公开(公告)号：USD492314S1

公开(公告)日：2004-06-29

申请号：US29192300

申请日：2003-10-21

申请人： Chih-Ming Huang ,  Chien-Ping Huang ,  Jui-Yu Chuang ,  Lien-Chi Chan ,  Cheng-Hsu Hsiao

设计人： Chih-Ming Huang ,  Chien-Ping Huang ,  Jui-Yu Chuang ,  Lien-Chi Chan ,  Cheng-Hsu Hsiao

公开(公告)号：US06444498B1

公开(公告)日：2002-09-03

申请号：US09990752

申请日：2001-11-15

申请人： Chien Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

发明人： Chien Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC分类号： H01L2144

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92147 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is attached to the chips, with an interface layer formed on a top surface of the heat spreader module plate. The chip carrier module plate, the chips and the heat spreader module plate are encapsulated. Adhesion force between the interface layer and the encapsulant is larger than that between the interface layer and the heat spreader module plate, and adhesion force between the interface layer and the heat spreader module plate is smaller than that between the heat spreader module plate and the encapsulant.

摘要翻译： 提供了一种制造具有散热器的半导体封装的方法，其中由多个阵列布置的芯片载体组成的芯片载体模块板在每个芯片载体上安装有至少一个芯片。 散热器模块板附接到芯片，其中界面层形成在散热器模块板的顶表面上。 芯片载体模块板，芯片和散热器模块板被封装。 界面层与密封剂之间的粘附力大于界面层与散热器模块板之间的粘合力，界面层与散热器模块板之间的粘合力小于散热器模块板与密封剂之间的粘附力 。

公开(公告)号：US20110287588A1

公开(公告)日：2011-11-24

申请号：US13195639

申请日：2011-08-01

申请人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Wen-Tsung Tseng ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/56

CPC分类号： H01L23/4334 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L25/03 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.

摘要翻译： 公开了一种散热半导体封装结构及其制造方法。 该方法包括：在至少半导体芯片和封装单元上布置并电连接到芯片载体; 在所述封装单元的顶表面上设置有经由所述平坦部分具有平坦部分和支撑部分的散热元件; 在由散热元件的平坦部分和支撑部分形成的接收空间中接收封装单元和半导体芯片; 以及在芯片载体密封剂上形成以封装封装单元，半导体芯片和散热元件。 散热元件消散封装单元产生的热量，提供EMI屏蔽，防止封装单元与密封剂之间的分层，降低热阻，防止开裂。

公开(公告)号：US20090261476A1

公开(公告)日：2009-10-22

申请号：US12148319

申请日：2008-04-18

申请人： Chien-Ping Huang ,  Chin-Huang Chang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao ,  Chun-Chi Ke

发明人： Chien-Ping Huang ,  Chin-Huang Chang ,  Chih-Ming Huang ,  Cheng-Hsu Hsiao ,  Chun-Chi Ke

IPC分类号： H01L23/482 ,  H01L21/60

CPC分类号： H01L24/19 ,  H01L21/6835 ,  H01L23/3114 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/24226 ,  H01L2224/82001 ,  H01L2225/1035 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311

摘要： A semiconductor device and a manufacturing method thereof are disclosed. The method includes the steps of providing a carrier board having conductive circuits disposed thereon and a plurality of chips with active surfaces having solder pads disposed thereon, wherein conductive bumps are disposed on the solder pads; mounting chips on the carrier board; filling the spacing between the chips with a dielectric layer and forming openings in the dielectric layer at periphery of each chip to expose the conductive circuits; forming a metal layer in the openings of the dielectric layer and at periphery of the active surface of the chips for electrically connecting the conductive bumps and the conductive circuits; and cutting along the dielectric layer between the chips and removing the carrier board to separate each chip and exposing the conductive circuits from the non-active surface.

摘要翻译： 公开了一种半导体器件及其制造方法。 该方法包括以下步骤：提供具有布置在其上的导电电路的载体板和具有设置在其上的焊料焊盘的有源表面的多个芯片，其中导电凸块设置在焊盘上; 将芯片安装在载板上; 用电介质层填充芯片之间的间隔，并在每个芯片周边的电介质层中形成开口以露出导电电路; 在所述电介质层的开口部和所述芯片的有源面的外围形成金属层，用于电连接所述导电凸块和所述导电电路; 并沿着芯片之间​​的电介质层切割并去除载体板以分离每个芯片并使导电电路与非活性表面相接触。

公开(公告)号：US07445957B2

公开(公告)日：2008-11-04

申请号：US11580560

申请日：2006-10-12

申请人： Chien-Ping Huang ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

发明人： Chien-Ping Huang ,  Cheng-Hsu Hsiao ,  Chih-Ming Huang

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

摘要： A wafer level semiconductor package with a build-up layer is provided, which includes a glass frame having a through hole for receiving a semiconductor chip therein, a low-modulus buffer material filled within the space formed between the semiconductor chip and the glass frame, a build-up layer formed on the glass frame and the semiconductor chip such that the build-up layer is electrically connected to the semiconductor chip, and a plurality of conductive elements mounted on the build-up layer so that the semiconductor chip is electrically connected to external devices. With the use of the glass frame and low-modulus buffer material, the wafer level semiconductor package thus-obtained is free from warpage, chip-crack, and delamination problems and the reliability thereof is enhanced. A method for fabricating the wafer level semiconductor package is also provided.

摘要翻译： 提供具有积层的晶片级半导体封装，其包括具有用于接收其中的半导体芯片的通孔的玻璃框架，填充在形成在半导体芯片和玻璃框架之间的空间内的低模量缓冲材料， 形成在所述玻璃框架和所述半导体芯片上的堆积层，使得所述积层层电连接到所述半导体芯片，以及安装在所述积层层上的多个导电元件，使得所述半导体芯片电连接 到外部设备。 通过使用玻璃框架和低模量缓冲材料，由此获得的晶片级半导体封装没有翘曲，芯片裂纹和分层问题，并且其可靠性得到提高。 还提供了一种用于制造晶片级半导体封装的方法。

公开(公告)号：US20080246142A1

公开(公告)日：2008-10-09

申请号：US12080798

申请日：2008-04-04

申请人： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

发明人： Jeng-Yuan Lai ,  Chien-Ping Huang ,  Chih-Ming Huang ,  Yu-Po Wang ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/367

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat dissipation unit and a semiconductor package having the same are disclosed. The semiconductor package includes a carrier; an electronic component mounted on and electrically connected to the carrier; a heat dissipation unit, which includes a flat section attached to the electronic component, extension sections connected to the flat section, and a heat dissipation section connected to the extension sections; and an encapsulant encapsulating the electronic component and the heat dissipation unit, wherein stress releasing sections are at least disposed at intersectional corners between the extension sections and the flat section so as to prevent projections from being formed by concentrated stresses in a punching process of the heat dissipation unit, thereby maintaining flatness of the flat section and further preventing circuits of the electronic component from being damaged due to a contact point produced between the electronic component and the flat section in a molding process.

摘要翻译： 公开了一种散热单元和具有该散热单元的半导体封装。 半导体封装包括载体; 电子部件，其安装在所述载体上并与其电连接; 散热单元，其包括附接到所述电子部件的平坦部分，连接到所述平坦部分的延伸部分和连接到所述延伸部分的散热部分; 以及封装电子部件和散热部的密封剂，其中应力释放部至少设置在延伸部和平坦部之间的交叉角处，以防止在热冲压加工中由于集中应力而形成突起 从而保持平坦部分的平坦度，并且进一步防止电子部件的电路在模制过程中由于在电子部件和平坦部分之间产生的接触点而损坏。

公开(公告)号：US20080213942A1

公开(公告)日：2008-09-04

申请号：US12074321

申请日：2008-03-03

申请人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Wen-Tsung Tseng ,  Cheng-Hsu Hsiao

发明人： Min-Shun Hung ,  Ho-Yi Tsai ,  Chien-Ping Huang ,  Wen-Tsung Tseng ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/12 ,  H05K7/00

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

摘要： This invention provides a method for fabricating a semiconductor device and a carrier applied therein. The method includes the steps of: disposing a chip-mounted substrate in an opening of a carrier; forming at least a storage aperture and at least an inspection aperture in the carrier; infusing an adhesive into the storage aperture to fill a gap between the substrate and carrier with the adhesive by capillarity; determining whether the inspection aperture is filled with the adhesive to ascertain whether the gap is completely filled with the adhesive; in response to a positive result, performing a molding process to form a molding compound for encapsulating the chip; and performing implantation of solder ball and a singulation process to form a semiconductor device with desirable dimensions. The inspection aperture is inspected with a naked eye to determine whether the gap is completely filled with the adhesive, thereby reducing inspection costs and increasing yields of products with no additional packaging costs.

摘要翻译： 本发明提供一种用于制造应用于其中的半导体器件和载体的方法。 该方法包括以下步骤：将芯片安装的基板设置在载体的开口中; 在所述载体中至少形成存储孔径和至少一个检查孔; 将粘合剂注入到存储孔中，以通过毛细管力用粘合剂填充基底和载体之间的间隙; 确定检查孔是否填充有粘合剂以确定间隙是否完全被粘合剂填充; 响应于积极的结果，进行成型处理以形成用于封装芯片的模塑料; 并且执行焊球的注入和单一化处理以形成具有所需尺寸的半导体器件。 检查孔径用肉眼检查以确定间隙是否完全充满粘合剂，从而降低检查成本并提高产品的产量，而不需要额外的包装成本。

公开(公告)号：US20080160678A1

公开(公告)日：2008-07-03

申请号：US11657834

申请日：2007-01-24

申请人： Yu-Po Wang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

发明人： Yu-Po Wang ,  Chien-Ping Huang ,  Cheng-Hsu Hsiao

IPC分类号： H01L21/60

CPC分类号： H01L23/49822 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package and a method for fabricating the same are proposed. A substrate having a first circuit layer, a second circuit layer, and a core layer formed between the first and second circuit layers is provided. At least one second opening is formed on the second circuit layer. At least one first opening is formed on the first circuit layer corresponding to the second opening. A plurality of finger holes corresponding to bond fingers on the first circuit layer are formed in the core layer. A through opening is formed in the core layer and communicates with the first and second openings. At least one chip is mounted on the first circuit layer and covers the first opening, with its active surface being exposed to the first opening. An encapsulant is formed to fill the first and second openings and the through opening and encapsulate the chip.

摘要翻译： 提出了一种半导体封装及其制造方法。 提供了具有形成在第一和第二电路层之间的第一电路层，第二电路层和芯层的衬底。 在第二电路层上形成至少一个第二开口。 在对应于第二开口的第一电路层上形成至少一个第一开口。 在芯层中形成与第一电路层上的接合指状对应的多个指孔。 在芯层中形成通孔，并与第一和第二开口连通。 至少一个芯片安装在第一电路层上并且覆盖第一开口，其有源表面暴露于第一开口。 形成密封剂以填充第一和第二开口和通孔并封装芯片。

公开(公告)号：US20080017977A1

公开(公告)日：2008-01-24

申请号：US11801625

申请日：2007-05-10

申请人： Wen-Tsung Tseng ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

发明人： Wen-Tsung Tseng ,  Chien-Ping Huang ,  Ho-Yi Tsai ,  Cheng-Hsu Hsiao

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A heat dissipating semiconductor package and a heat dissipating structure thereof are provided. The heat dissipating structure includes an outer surface, consecutive recessed step portions, and a pressure-releasing groove. The outer surface is exposed from an encapsulant made of a molding compound. The step portions are formed at an edge of the outer surface and have decreasing depths wherein the closer a step portion to a central position of the outer surface, the smaller the depth of this step portion is. The pressure-releasing groove is disposed next to and deeper than the innermost one of the step portions. A molding compound flows to the step portions and absorbs heat from an encapsulation mold quickly, such that a flowing speed of the molding compound is reduced. Pressure suffered by air remaining at the step portions is released through the pressure-releasing groove, thereby preventing flashes of the molding compound and resin bleeding.

摘要翻译： 提供散热半导体封装及其散热结构。 散热结构包括外表面，连续凹进的台阶部分和压力释放槽。 外表面从由模塑料制成的密封剂暴露。 台阶部分形成在外表面的边缘处并且具有减小的深度，其中台阶部分越接近外表面的中心位置，该阶梯部分的深度越小。 压力释放槽设置在步骤部分的最内侧之上并深度。 模塑料流到台阶部分并迅速从封装模具吸收热量，从而降低模塑料的流动速度。 通过压力释放槽释放在台阶部分残留的空气所产生的压力，从而防止模塑料的闪烁和树脂渗色。

公开(公告)号：USRE39957E1

公开(公告)日：2007-12-25

申请号：US10934632

申请日：2004-09-03

申请人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

发明人： Chien-Ping Huang ,  Tzong-Da Ho ,  Cheng-Hsu Hsiao

IPC分类号： H01C21/66 ,  H01C21/00 ,  H01L21/44 ,  H01L23/28 ,  H01L25/29 ,  H01L23/48 ,  H01L23/34 ,  H01L23/10

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92147 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0401

摘要： A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least one chip on each of the chip carriers. A heat spreader module plate is attached to the chips, with an interface layer formed on a top surface of the heat spreader module plate. The chip carrier module plate, the chips and the heat spreader module plate are encapsulated. Adhesion force between the interface layer and the encapsulant is larger than that between the interface layer and the heat spreader module plate, and adhesion force between the interface layer and the heat spreader module plate is smaller than that between the heat spreader module plate and the encapsulant.

摘要翻译： 提供了一种制造具有散热器的半导体封装的方法，其中由多个阵列布置的芯片载体组成的芯片载体模块板在每个芯片载体上安装有至少一个芯片。 散热器模块板附接到芯片，其中界面层形成在散热器模块板的顶表面上。 芯片载体模块板，芯片和散热器模块板被封装。 界面层与密封剂之间的粘附力大于界面层与散热器模块板之间的粘合力，界面层与散热器模块板之间的粘合力小于散热器模块板与密封剂之间的粘附力 。