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公开(公告)号：US20190144325A1
公开(公告)日：2019-05-16
申请号：US16097999
申请日：2017-05-04
Applicant: CORNING INCORPORATED
Inventor： Bradley Frederick Bowden , Xiaoju Guo , Thomas Hackert , Garrett Andrew Piech , Kristopher Allen Wieland
Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.
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公开(公告)号：US10252931B2
公开(公告)日：2019-04-09
申请号：US14993236
申请日：2016-01-12
Applicant: Corning Incorporated
Inventor： Moussa N'Gom , Garrett Andrew Piech , James Joseph Watkins , Kristopher Allen Wieland , Chad Michael Wilcox
IPC: B32B3/10 , C03B33/02 , B23K26/38 , B23K26/402 , B23K26/0622 , B23K26/359 , B23K26/53 , B23K103/00
Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.
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公开(公告)号：US10144093B2
公开(公告)日：2018-12-04
申请号：US15251453
申请日：2016-08-30
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
IPC: B23K26/384 , B23K26/402 , C03B33/09 , B23K26/04 , C03B33/02 , C03C15/00 , B32B17/06 , C03C17/00 , B23K26/00 , B23K26/06 , B23K26/38 , B23K26/0622 , C09K13/00
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
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64.发明申请公开(公告)号：US20180342451A1
公开(公告)日：2018-11-29
申请号：US15978430
申请日：2018-05-14
Applicant: CORNING INCORPORATED
Inventor： Rachel Eileen Dahlberg , Tian Huang , Yuhui Jin , Garrett Andrew Piech , Daniel Ohen Ricketts
IPC: H01L23/498 , C03C23/00 , C03C15/00 , H01L23/15 , H01L21/48
Abstract: Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.
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65.发明申请公开(公告)号：US20180249579A1
公开(公告)日：2018-08-30
申请号：US15754144
申请日：2016-08-19
Applicant: Corning Incorporated
Inventor： Sean Matthew Garner , Samuel Odei Owusu , Garrett Andrew Piech , Scott Christopher Pollard
CPC classification number: H05K3/0029 , C03B33/0222 , C03C15/00 , C03C17/002 , C03C17/008 , C03C23/0025 , C03C23/007 , C03C2217/445 , C03C2217/70 , H01L21/4807 , H01L23/15 , H05K1/024 , H05K1/028 , H05K1/0306 , H05K1/036 , H05K1/115 , H05K3/002 , H05K3/107 , H05K3/388 , H05K3/4038 , H05K3/4629 , H05K2201/0195 , H05K2201/09509 , H05K2203/0143 , H05K2203/0743 , H05K2203/075 , H05K2203/0776 , H05K2203/0789 , H05K2203/107 , H05K2203/1194 , H05K2203/1545 , Y02P40/57
Abstract: Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.
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Patent Agency Ranking
公开(公告)号：US09850160B2
公开(公告)日：2017-12-26
申请号：US14529520
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
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公开(公告)号：US20170266757A1
公开(公告)日：2017-09-21
申请号：US15617622
申请日：2017-06-08
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: B23K26/00 , B23K26/382 , C03B33/02 , B23K26/0622
Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.
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公开(公告)号：US09758876B2
公开(公告)日：2017-09-12
申请号：US14092536
申请日：2013-11-27
Applicant: Corning Incorporated
Inventor： Aric Bruce Shorey , Garrett Andrew Piech , Xinghua Li , John Christopher Thomas , John Tyler Keech , Jeffrey John Domey , Paul John Shustack
IPC: H01L21/302 , H01L21/461 , B23P15/00 , C03C25/00 , C23F1/00 , B44C1/22 , C03C15/00 , C23F4/04 , C03B33/10 , H05K3/00 , C03B33/02 , B23K26/18 , B23K26/0622 , B23K26/386 , B23K26/40 , B23K26/382 , B23K103/00
CPC classification number: C23F4/04 , B23K26/0622 , B23K26/18 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/102 , H05K3/0026 , Y10T428/24322
Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
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公开(公告)号：US20160368809A1
公开(公告)日：2016-12-22
申请号：US15251605
申请日：2016-08-30
Applicant: Corning Incorporated
Inventor： Thomas Hackert , Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/082 , B23K26/0608 , B23K26/0622 , B23K26/359 , B23K26/382 , B23K26/389 , B23K26/53 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03B33/04 , C03B33/091 , Y02P40/57 , Y10T428/15 , Y10T428/24273
Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.
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公开(公告)号：US20150232369A1
公开(公告)日：2015-08-20
申请号：US14529520
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B33/02
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
Abstract translation: 本发明涉及用于切割和分离透明材料薄基板的激光切割技术，例如切割主要用于制造薄膜晶体管（TFT）器件的显示玻璃组合物。 所描述的激光工艺可以用于例如以> 1m / sec的速度进行直线切割，以切割尖锐的半径外角（<1mm），并且产生包括形成内部孔和狭槽的任意弯曲形状。 激光加工碱土硼硅铝酸盐玻璃复合工件的方法包括将脉冲激光束聚焦到焦线中。 焦线被引导到玻璃复合工件中，在材料内产生诱导吸收。 工件和激光束相对于彼此平移以沿着轮廓形成多条缺陷线，其中相邻的缺陷线具有0.1-20微米的间隔。
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