Abstract:
A memory device includes a first floating gate electrode on a substrate between adjacent isolation layers in the substrate, at least a portion of the first floating gate protruding above a portion of the adjacent isolation layers, a second floating gate electrode, electrically connected to the first floating gate electrode, on at least one of the adjacent isolation layers, a dielectric layer over the first and second floating gate electrodes, and a control gate over the dielectric layer and the first and second floating gate electrodes.
Abstract:
Disclosed herein are a motor, which prevents cut-off of magnet wire connection parts due to corrosion caused by a potential difference and damage to a magnet wire film, and a washing machine having the motor. The motor includes a stator, on which a magnet wire is wound, including mag mate terminals connected with the magnet wire, and a rotor rotated by electromagnetic interaction with the stator. Each of the mag mate terminals includes a first metal connection part, to which a metal of a different kind is connected, and a same kind metal connection part, to which a metal of the same kind is connected.
Abstract:
Disclosed are a fuse box and a semiconductor integrated circuit having the same. The semiconductor integrated circuit includes a plurality of banks, column control blocks, and column fuse blocks. The plurality of banks including a plurality of mat rows and mat columns. The banks are arranged in row and column directions and disposed away from each other. The column control blocks are disposed in a space between the banks which are extended to the column direction. The column fuse blocks are disposed adjacent to the column control blocks and have a plurality of fuse boxes. The fuse boxes include fuse sets arranged in two rows. The fuse boxes are disposed to correspond to the one mat column. Each fuse box has an interconnection fuse and address fuses which are arranged with a constant interval and are the same type.
Abstract:
Disclosed is a method of manufacturing a through-via. The through-via manufacturing method includes forming a core-via hole in a wafer, forming a suction-via hole adjacent to the core-via hole in the wafer, forming a via core in the core-via hole, forming a polymer-via hole connected to the suction-via hole in the wafer, filling the polymer-via hole with polymer solution by creating a vacuum inside the polymer-via hole by drawing air out of the suction-via hole, and polishing the wafer such that the via core formed in the core-via hole is exposed.
Abstract:
An electronic component embedded printed circuit board and a method for manufacturing the same are disclosed. The method includes: providing a first carrier having a first circuit pattern formed on one surface thereof; providing a second carrier having a second circuit pattern formed on one surface thereof; flip-chip bonding an electronic component to the first circuit pattern; stacking one side of an insulator on one side of the first carrier to cover the electronic component; compressing the second carrier having the second circuit pattern formed on one surface thereof on an other side of the insulator; and removing the first carrier and the second carrier. The method can improve the degree of conformation for an electrical component by embedding the electrical component using a flip-chip bonding method and can improve the yield by simplifying the production process.
Abstract:
A complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) includes a semiconductor substrate including a photodiode therein as a light sensing unit. A floating diffusion region of a first conductivity type is provided in the semiconductor substrate, and is configured to receive charges generated in the photodiode. A power supply voltage region of the first conductivity type is also provided in the semiconductor substrate. A reset transistor including a reset gate electrode on a surface of the substrate between the floating diffusion region and a power supply voltage region is configured to discharge charges stored in the floating diffusion region in response to a reset control signal. The reset transistor includes a channel region in the substrate extending between the floating diffusion region and the power supply voltage region such that the floating diffusion region and the power supply voltage regions define source/drain regions for the reset transistor. An impurity region is provided in a first portion of the channel region adjacent to the floating diffusion region. The impurity region has a doping such that the first portion of the channel region adjacent to the floating diffusion region has a different built-in potential than a second portion of the channel region adjacent to the power supply voltage region.
Abstract:
An image sensor may include a plurality of photodiodes for performing a photo-electric conversion and a plurality of microlenses. Each of the microlenses is formed over one of the photodiodes. The image sensor may further include a vertical light generating portion formed over the microlenses and configured to refract each of plurality of incident light rays such that the light rays are vertically incident on the microlenses.
Abstract:
Disclosed is a ball grid array substrate having a window formed on a core material instead of a thin core material, and wherein a semiconductor chip is mounted thereon, thereby reducing the thickness of a package, and a method of fabricating the same. The ball grid array substrate comprises a first external layer which includes first circuit patterns, wire bonding pad patterns, and a window corresponding in size to a first chip mounted therein and wherein the chip is wire-bonded to the wire bonding pad patterns. A second external layer includes second circuit patterns, a portion corresponding in position to the window of the first external layer, and solder ball pad patterns. Second chips mounted on the solder ball pad patterns. An insulating layer interposed between the first and second external layers. The window is formed though the insulating layer at a position corresponding to the window of the first external layer.
Abstract:
The memory device includes upper gate structures and lower gate structures formed on an active region of a substrate, and an insulation layer. Each of the upper gate structures may have a blocking layer pattern and a control gate electrode. Each of the lower gate structures may have a tunnel insulation layer pattern and a floating gate electrode. The floating gate electrode may include a lower portion that is narrower than an upper portion contacting with the upper gate structure. The insulation layer may cover gate structures formed of the lower and upper gate structures, and may include air gaps between adjacent gate structures.
Abstract:
In a memory device and a method of manufacturing the memory device, a pair of channel layers included in the memory device may be formed on a sidewall of the sacrificial single crystalline layer pattern located on a protrusion of a semiconductor substrate. Accordingly, an etch damage may be reduced at the channel layer. The sacrificial single crystalline layer pattern may be removed to generate a void between the pair of the channel layers. As a result, a generation of a coupling effect may be reduced between the channel layers.