二轴，第三轴，第一弹性体和第二弹性体。 数据连接器根据第一轴和第一弹性体旋转和膨胀。 在数据连接器退回期间，数据连接器推动滑块。 然后滑动块抵靠锁定块移动，使得锁定块根据第二轴旋转。 锁定块旋转以通过锁定件锁定并固定数据连接器，同时链节的凸轮沿着滑动块的轨道的倾斜平面移动到安全位置。

公开(公告)号：US20070181434A1

公开(公告)日：2007-08-09

申请号：US11783245

申请日：2007-04-06

申请人： Hsien-Ming Lee ,  Jing-Cheng Lin ,  Shing-Chyang Pan ,  Ming-Hsing Tsai ,  Hung-Wen Su ,  Shih-Wei Chou ,  Shau-Lin Shue ,  Kuo-Wei Cheng ,  Ting-Chu Ko

发明人： Hsien-Ming Lee ,  Jing-Cheng Lin ,  Shing-Chyang Pan ,  Ming-Hsing Tsai ,  Hung-Wen Su ,  Shih-Wei Chou ,  Shau-Lin Shue ,  Kuo-Wei Cheng ,  Ting-Chu Ko

IPC分类号： C25D5/34 ,  H01L21/44 ,  C25D3/38

CPC分类号： H01L21/2885 ,  H01L21/76843 ,  H01L21/76861 ,  H01L21/76862 ,  H01L21/76873 ,  H01L21/76877

摘要： A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemical surface treatment process. The electrochemical plating cell is covered by a cap to prevent evaporation of the electrolyte solution. The electrochemical plating cell includes a substrate holder assembly with a lift seal, e.g., with a contact angle θ less than 90° between the lift seal and the substrate. The substrate holder assembly includes a substrate chuck at the rear side of the substrate.

摘要翻译： 电化学沉积（ECD）的方法在衬底上提供阻挡层和种子层。 在将金属层电化学沉积在具有物理或化学表面处理工艺的电化学镀覆电池中之前，对基板的表面进行预处理。 电化学镀覆电池被盖覆盖以防止电解质溶液的蒸发。 电化学电镀单元包括具有提升密封件的衬底保持器组件，例如在提升密封件和衬底之间的接触角θ小于90°。 衬底保持器组件包括在衬底的后侧的衬底卡盘。

公开(公告)号：US20060244151A1

公开(公告)日：2006-11-02

申请号：US10908204

申请日：2005-05-02

申请人： CHEN-HUA YU ,  CHENG-LIN HUANG ,  SHAU-LIN SHUE ,  CHING-HUA HSIEH ,  SHING-CHYANG PAN ,  HSIEN-MING LEE LEE ,  HSUEH-HUNG FU

发明人： CHEN-HUA YU ,  CHENG-LIN HUANG ,  SHAU-LIN SHUE ,  CHING-HUA HSIEH ,  SHING-CHYANG PAN ,  HSIEN-MING LEE LEE ,  HSUEH-HUNG FU

IPC分类号： H01L23/48

CPC分类号： H01L23/5226 ,  H01L21/76805 ,  H01L21/76844 ,  H01L23/53238 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： Semiconductor devices having an oblique metal recess for receiving metal during metallization processes are described. In one example, a semiconductor device includes a dielectric layer formed over a conductive pad disposed in a substrate. The conductive pad is etched to include an oblique recess, which interfaces with a metal deposited during a metallization process. Related methods for forming such metal contacts and interconnections for the semiconductor device are also described.

摘要翻译： 描述了在金属化处理期间具有用于接收金属的倾斜金属凹部的半导体器件。 在一个示例中，半导体器件包括在布置在衬底中的导电焊盘上形成的电介质层。 导电焊盘被蚀刻以包括倾斜凹部，其与在金属化过程期间沉积的金属相接触。 还描述了用于形成用于半导体器件的金属触点和互连的相关方法。

公开(公告)号：US06876082B2

公开(公告)日：2005-04-05

申请号：US10214638

申请日：2002-08-08

申请人： Hsien-Ming Lee ,  Shing-Chuang Pan ,  Chung-Shi Liu ,  Chen-Hua Yu

发明人： Hsien-Ming Lee ,  Shing-Chuang Pan ,  Chung-Shi Liu ,  Chen-Hua Yu

IPC分类号： H01L21/285 ,  H01L21/768 ,  H01L23/48

CPC分类号： H01L21/76846 ,  H01L21/2855

摘要： Within a microelectronic fabrication and a method for fabricating the microelectronic fabrication a barrier layer is formed over a substrate. Within the method and the microelectronic fabrication the barrier layer is formed of a refractory metal nitride barrier material having within its thickness a gradient in nitrogen concentration. The barrier layer has low resistivity and improved electromigration performance.

公开(公告)号：US08907431B2

公开(公告)日：2014-12-09

申请号：US13328936

申请日：2011-12-16

申请人： Po-Chin Kuo ,  Hsien-Ming Lee

发明人： Po-Chin Kuo ,  Hsien-Ming Lee

IPC分类号： H01L29/78

CPC分类号： H01L21/82345 ,  H01L21/28088 ,  H01L21/28105 ,  H01L21/28114 ,  H01L21/30604 ,  H01L21/823418 ,  H01L21/823431 ,  H01L27/0886 ,  H01L29/0847 ,  H01L29/1608 ,  H01L29/161 ,  H01L29/165 ,  H01L29/42376 ,  H01L29/4238 ,  H01L29/4966 ,  H01L29/4983 ,  H01L29/66545 ,  H01L29/66636 ,  H01L29/66795 ,  H01L29/6681 ,  H01L29/7848 ,  H01L29/785 ,  H01L29/7851

摘要： A device includes a substrate, a semiconductor fin over the substrate, and a gate dielectric layer on a top surface and sidewalls of the semiconductor fin. A gate electrode is spaced apart from the semiconductor fin by the gate dielectric layer. The gate electrode includes a top portion over and aligned to the semiconductor fin, and a sidewall portion on a sidewall portion of the dielectric layer. The top portion of the gate electrode has a first work function, and the sidewall portion of the gate electrode has a second work function different from the first work function.

摘要翻译： 一种器件包括衬底，衬底上的半导体鳍片，以及半导体鳍片的顶表面和侧壁上的栅极电介质层。 栅电极通过栅介质层与半导体鳍片间隔开。 栅极电极包括在半导体鳍片上方并对准的顶部部分，以及介电层侧壁部分上的侧壁部分。 栅电极的顶部具有第一功函数，并且栅极的侧壁部分具有与第一功函数不同的第二功函数。

公开(公告)号：US08242016B2

公开(公告)日：2012-08-14

申请号：US11803282

申请日：2007-05-14

申请人： Hsien-Ming Lee ,  Minghsing Tsai ,  Syun-Ming Jang

发明人： Hsien-Ming Lee ,  Minghsing Tsai ,  Syun-Ming Jang

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： H01L21/76856 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76873

摘要： A method for fabricating an integrated circuit structure and the resulting integrated circuit structure are provided. The method includes forming a low-k dielectric layer; form an opening in the low-k dielectric layer; forming a barrier layer covering a bottom and sidewalls of the low-k dielectric layer; performing a treatment to the barrier layer in an environment comprising a treatment gas; and filling the opening with a conductive material, wherein the conductive material is on the barrier layer.

摘要翻译： 提供一种用于制造集成电路结构的方法和所得到的集成电路结构。 该方法包括形成低k电介质层; 在低k电介质层中形成开口; 形成覆盖所述低k电介质层的底部和侧壁的阻挡层; 在包括处理气体的环境中对阻挡层进行处理; 并用导电材料填充开口，其中导电材料在阻挡层上。

公开(公告)号：US20120149219A1

公开(公告)日：2012-06-14

申请号：US13102949

申请日：2011-05-06

申请人： YU-FANG LIN ,  HSIEN-MING LEE ,  HAO-CHUNG LIEN

发明人： YU-FANG LIN ,  HSIEN-MING LEE ,  HAO-CHUNG LIEN

IPC分类号： H01R13/44

CPC分类号： H04M1/0227 ,  H01R13/60 ,  H04M1/0274

摘要： A signal transmission device is provided. The signal transmission device comprises a linked unit, a data connector, a sliding block, a link and a lock block. The linked unit includes a first shaft, a second shaft, a third shaft, a first elastomer and a second elastomer. The data connector rotates and expands according to the first shaft and the first elastomer. During the retraction of the data connector, the data connector pushes the sliding block. Then the sliding block moves against the lock block so that the lock block rotates according to the second shaft. The lock block rotates to lock and secure the data connector by the lock piece, while a cam of the link moves to a secure location along an incline plane of a track of the sliding block.

摘要翻译： 提供了一种信号传输装置。 信号传输装置包括链接单元，数据连接器，滑动块，链接和锁定块。 连接单元包括第一轴，第二轴，第三轴，第一弹性体和第二弹性体。 数据连接器根据第一轴和第一弹性体旋转和膨胀。 在数据连接器退回期间，数据连接器推动滑块。 然后滑动块抵靠锁定块移动，使得锁定块根据第二轴旋转。 锁定块旋转以通过锁定件锁定并固定数据连接器，同时链节的凸轮沿着滑动块的轨道的倾斜平面移动到安全位置。

公开(公告)号：US20070225088A1

公开(公告)日：2007-09-27

申请号：US11756399

申请日：2007-05-31

申请人： Hsien Ming Lee

发明人： Hsien Ming Lee

IPC分类号： A63B57/00

CPC分类号： A63B57/12 ,  A63B57/10

摘要： A durable golf tee construction to prevent the loss of or damage to golf tees, allowing golf players to play many rounds of golf using only one golf tee. The first tee of the duo-tee construction contains a wire connected to the base top and the separable ball seat, through a center hole in the middle ring portion, so that the whole structure becomes more durable and thus environmental friendly than other prior art disclosure's teaching.

摘要翻译： 一个耐用的高尔夫球座建筑，以防止高尔夫球场的损失或损坏，允许高尔夫球员只使用一个高尔夫球座打高尔夫球。 二通道结构的第一个三通包括通过中间环部分的中心孔连接到基座顶部和可分离球座的电线，使得整个结构变得比其它现有技术的公开内容更加耐用，因此环境友好 教学。

公开(公告)号：US07226860B2

公开(公告)日：2007-06-05

申请号：US10833154

申请日：2004-04-28

申请人： Hsien-Ming Lee ,  Jing-Cheng Lin ,  Shing-Chyang Pan ,  Ming-Hsing Tsai ,  Hung-Wen Su ,  Shih-Wei Chou ,  Shau-Lin Shue ,  Kuo-Wei Cheng ,  Ting-Chu Ko

发明人： Hsien-Ming Lee ,  Jing-Cheng Lin ,  Shing-Chyang Pan ,  Ming-Hsing Tsai ,  Hung-Wen Su ,  Shih-Wei Chou ,  Shau-Lin Shue ,  Kuo-Wei Cheng ,  Ting-Chu Ko

IPC分类号： H01L21/44

CPC分类号： H01L21/2885 ,  H01L21/76843 ,  H01L21/76861 ,  H01L21/76862 ,  H01L21/76873 ,  H01L21/76877

摘要： A method of electrochemical deposition (ECD) provides a barrier and a seed layer on a substrate. The surfaces of the substrate are pre-treated before a metal layer is electrochemically deposited thereon in an electrochemical plating cell with a physical or a chemical surface treatment process. The electrochemical plating cell is covered by a cap to prevent evaporation of the electrolyte solution. The electrochemical plating cell includes a substrate holder assembly with a lift seal, e.g., with a contact angle θ less than 90° between the lift seal and the substrate. The substrate holder assembly includes a substrate chuck at the rear side of the substrate.